+86 755 2794 4155 
sales@knownpcb.com
| Item | Standard Capability | Limited Capability | Remark | ||
|---|---|---|---|---|---|
| SMT process | PCB | Min Size | L≥30mm,W≥30mm | L<30mm,W<30mm | BOT、TOP sides components、Fiducial Mark should be≥3mm from the board edge. |
| Max Size | L≤650mm,W≤400mm | L:800-650mm,W:400-450mm | |||
| Component thickness(T) | 0.5mm≤T≤3mm | T＜0.5mm T＞3mm | |||
| Component size | Min Package | 0201 (0.6mm*0.3mm) | 01005 (0.3mm*0.2mm) | ||
| QFP、QFN、SOP、SOJ | Min Pin distance | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
| CSP、BGA | Min Pitch distance | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
| Item | Standard Capability | Limited Capability | Remark | ||
|---|---|---|---|---|---|
DIP Process (Wave soldering) | PCB size | Min Size | L≥30mm,W≥30mm | L＜30mm | |
| Max Size | L≤650mm,W≤400mm | L:800-650mm,W:400-450mm | |||
| Thinnest size | 0.4mm | T＜0.4mm | |||
| Thickest size | 5mm | T>5mm | |||
| Item | Standard Capability | Limited Capability | Remark | ||
|---|---|---|---|---|---|
Conformal Coating Process | Technological parameter | Temperature range | -30°C≤T≤120°C | -50°C≤T≤150°C | |
| Coating thickness | 20um≤T≤35um | 35um≤T≤60um | |||
Leading technology
1.Max.layers:38L, the min.track w/d is 3mil/3mil, the plating hole aspect ratio is 13:1, and the drill hole is 0.10mm(laser hole is 0.075mm).
2.High precision lamination positioning and hot melt and shooting technology, to ensure the quality of multilayers PCB processing.
3.Various types of rigid flexible lamination design, to meet different industrial products
4.High precision back drilling and depth control technology,to meet the integrity design of product signal transmission
Advanced research and development strength
1.More than 10 professional and technical teams with more than 20 years of PCB experience, provide clients products and services of high stability.
Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
Leading technology
1.The copper thickness can be more than 12OZ,to meet the requirements of high current design.
2.Strictly implement quality PDCA process and continuously improve product performance
3.Meet the requirements of multiple blind hole design of power supply products, the matching design of pressure expansion and shrinkage, vacuum resin plugging technology, etc.
4.Local embedded copper block technology to meet the design requirements of high heat dissipation.
Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
Leading technology
1.Minimum line w/s 3mil/3mil, minimum aperture 0.075mm.
2.FR4+ high frequency mixed pressure, high frequency multistage step plate, metal base, etc
3.Mechanical blind burring, HDI, rigid torsion combination and other processing technology.
Advanced research and development strength
1.10 years' experience in R&D and manufacturing of medical printed circuit boards, including medical diagnosis, patient intelligent drug injection, patient intelligent monitoring system, X-ray machine, B-ultrasound machine, blood glucose meter, etc.
2.Assist customers to develop new products such as endoscope, scalpel and lifting beds.
3.Production of multiple high level HDI and rigid flexible joint and other processing technologies.
Advanced production equipment&Complete quality control system
1.100% of products have been tested by imported AOI to reduce electrical leakage and ensure that the inductance of power products meets customer design requirements.
2.More than 20 kinds of reliability testing equipment, such as reflow welding, thermal shock, pore copper tester, impedance tester, gold-nickel thickness tester, etc.
3.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
4.Strictly implement quality PDCA process and continuously improve product performance.
5.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
Leading technology
1.Minimum line w/s 3mil/3mil, minimum aperture 0.075mm.
2.Mature hybrid laminating technology meets the pressing requirements of FR4+rogers3 series, 4 series, 5 series /Arlon/ PTFE and other materials to ensure the leading characteristics of products.
3.Years of experience in wireless communication, network communication and other products processing, to meet the requirements of different product types of customers.
Advanced research and development strength
1.More than 15 years of experience in the development and manufacturing of communication equipment circuit boards.
2.Assist customers to develop radio frequency transmission and receivers, mobile base stations, etc.
3.Production of multi-high level HDI and rigid flexible combination and other processing technology, used in communication equipment, mobile phones, Bluetooth modules, etc.
