1. Splicing method:

　　Applicable: The line is not too dense, the film deformation of each layer is inconsistent; It is especially suitable for the deformation of solder resistance plate and multilayer plate power formation plate.

　　Not applicable: film with high wire density, line width and spacing less than 0.2mm;

　　Note: When splicing, the wire should be damaged as little as possible, and the welding pad should not be damaged. When splicing copy after revision, attention should be paid to the correctness of the connection relationship.

　　2, change the hole position method:

　　Application: All layers of film deformation is consistent. This method also applies to film with dense lines;

　　Not applicable: film deformation is not uniform, local deformation is particularly serious.

　　Note: After using the programmer to lengthen or shorten the hole position, the out-of-tolerance hole position should be reset.

　　3, hanging method:

　　Applicable; Film that has not been deformed and is protected from deformation after copying;

　　Not applicable: Deformed negatives.

　　Note: Hang the negatives in a ventilated and dark (safe or not) environment to avoid contamination. Ensure that the temperature and humidity of the hanging place are consistent with that of the working place.

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