+86 755 2794 4155 
sales@knownpcb.com
Ro4350B material, cavity opening at L1-L2&L6-L5, 4mil bonding pad. |
Details: |
Cavity from Top Layer to L2. L2 has exposed pads with ENEPlG Plating for Wire Bonding. |
Cavity from Bottom Layer to L5. L5 has exposed pads with ENEPIG Plating for Wire Bonding. |
The 2 cavities are symmetric with each other. |
Read recommendations:
FR4 Printed Circuit Board Factory
Operation Center: Room 306-309,Bldg D,Liantangkeng Industrial Area,Qianjin Road,Xixiang Street,Bao'an Dist.,Shenzhen City,Guangdong Province,518102,China.
Tel: +86 755 2794 4155
Fax: +86 755 2794 4159
E-mail: sales@knownpcb.com
Appointment Experience
EN
CN
Home > 