Top raw material suppliers
1.Long-term strategic cooperation with top material suppliers Rogers, Taconic, Arlon, Kingboard, Biggs, Sunyi, Taiyao, Panasonic and DuPont.
2.Electroplating special use Rohm and Haas electroplating potion, Fuji film, Hitachi dry film, sun ink.
Leading technology
1.The top number is 38 layers, the minimum line width and line distance is 3mil/3mil, the plating hole aspect ratio is 13:1, and the drill hole is 0.1mm(laser hole is 0.075mm).
2.High precision pressing positioning and hot melt and shooting technology, to ensure the processing quality of high multilayer PCB.
3.Various types of rigid flexible binding plate process structure, to meet the needs of different vehicle type products.
4.Metal base, aluminum base plate, thick copper processing technology, to ensure high heat dissipation requirements of products.
Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
4.Ensure that the hole copper and surface copper meet customer requirements, electroplating special use Rohm and Haas electroplating potions, Fuji film, Hitachi dry film, sun ink, etc.
| Item | Project name | Process capability |
|---|---|---|
| Capability | Layers | 1-36L |
| Board thickness | 0.1-8.0mm | |
| High Frequency | PTFE，Ceramic、Rogers | |
| HDI | HDI | |
| HDI Stage | 1-5 Stage（≥6 Stage need to appraisal） | |
| Min PCS size | pcs size 5*5mm（less than 3mm need to appraisal） | |
| Max Panel size | 21*33inch | |
| Max Finish copper thickness | 12OZ | |
| Min Finish copper thickness | 1/2oz | |
| Layer to layer accuracy | ≤3mil | |
| Board thickness of Resin | 0.2-6.0mm | |
| Board thickness tolerance | Thickness≤1.0mm；±0.1mm Thickness＞1.0mm；±10% | |
| Impedance tolerance | ±5Ω（＜50Ω），±10%（≥50Ω）；Min±8%（≥50Ω） | |
| Bow and twist | Normal:0.75%，Min:0.5% Max:2.0% | |
| Lamination times | one core ≤5 times |
| Item | Project name | Process capability |
|---|---|---|
| Material Type | Normal TG FR4 | SY S1141、KB 6160A |
| Middle TG FR4 | SY S1150G、KB6165 F、KB6165G(HF) | |
| High TG FR4 | SY S1000-2、SY S1165(HF)、KB 6167G(HF)、KB 6167F、TU-768、TU-872、VT-47； | |
| Aluminum | GL12、SPS-AL-01、CH-AL-LM3 | |
| CTI 600 | SY S1600 | |
| High Frequency | Rogers4350、Rogers4003;Arlon 25FR、25N; | |
| PTFE | Rogers series、Taconic series、Arlon series、F4Bseries 、TP series | |
| Minture+FR4 | Rogers、Taconic、Arlon、Nelco、F4B+FR-4 |
| Item | Project name | Process capability |
|---|---|---|
| Metal material | Layers | Alumi、Metal:1-8L；Ceramic board:1-2L； |
| PCS Size | MAX:610*610mm、MIN:5*5mm | |
| Max Panel size(Ceramic board) | 100*100mm | |
| Finish board thickness | 0.5-5.0mm | |
| Copper thickness | 0.5-12 OZ | |
| Matel thickness | 0.5-4.5mm | |
| Matel material type | AL:1100/1060/2124/3003/5052/6061;Copper:Purple copper | |
| Min finish holes and tolerance | NPTH:0.5±0.05mm；PTH(Aluminum;Metal)：0.3±0.1mm； | |
| CNC tolerance | ±0.2mm | |
| PCB Surface Treatment | HASL/HASL L/F;OSP；ENEPIG；Hard gold;Heavy gold | |
| Metal PCB Surface Treatment | ENEPIG | |
| Matel material | Bergquist（MP06503、HT04503）；TACONIC（TLY-5、TLY-5F）； | |
| Dielectric thickness | 75-200um | |
| Thermal conductivity | 0.3-3W/m.k（Aluminum,Metal）；24-180W/m.k（Ceramic） |
| Item | Project name | Process capability |
|---|---|---|
| Product Type | Rigid boarad | Back board、HDI、Multilayer burried board、Heavy copper、Power heavy copper、IC Substrate |
| Item | Project name | Process capability |
|---|---|---|
| Stack up | HDI board | 1+N+1、1+1+N+1+1、2+N+2、3+N+3(Burried hole size 0.3mm) Filled vias with copper capped |
