2025-06-05
973
With the rapid advancement of electronic communication technology, the demand for high frequency circuit boards in communication equipment has significantly increased to support high-speed and high-frequency signal transmission.
The high frequency boards utilize dielectric materials that exhibit exceptional electrical properties and outstanding chemical stability.
Key Performance Characteristics
• Precision impedance control (Zo) – Ensures signal integrity and minimal reflection.
• Superior thermal stability (Tg) – Maintains performance under high-temperature conditions.
• Low signal transmission loss – Enhances signal fidelity over long distances.
• Minimal signal delay and distortion – Supports high-speed data transmission with accuracy.
• Low dielectric constant (Dk) and dissipation factor (Df) – Reduces signal attenuation and energy loss.
Application Area
Aerospace,Wireless antennas,Base station receiving antennas,Power amplifiers,Radar systems,Navigation systems,Other advanced communication equipment.
As the cornerstone of modern electronic communication infrastructure, high frequency Boards are inherently aligned with the evolution of high-speed signal transmission and high frequency system integration. These boards will continue to serve as indispensable enablers for next-generation electronic systems across diverse high-tech domains.
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