| Vias Holes (According to IPC-4761) | ||
|---|---|---|
Tented Via | A via with a dry film mask material applied bridging over the via wherein no additional materials are in the hole. Single-sided tented is not recommended.  |  |
Tented and Covered Via | A Type I via with a secondary covering of mask material applied over the tented via. Single-sided tented and covered is not recommended. |  |
Plugged Via | A via with material applied allowing partial penetration into the via. Single-sided plugged is not recommended.  |  |
Plugged and Covered Via | A Type III via with a secondary covering of material applied over the via. Single-sided plugged and covered is not recommended.  |  |
Filled Via | A via with material applied into the via targeting full penetration and encapsulation of the hole.  |  |
Filled and Covered Via | A Type V via with a secondary covering of material (liquid or dry film soldermask) applied over the via.  |  |
Filled and Capped Via | A Type V via with a secondary metallized coating covering the via. The metallization is on both sides.  |  |
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