Step 1 Drill holes

　　The design of the through hole aperture below 8mil, the hole spacing is close, plus each board about 500,000 to 1.2 million blind holes, the hole deviation and plugging of the through hole, and the perforation of the perforation will affect the PCB yield. Drilling machine needs to be maintained according to the regulations, the use of appropriate aluminum sheet and drill nozzle, in the production of new materials engineers to confirm the rationality of the operation parameters: number of sheets, tool parameters, etc. The amount of dust suction of the drilling machine needs to meet the standard, and the drilling needle has space for debris removal is also crucial. The pass shape and aperture, dielectric thickness, material and laser energy of the laser are very important, and it is necessary to set the best operating conditions.

　　Step 2: Electroplating

　　Electroplated copper carries the functions of current conduction and signal transmission, and the electroplating process must ensure the reliability of copper, the plating ability of the surface copper and the exquisite appearance. 2mil/2mil lines, through hole aperture is generally 6-8mil, blind hole aperture 4mil, which requires hole copper thickness to meet specifications and thin surface copper, horizontal copper with VCP wire plating (or choose pulse plating) is a good choice for guests.

　　The use of horizontal copper sinking process, intelligent manufacturing and closed automatic management, production cycle and quality can be adequately guaranteed. The VCP line can achieve the copper range R of the electroplating table at 5um, the etching process does not worry about the uneven plating, the thickness ratio of 12:1, the TP value of more than 85%, so that the loss of the copper ball is the best. For different product needs, can set through the blind hole and plating, reduce production costs. In electroplating production, the appearance requirement of no particles also has a great impact on the 2mil/2mil line yield.

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