1. The effect of reducing temperature on the stress of PCB boards

　　Since temperature is the main source of stress on the board, reducing the temperature of the reflow furnace or slowing down the heating and cooling rate of the board in the reflow furnace can greatly reduce the occurrence of bending and warping of the board. However, there may be other side effects, such as solder short circuits.

　　2. Using high Tg boards

　　Tg is the glass transition temperature, which is the temperature at which a material transitions from a glass state to a rubber state. The lower the Tg value of a material, the faster its board begins to soften after entering the reflow furnace, and the longer it takes to become a soft rubber state, the more severe the deformation of the board. Using a higher Tg board can increase its ability to withstand stress and deformation, but the cost of the material is relatively high.

　　3. Increase the thickness of the circuit board

　　Many electronic products, in order to achieve the goal of being lighter and thinner, have left boards with thicknesses of 1.0mm, 0.8mm, and even 0.6mm. This thickness is difficult to maintain when the boards are reflowed in the soldering furnace. It is recommended that if there is no requirement for lightness, boards can use a thickness of 1.6mm, which can greatly reduce the risk of bending and deformation.