| Item | Project name | Process capability |
|---|---|---|
| Surface Treatment | PB Free | Gold Plating 、ENIG、Gold finger、HASL L/F、OSP、ENEPIG、immersion silver、immersion Tin、ENIG+OSP、ENIG+G/F、Gold Plating +G/F、immersion silver+G/F、immersion Tin+G/F |
| PB | HASL | |
| A/R Ratio | 10：1（HASL、HASL L/F、ENEPIG、immersion silver、immersion Tin）；8：1（OSP） | |
| Board thickness | ENIG：0.2-7.0mm，immersion Tin：0.3-7.0mm（Vertical）、0.3-3.0mm（Level）；immersion silver：0.3-3.0mm；HASL、HASL L/F：0.6-3.5mm、OSP：0.3-3.0mm；Gold plating：0.3-5.0mm（A/R:10:1） | |
| IC SPACE | 3mil |
| Item | Project name | Process capability |
|---|---|---|
| Surface Treatment Thickness | HASL、HASL L/F | 2-40um（HASL MAX:0.4um、HASL L/F MAX:1.5um） |
| OSP | 0.2-0.4um | |
| ENIG | Ni：3-5um；Au：1-5uinch，≥3uinch(Need to appraisal) | |
| Immersion silver | 6-12uinch | |
| Immersion Tin | ≥1um | |
| Gold Hard Plating | 2-50uinch | |
| ENEPIG | Ni:3-5um，Pd：1-6uinch，Au：1-5uinch | |
| Gold Plating | Au:0.025-0.10um，Ni≥3um， | |
| Gold Plating +G/F | Au:1-50uinch、Ni≥3um | |
| Carbon ink | 10-50μm | |
| Liquid | copper(10-18um)、via hole（5-8um）、line corner≥5u | |
| Peelable | 0.20-0.80mm |
Leading technology
1.Multi-layer thick copper plate UL certification, minimum line width and line distance of 3mil/3mil, maximum hole drilling 0.1mm(laser hole 0.075mm)
2.BGA adopts three-machine plug hole and aluminum sheet plug hole to ensure that there is no copper short circuit problem.
3.Strictly implement quality PDCA process and continuously improve product performance
Advanced research and development strength
1.Super multi-layer processing technology, can achieve 2-38 layers of plate production, meet the requirements of product design.
2.Years of experience in wireless communication, network communication, electronic monitoring and other products processing, to meet the requirements of different product types of customers.
Advanced production equipment&Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
Leading technology
1.Long-term strategic cooperation with industry top material suppliers Kingboard, Shengyi, Taiyao, Panasonic and DuPont.
2.FR1,22F, CIM-1, CIM-3,FR4,FR4 TG150,FR4 TG170,FR4 TG180 and other materials.
3.Use the Low DK,Low DF, high CTI, and CAF materials.
Complete quality control system
1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc
2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements
3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.
Leading technology
Minimum line w/s 3mil/3mil, minimum aperture 0.075mm.
Mature hybrid laminating technology meets the pressing requirements of FR4+rogers3 series, 4 series, 5 series /Arlon/ PTFE and other materials to ensure the leading characteristics of products.
Years of experience in GPS, infrared sensor and other products processing, to meet the requirements of different product types of customers.
Advanced research and development strength
More than 15 years of experience in the development and manufacturing of GPS communication equipment circuit boards.
Assist customers to develop radio frequency transmission and receivers, mobile base stations,GPS positioning and satellite positioning devices, etc.
Production of multi-high level HDI and rigid flexible combination and other processing technology, used in communication equipment, mobile phones, Bluetooth modules, etc.
Top raw material suppliers
Long-term strategic cooperation with top material suppliers Rogers, Taconic, Arlon, Kingboard, Biggs, Sunyi, Taiyao, Panasonic and DuPont.
