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    Multilayers rigid-flex with filling resin, impedance design

    Multilayers rigid-flex with filling resin, impedance design
    Multilayers rigid-flex with filling resin, impedance design
    Multilayers rigid-flex with filling resin, impedance design
    Multilayers rigid-flex with filling resin, impedance design
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    Multilayers rigid-flex with filling resin, impedance design

    Multilayers rigid-flex with filling resin, impedance design

    8layer rigid and 2 layers flex with via-in-pad and impedance design

    Product Description

    Layer count: 10 layers

    Model: M-29168

    Material:  IT180 +R-F777(Panasonnic) PI+FR0110 (DUPont coverlay)

    Surface Treatement: ENIG2U"

    Special Technics: 1. 8layers rigid+2layers flex board (4R+2F+4R)

                                2. Via-in-pad need filling resin

                                3. Impedance on flex layers 

                                4. Asymmetry copper in inner layer.

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