FR4,High TG, Polymide to High-power, RF PCB

PCB Product

Comparison Table

	HDI PCB	Rigid-Flex PCB	Multilayer PCB (Standard)	High-Power Heavy-Copper PCB	Metal Core PCB	High-Speed Low-Loss PCB	Flexible PCB (FPC)
Lead Time	7-18 Days	10-18 Days	5-15 Days	5-15 Days	5-15 Days	5-15 Days	5-10 Days
Layer Count	4–12 Layers	Rigid: 2–10 Layers Flex: 1–4 Layers	4-32 Layers	2–10 Layers	2–8 Layers	4–20 Layers	1-4 Layers
Supported Materials	FR-4 high-Tg / low-Dk laminates	Polyimide / FR-4 / adhesive-less PI	FR-4 / high-Tg FR-4	FR-4 / high-Tg FR-4	Copper Core / Aluminum Core / FR-4	Megtron 6/7, Tachyon, TU-872, low-Dk/Df FR-4	Polyimide / adhesive-less PI
Typical Applications	IoT / Wearables / Smartphones / Compact Modules	AR/VR / Foldable Devices / Medical Wearables	Industrial / Automation / Consumer Electronics	Power Electronics / Chargers / Motor Control	LED Lighting / DC-DC Converters / Power Control / Thermal Boards	5G / Servers / Telecom Equipment	Wearables / Cameras / Connectors / Sensors
Key Features	◎ 2-3 levels microvia ◎ Fine-pitch BGA fan-out ◎ Impedance control	◎ Dynamic bending ◎ Stable interconnects ◎ Weight reduction	◎ Cost-effective ◎ Stable performance ◎ Widely applicable	◎ High current carrying ◎ Thermal via arrays ◎ HV spacing	◎ Efficient heat dissipation ◎ High thermal conductivity ◎ Stable mechanical structure	◎ 10–112G SerDes ◎ Low skew ◎ Backdrill support	◎ Ultra-thin ◎ Small bending radius ◎ Dynamic flex
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Our PCB Capabilities

—are summarized in clear tables.

They help engineers quickly evaluate manufacturability and match real PCB performance with high-speed or high-power design requirements.

01Core electrical specs
02Material and stackup design options
03Impedance & Signal Performance

Product Type

Min Trace/Space

Min Drill / Microvia

Aspect Ratio

Max Layers

Board Size Max

HDI Levels

Blind/Buried Via

Via Filling

Backdrill

HDI PCB

🔵 2/2 mil

🔵 0.075–0.1 mm

laser via

1:1 (microvia) /

1:10 (TH)

🔵 12–16L

🔵 250×310 mm

1–3 levels

Yes

resin / copper-filled

Yes

Rigid-Flex PCB

🔵 3/3 mil

0.1 mm laser

1:1–1:12

🔵 10L

🔵 350×600 mm

1 level

No (usually)

RF / Microwave PCB

4/4 mil

mechanical only

1:08

2–8L

🔵 400×500 mm

–

High-Speed /

Low-Loss PCB

🔵 3/3 mil

laser optional

1:10

4–20L

🔵 300×500 mm

1–2 levels

Yes

resin

Yes

Heavy-Copper PCB	6/6 mil (2 oz)	mechanical only	1:08	2–10L	🔵 350×450 mm	–	No	No	No
Heavy-Copper PCB	8/8 mil (4–6 oz)	mechanical only	1:08	2–10L	🔵 350×450 mm	–	No	No	No
Multilayer PCB	🔵 3/3 mil	mechanical	1:10	🔵 4–32L	🔵 450×600 mm	–	Optional	No	Optional
FPC (Flex PCB)	3/3 mil	0.1 mm laser	1:1–1:10	1–4L	🔵 300×500 mm	–	No	No	No

Product	Supported Material Systems	Tg Range	Low-Loss Options	Special Requirements
HDI	FR-4 high-Tg, S1000H	150–170°C	–	thin cores (50–75 µm)

Rigid-Flex

PI (adhesive / non-adhesive)

FR-4

150–200°C

–

bend radius validation

RF PCB

Rogers 4003/4350B/

PTFE,/hydrocarbon

120–200°C

Yes

Dk/Df stability

High-Speed PCB	Megtron 6/7, Tachyon, IT-88	180–200°C	Yes	low roughness foil
Heavy-Copper	FR-4 / FR-5	130–170°C	–	thick copper lamination

Multilayer PCB	FR-4 / FR-5	130–150°C	–	high aspect ratio control
FPC	Polyimide	200–260°C	–	flex reliability

Factors	HDI PCB	Rigid-Flex	RF PCB	High-Speed PCB	Heavy-Copper PCB	Multilayer PCB	FPC
Thermal Cycling	good	excellent	medium	good	good	good	medium
Vibration Resistance	good	good	medium	good	excellent	good	low

Flex/Bend Life	–	excellent	–	–	–	–	excellent
Via Reliability	high	medium	medium	high (backdrill optional)	high	medium	–

Max Copper Weight	1 oz	1 oz rigid / 0.5 oz flex	1 oz	1 oz	🔵 2–6 oz	1–2 oz	0.5–1 oz
Thermal Via Support	Yes	limited	limited	optional	Yes	Yes	Impedance & Signal Performance

Heat Spreading	limited	–	–	plane–based	strong	good	–
Suitable Applications	IoT, wearables	AR/VR, medical	antennas, RF modules	servers, telecom	power electronics	industrial	wearables

Advanced PCB Technology & Reliability Capabilities

Controlled Impedance for High-Speed & RF Paths

Stable impedance for MIPI, USB, LVDS, PCIe, 5G NR, Wi-Fi/BLE RF, and 10–112G SerDes.

Maintains signal quality through:

Precise dielectric thickness
Consistent copper-reference planes
Low-loss / low-Dk / low-Df stackups

HDI Microvia Reliability (Stacked & Staggered)

Verified microvia integrity for fine-pitch BGA fan-out, sensor clusters, and compact IoT modules:

stable laser via formation
controlled plating and copper filling
copper balancing to avoid via fatigue underthermal cycling

High-Temperature & High-Tg Stackups for Harsh Environments

Thermally stable materials for automotive (AEC-Q100 electronics), aerospace (–55°C to +150°C), and industrial control:

high-Tg FR-4 / FR-5
polyimide for wide thermal cycling
CTE-matched stackups to reduce warpage

Heavy-Copper Thermal Management for High-Power Electronics

For power converters, motor drivers, chargers, BMS, PMIC zones:

2–6 oz copperoptions
thermal-via grids
heat-spreading planes for MOSFETs / IGBTs /SiC devices

Rigid-Flex Mechanical Stability under Repeated Bending

Designed for wearables, AR/VR headsets, medical sensors, and dynamic cable replacements:

bend-radius validation
flex-tail stress analysis
adhesive-less PI for long bending life

RF Loss & Phase Stability for Microwave/mmWave Designs

For antennas, radar front-ends, GNSS, BLE/WiFi modules, 24/60/77 GHz automotive radar:

low-loss PTFE / hydrocarbon laminates
smooth copper for reduced conductor loss
stable Dk across frequency and temperature

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PCB Product Capabilities