Electroplating special use Rohm and Haas electroplating potion, Fuji film, Hitachi dry film, sun ink.
| Item | Project name | Process capability |
|---|---|---|
| Drilling | 0.15/0.2mm Mechanical drilling board thickness(Max) | 1.5mm/2.5mm |
| Laser drilling size(Min) | 0.1mm | |
| Laser drilling size(Max) | 0.15mm | |
| Drilling size | 0.15-6.2mm PTFE series :0.25mm(drill bit:0.35mm） Mechanical Blind and Burried holes size≤0.3mm Close hole size:0.35mm(Min)（drill bit:0.45mm） PTH Half hole size:0.40mm（drill bit:0.5mm） | |
| A/R Ratio | 20:1(≤0.2mm) | |
| Back drill depth | 0.2mm | |
| Drilling to conductor space | 5.5mil(≤8L)；6.5mil（10-14L）；7mil(＞14L) | |
| Mechanical drilling to conductor space(2stage HDI) | 7mil（one time）；8mil(two time)；9mil(three time) | |
| Laser drilling to conductor space | 7mil（1+N+1）；8mil（1+1+N+1+1 or 2+N+2） | |
| PTH edge to PTH edge space(diff net) | 10mil | |
| PTH edge to PTH edge space(same net) | 6mil(drilling;laser drilling)；10mil（Mechanical HDI） | |
| NPTH edge to NPTH edge space | 8mil | |
| Drilling accuracy | ±2mil | |
| NPTH tolerance | ±2mil | |
| PTH tolerance | ±2mil | |
| countersunk | ±0.15mm |
| Item | Project name | Process capability |
|---|---|---|
| Outer layer PAD | Inner Layer and outer Layer PAD size(Laser drilling) | 10mil（4mil Laser drilling size），11mil（5mil Laser drilling size） |
| Inner Layer and outer Layer PAD size(Mechanical drilling) | 16mil（8mil drilling size） | |
| BGA PAD Size(min) | HASL:10mil，Other:7mil | |
| BGA tolerance | +/-1.2mil（PAD＜12mil）；+/-10%（PAD≥12mil） |
| Item | Project name | Process capability |
|---|---|---|
| Line width/space | width/space | 1/2OZ：3/3mil 1OZ: 3/3.5mil 2OZ: 5/5mil 3OZ: 7/7mil 4OZ: 10/10mil 5OZ: 15/15mil 6OZ: 18/18mil 7OZ: 20/20mil 8OZ: 24/24mil 9OZ: 26/26mil 10OZ: 28/28mil 12OZ: 32/32mil |
| Line tolerance | ≤10mil：+/-1.0mil ＞10mil：+/-1.5mil |
| Item | Project name | Process capability |
|---|---|---|
Solder mask and Silk screen | Solder mask plugged hole size(Min) | 0.5mm |
| Solder mask color | Green、Yellow、Black、Blue、Red、White、Purple、Pink、Matt Green、Matte Black、cold white. | |
| Silk screen color | White、Yellow、Black | |
| Peelable hole size(Max) | 10.0mm | |
| Resin hole size | 0.1-1.0mm | |
| Solder mask dam | Green:3.5mil、Other:6mil | |
| Silk screen line width(Min) | Width:3mil,High:24mil(White)； Width:5mil,High:32mil(Black)； | |
| Hollow out on silk screen space(Min) | Width:8mil,High:40mil | |
| Hollow out on solder mask space(Min) | Width:8mil,High:40mil |
| Item | Project name | Process capability |
|---|---|---|
| Router | V-CUT to conductor space | H≤1.0mm:0.3mm(20°)、0.33mm(30°)、0.37mm(45°); 1.0＜H≤1.6mm:0.36mm(20°)、0.4mm(30°)、0.5mm(45°); 1.6＜H≤2.4mm:0.42mm(20°)、0.51mm(30°)、0.64mm(45°); 2.4＜H≤3.2mm:0.47mm(20°)、0.59mm(30°)、0.77mm(45°); |
| V-CUT symmetrical tolerance | ±4mil | |
| V-CUT Angle tolerance | ±5° | |
| V-CUT Spec | 20°、30°、45° | |
| G/F bevel | 20°、30°、45° | |
| G/F bevel angle tolerance | ±5° | |
| Controlled milling/drill tolerance(NPTH) | ±0.10mm | |
| Outline tolerance | ±4mil | |
| Router slot hole tolerance（PTH） | Slot hole width and length ±0.15mm | |
| Router slot hole tolerance（NPTH） | Slot hole width and length ±0.10mm | |
| Drilling slot hole tolerance（PTH） | ±4mil | |
| Drilling slot hole tolerance（NPTH） | ±2mil |
Operation Center: Room 306-309,Bldg D,Liantangkeng Industrial Area,Qianjin Road,Xixiang Street,Bao'an Dist.,Shenzhen City,Guangdong Province,518102,China.
Tel: +86 755 2794 4155
Fax: +86 755 2794 4159
E-mail: sales@knownpcb.com
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