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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
With the development of electronic products towards high density and precision, the same requirements have been put forward for circuit boards. The most effective way to increase PCB density is to reduce the number of through holes and precisely set blind holes and buried holes to achieve this. 1. Definition of blind holes a: Compared to through holes, through holes refer to holes that are drilled through each layer, while blind holes are non drilled through holes. (Illustrated, eight layer board examples: through hole, blind hole, buried hole) b: blind hole subdivision: BLIND HOLE, buried hole Buried HOLE (outer layer not visible); c: Distinguish from the production process: blind holes are drilled before pressing, while through holes are drilled after pressing. 2. Production method A: Diamond belt: (1) : Select reference point: Select a through hole (i.e. a hole in the first drilling strip) as the unit reference hole. (2) Each blind hole drill belt needs to select a hole an
OSP is the abbreviation for Organic Solderability Preservatives, also known as copper protector. Simply put, OSP is a chemical method that grows a layer of organic film on a clean bare copper surface. This film has oxidation resistance, heat resistance, impact resistance, and moisture resistance, used to protect the copper surface of circuit boards from oxidation or vulcanization in normal environments; But in the subsequent welding high temperature, this protective film must be easily removed by the flux quickly, so that the exposed clean copper surface can immediately combine with the molten solder to form a solid solder joint in a very short time. 1. Process flow: degreasing → water washing → micro etching → water washing → acid washing → pure water washing → OSP → pure water washing → drying. 2. Principle: A layer of organic film is formed on the copper surface of the circuit board, firmly protecting the fresh copper surface and preventing oxidation and pollution even at high
To solve the above problems of gold-plated boards, PCBs using gold-plated boards mainly have the following characteristics: 1. Due to the different crystal structures formed by gold deposition and gold plating, gold deposition will appear more yellow than gold plating, resulting in better customer satisfaction. 2. Due to the different crystal structures formed by sinking gold and plating gold, sinking gold is easier to weld than plating gold, and will not cause welding defects, leading to customer complaints. 3. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, the signal transmission in the skin effect is in the copper layer and will not affect the signal. 4. Due to the denser crystal structure of deposited gold compared to gold plating, it is less prone to oxidation. 5. Due to the fact that only nickel gold is present on the solder pad of the sinking gold plate, it will not produce gold wire and cause slight shortening.
1. Annual maintenance knowledge: 1. Clean the dust on the circuit board. 2. The electrolytic capacitor capacity in the circuit board is randomly checked, if the capacity of the electrolytic capacitor is found to be less than 20% of the nominal capacity, it should be replaced, and the general life of the electrolytic capacitor should be replaced for about ten years to ensure the working performance of the pcb. 3. For high-power devices coated with heat dissipation silicone grease, check whether the heat dissipation silicone grease is dry and solid. For dry and solid devices, remove the dry and solid heat dissipation silicone grease and apply new heat dissipation silicone grease to prevent the high-power devices in the circuit board from burning out due to poor heat dissipation. 2, seasonal maintenance: 1. Clean the dust on the circuit board every quarter, use the circuit board special cleaning solution for cleaning, after cleaning the dust above, dry the circuit board with a ha
First, the different materials used in flexible circuit boards cause the diversity of prices Taking ordinary double panels as an example, the board material is generally PET, PI, etc., the board thickness ranges from 0.0125mm to 0.10mm, and the copper thickness ranges from 0.0125mm to 0.10mm. Oz to 3 Oz, all of which creates a huge price difference in sheet metal alone; The different brands of materials also have a certain price difference, so the different materials cause the diversity of prices. Second, the different production processes used in flexible circuit boards cause the diversity of prices Different production processes result in different costs. Such as gold-plated plate and tinned plate, the accuracy of the production shape, the use of silk screen lines and dry film lines will form different costs, leading to the diversity of prices. Third, the price diversity caused by the different difficulty of the flexible circuit board itself Even if the material is the same
For some customers, pcb sampling production design is seriously non-standard, it is impossible to distinguish which is pad and which is via usage, sometimes conductive holes are processed with pad, sometimes key holes are processed with via, the design is confused, resulting in increased errors, according to incomplete statistics of Jialicom, the problems caused by non-standard design account for more than 50% of customer complaints. And for the current situation of the circuit board, some of the processing of Philin engineers, because the customer design documents are not standardized, and make mistakes, help customers modify the document, the non-standard design, with their own experience to deal with engineering data, which leads to and contributes to the customer's design is not standardized, Jialicang once again stated that the last time you do the right, does not mean that your file is right! All engineers must pay attention to the design standards and specifications! Jialich
An ordinary pcb board proofing production line needs more than 20 million yuan, multi-layer boards need to invest 50 million yuan, and HDI needs to invest more than 200 million yuan. Due to the huge industry, the division of labor is very fine, there are single-station process outsourcing specializing in drilling, etc., and low-grade products are oversupplied. HDI and other high-end printed circuit board industry is a capital, labor-intensive industry, management and technical requirements are relatively high, often become the bottleneck of capacity expansion. Glass fiber yarn: glass fiber yarn processing by silica sand and other raw materials in the kiln calcined into liquid, through the PCB through the very small alloy nozzle to draw very fine glass fiber, and then hundreds of glass fiber twisted into glass fiber yarn. Kiln construction investment is huge, for the capital intensive industry, 30,000 tons of kiln needs 400 million yuan, the new kiln needs 18 months, the business
Many customers believe that after a hole is broken, the film temperature and pressure should be increased to enhance its adhesion. However, this view is not correct because the solvent in the corrosion resistant layer evaporates excessively when the temperature and pressure are too high, making the dry film brittle and thin. During development, it is very easy to break the hole. We always need to maintain the toughness of the dry film. Therefore, after a hole is broken, we can improve it from the following points: 1. Reduce film temperature and pressure 2. Improve drilling edge 3. Increase exposure energy 4. Reduce development pressure 5. After applying the film, the parking time should not be too long to avoid causing the semi fluid like drug film at the corner to diffuse and thin under pressure 6. During the film application process, do not tension the dry film too tightly
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