1) The diameter of the test pad specially used for detection should not be less than 0.9mm.

　　2) The space around the test pad should be greater than 0.6mm and less than 5mm. If the height of the component is greater than 6.7mm, the test pad shall be placed 5mm away from the component.

　　3) Do not place any components or test pads within 3mm of the edge of the printed circuit board.

　　4) The test pad should be placed in the center of a 2.5mm hole in a grid. If possible, allow the use of a standard probe and a more reliable fixture.

　　5) Do not rely on the edge of the connector pointer for pad testing. The gold-plated pointer is easily damaged by the test probe.

　　6) Avoid plating through holes - probes on both sides of the printed circuit board. Place the test tip through the hole on the non-component/weld side of the printed circuit board.

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