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PCB Product Capabilities
From FR4,high TG,Polymide to high-power, RF, and specialized materials — explore all PCB product categories including HDI and rigid-flex for modern hardware. Get A Quote Contact Us |
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 HDI PCB |
Lead Time: 7-18 DaysLayer Count: 4–12 Layers |
Supported Materials: FR-4 high-Tg / low-Dk laminates Typical Applications: IoT, wearables, smartphones, compact modules |
Key Features:
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Rigid-Flex PCB |
Lead Time: 10-18 DaysLayer Count:
2–10 layers (rigid);
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Supported Materials: Polyimide / FR-4 / adhesive/adhesive-less PI Typical Applications: AR/VR, foldable devices, medical wearables |
Key Features:
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Multilayer PCB |
Lead Time: 5-15 DaysLayer Count: 4-32 Layers |
Supported Materials: FR-4 / high-Tg FR-4 Typical Applications: Industrial, automation, consumer electronics |
Key Features:
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High-Power |
Lead Time: 5-15 DaysLayer Count: 2–10 Layers |
Supported Materials: FR-4 / high-Tg FR-4 Typical Applications: Power electronics, chargers, motor control |
Key Features:
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 Metal Core PCB |
Lead Time: 5-15 DaysLayer Count: 2–8 Layers |
Supported Materials: Copper Core/Aluminum Core/FR-4 Typical Applications:
LED lighting modules, tail lights, |
Key Features:
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High-Speed |
Lead Time: 5-15 DaysLayer Count: 4–20 Layers |
Supported Materials: Megtron 6/7, Tachyon, TU-872, low-Dk/Df FR-4 Typical Applications: 5G, servers, telecom equipment |
Key Features:
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Flexible PCB |
Lead Time: 5-10 DaysLayer Count: 1-4 Layers |
Supported Materials: Polyimide / adhesive-less PI Typical Applications: Wearables, cameras, connectors, sensors |
Key Features:
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They help engineers quickly evaluate manufacturability and match real PCB performance with high-speed or high-power design requirements.
| Product Type | Min Trace/Space | Min Drill / Microvia | Aspect Ratio | Max Layers | Board Size Max | HDI Levels | Blind/Buried Via | Via Filling | Backdrill |
| HDI PCB | 🔵 2/2 mil |
🔵 0.075–0.1 mm laser via |
1:1 (microvia) / 1:10 (TH) |
🔵 12–16L | 🔵 250×310 mm | 1–3 levels | Yes | resin / copper-filled | Yes |
| Rigid-Flex PCB | 🔵 3/3 mil | 0.1 mm laser | 1:1–1:12 | 🔵 10L | 🔵 350×600 mm | 1 level | No (usually) | No | No |
RF / Microwave PCB
High-Speed /
Low-Loss PCB
4/4 mil
mechanical only
1:08
2–8L
🔵 400×500 mm
–
No
No
No
🔵 3/3 mil
laser optional
1:10
4–20L
🔵 300×500 mm
1–2 levels
Yes
resin
Yes
Heavy-Copper PCB
6/6 mil (2 oz)
mechanical only
1:08
2–10L
🔵 350×450 mm
–
No
No
No
8/8 mil (4–6 oz)
Multilayer PCB
🔵 3/3 mil
mechanical
1:10
🔵 4–32L
🔵 450×600 mm
–
Optional
No
Optional
FPC (Flex PCB)
3/3 mil
0.1 mm laser
1:1–1:10
1–4L
🔵 300×500 mm
–
No
No
No
| Product | Supported Material Systems | Tg Range | Low-Loss Options | Special Requirements |
| HDI | FR-4 high-Tg, S1000H | 150–170°C | – | thin cores (50–75 µm) |
| Rigid-Flex |
PI (adhesive / non-adhesive) FR-4 |
150–200°C | – | bend radius validation |
| RF PCB |
Rogers 4003/4350B/ PTFE,/hydrocarbon |
120–200°C | Yes | Dk/Df stability |
| High-Speed PCB | Megtron 6/7, Tachyon, IT-88 | 180–200°C | Yes | low roughness foil |
| Heavy-Copper | FR-4 / FR-5 | 130–170°C | – | thick copper lamination |
| Multilayer PCB | FR-4 / FR-5 | 130–150°C | – | high aspect ratio control |
| FPC | Polyimide | 200–260°C | – | flex reliability |
| Factors | HDI PCB | Rigid-Flex | RF PCB | High-Speed PCB | Heavy-Copper PCB | Multilayer PCB | FPC |
| Thermal Cycling | good | excellent | medium | good | good | good | medium |
| Vibration Resistance | good | good | medium | good | excellent | good | low |
| Flex/Bend Life | – | excellent | – | – | – | – | excellent |
| Via Reliability | high | medium | medium | high (backdrill optional) | high | medium | – |
| Max Copper Weight | 1 oz | 1 oz rigid / 0.5 oz flex | 1 oz | 1 oz | 🔵 2–6 oz | 1–2 oz | 0.5–1 oz |
| Thermal Via Support | Yes | limited | limited | optional | Yes | Yes | Impedance & Signal Performance |
| Heat Spreading | limited | – | – | plane–based | strong | good | – |
| Suitable Applications | IoT, wearables | AR/VR, medical | antennas, RF modules | servers, telecom | power electronics | industrial | wearables |
Controlled Impedance for High-Speed & RF PathsStable impedance for MIPI, USB, LVDS, PCIe, 5G NR, Wi-Fi/BLE RF, and 10–112G SerDes. Maintains signal quality through:
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HDI Microvia Reliability (Stacked & Staggered)Verified microvia integrity for fine-pitch BGA fan-out, sensor clusters, and compact IoT modules:
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High-Temperature & High-Tg Stackups for Harsh EnvironmentsThermally stable materials for automotive (AEC-Q100 electronics), aerospace (–55°C to +150°C), and industrial control:
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Heavy-Copper Thermal Management for High-Power ElectronicsFor power converters, motor drivers, chargers, BMS, PMIC zones:
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Rigid-Flex Mechanical Stability under Repeated BendingDesigned for wearables, AR/VR headsets, medical sensors, and dynamic cable replacements:
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RF Loss & Phase Stability for Microwave/mmWave DesignsFor antennas, radar front-ends, GNSS, BLE/WiFi modules, 24/60/77 GHz automotive radar:
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Operations Center
Shenzhen KnownPCB Technology Co.,LtdBldg D,Liantangkeng Industrial Area,Qianjin Road,Xixiang Street,Bao'an Dist.,Shenzhen City,Guangdong Province,518102,China.
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