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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
In the process of circuit board manufacturing, what is the copper sinking process of pcb in circuit board factory? And the major circuit board manufacturers are a kind of production process? That's the whole process of sinking copper? Let's take a closer look. In the production process of the circuit board factory, the copper is called plating through the hole, that is, chemical plating copper. In the PCB production process of Shenzhen Circuit Board Factory copper deposition this process requires a chemical reaction, usually abbreviated as PTH, is a self-catalytic REDOX reaction. Generally, double panels or multi-layer boards are sunk after drilling. The role of copper sinking is mainly to connect the circuit, in the non-conductive hole wall substrate, the use of chemical method - chemical copper, because there are electroplated copper behind, copper sinking is to make a base for the copper plating behind, our Shenzhen circuit board factory in the production of PCB process are ve
1. The first step is alkaline oil removal: Alkaline oil removal refers to the removal of oil, finger marks, oxides and dust in the hole; The negative charge of the pore wall is changed into positive charge, which is convenient for the adsorption of colloidal palladium in the later process. Under normal circumstances, oil removal cleaning should be carried out in accordance with the rules of the circuit board factory (Shenzhen circuit board factory is also like this), and the copper backlight test is used for detection. 2. Micro-etching: Micro-corrosion refers to remove the oxide of the plate surface, rough the plate surface, to ensure that the subsequent copper deposition layer and the substrate bottom copper combination; The new copper surface has strong flexibility and can adsorb colloidal palladium very well. 3. Prepreg: The prepreg is mainly to protect the palladium tank from pollution, because the front tank will pollute the palladium tank, and the service life of the pal
The staff of the enterprise often turn a blind eye to many problems, or think that it is harmless, or think that it cannot be changed. There are also many managers who tend to turn a blind eye to intuitive information and focus only on numbers. As a result, it may slip through the cracks, ignore some key clues, and fail to truly understand the true state of the enterprise. As a customer, you should go to the supplier's site to understand its cost composition, production efficiency, quality control. As a supplier, we should go to the customer's site to understand its production process in order to better serve customers. As a peer, if you have the opportunity to visit other circuit board factories, it is also a very good opportunity to learn, compare and reference. Enterprise operation is a big system, all links are closely related and affect each other. For production-oriented enterprises, through any details of the scene, you can know the micro. Any big problem can be found at the
1, PCB wire welding This method does not require any connectors, as long as the external connection point on the PCB printed board is welded directly with the components or other components outside the board. For example, the speaker in the radio, the battery box, etc. Circuit board interconnection welding should pay attention to: (1) The welding pad of the welding wire should be as far as possible on the edge of the PCB printed board, and arranged according to a unified size to facilitate welding and maintenance. (2) In order to improve the mechanical strength of the wire connection and avoid pulling the solder pad or printed wire off due to the pull of the wire, drill holes near the solder joints on the PCB printed board, let the wire pass through the hole from the welded surface of the printed board, and then insert the solder pad hole from the component surface for welding. (3) Arrange or bundle the wire neatly, and fix it with the board through the wire card or other fast
1. Check and remove the debris adhering to the semi-cured sheet; 2. Check the inner plate: and ensure that there is no debris adhering to it; Our operators do a good job in the laminate positioning template (also known as the press template positioning pin) tooling, templates, and buffer paper before the plate. Whether it is a senior circuit board manufacturer or our operator, according to the performance of the semi-cured sheet used, the relevant temperature setting size provisions: Tg<135t, the maximum temperature setting range is 160-185t; Tg>160t, the maximum temperature setting range is 170-205t. The next step is the pressure of lamination: it squeezes the air between the plates and speeds up the flow of resin to fill the space between the shapes. - Generally, the setting of pressure is divided into four stages: ① Pre-pressure section: drive volatiles and residual gases, so that the layer is closely combined. Precompression is the key of lamination. ② Medium pressure se
1, plate: multi-layer board are using Shengyi /KB A-grade copper-clad plate /PP, Sun/Guangxin ink. As a recognized leading enterprise in the copper clad plate industry, Shengyi board products are used in a large number of cutting-edge PCB factories around the world, and multi-layer board guarantees the excellent performance of PCB finished products from the source. 2, hole copper :PCB production has always strictly followed the IPC secondary standard, the thinnest hole copper of the finished product is greater than 20um, beyond the IPC -- level standard! Due to good plating uniformity and strong deep plating ability,PCB dares to ensure smooth and uniform copper plating of the hole and hole wall, and there is no serious uneven copper plating similar to "10 um somewhere, 30 um somewhere" If the user finds the thinnest copper of the finished hole is less than 20um,PCB promises a full refund; 3, line width and line distance: according to the control of 20% of the soil shipment, but t
1, PCB board width ≤260mm(SIEMENS line) or ≤300mm(FUJI line); If automatic dispensing is required, PCB board width × length ≤125 mm×180 mm. 2, PCB board appearance as close as possible to the conventional graphics, it is recommended to use 2*5, 3*3 board, can be assembled according to the thickness of the board; 3. The outer frame of the PCB assembly should adopt a closed-loop design to ensure that the assembly is fixed on the fixture without deformation. 4. The center distance between the small plates is controlled between 75 mm and 145 mm. 5. There can be no large components next to the connection point between the panel shape and the PCB internal small board, small board and small board, and the edge of the components and board should have a space greater than 0.5mm. 6, four positioning holes are opened at the four corners of the outer frame of the plate, plus the Mark point, the aperture is 4mm(±0.01mm); The strength of the hole should be moderate to ensure that it will no
1. Substrate processing problems, for some thinner pcb substrates, due to poor rigidity of the substrate, it is not appropriate to use the brush machine to brush the board, and attention should be paid to control the solid production and processing, so as not to cause the poor bonding force between the substrate copper foil and chemical copper caused by the board bubbling. 2. The surface of the plate in the machining (drilling, laminating, milling, etc.) process caused by oil, or other liquids contaminated with dust pollution surface, will cause the surface foaming phenomenon. 3. The copper brush plate is bad, the grinding plate pressure is too large before copper sinking, resulting in hole deformation, so that the hole foaming phenomenon will be caused in the process of copper plating and tin-spraying welding. 4. Washing problem, due to copper plating to go through a large number of chemical solution treatment, all kinds of acid and alkali inorganic, organic and other drug solv
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