A China-based PCB manufacturer working closely with global hardware engineers

PCB Product

Comparison Table

HDI PCB

Lead Time:

7-18 Days

Layer Count:

4–12 Layers

Supported Materials:

FR-4 high-Tg / low-Dk laminates

Typical Applications:

IoT, wearables, smartphones, compact modules

Key Features:

2-3 levels microvia
fine-pitch BGA fan-out
impedance control

Rigid-Flex PCB

Lead Time:

10-18 Days

Layer Count:

2–10 layers (rigid);
1–4 layers (flex)

Supported Materials:

Polyimide / FR-4 / adhesive/adhesive-less PI

Typical Applications:

AR/VR, foldable devices, medical wearables

Key Features:

Dynamic Bending
Stable Interconnects
Weight Reduction

Multilayer PCB
(Standard)

Lead Time:

5-15 Days

Layer Count:

4-32 Layers

Supported Materials:

FR-4 / high-Tg FR-4

Typical Applications:

Industrial, automation, consumer electronics

Key Features:

cost-effective
stable performance
widely applicable

High-Power
Heavy-Copper PCB

Lead Time:

5-15 Days

Layer Count:

2–10 Layers

Supported Materials:

FR-4 / high-Tg FR-4

Typical Applications:

Power electronics, chargers, motor control

Key Features:

high current carrying
thermal via arrays
HV spacing

Metal Core PCB

Lead Time:

5-15 Days

Layer Count:

2–8 Layers

Supported Materials:

Copper Core/Aluminum Core/FR-4

Typical Applications:

LED lighting modules, tail lights,
DC-DC converters, power control units
Thermal management boards for consumer electronics

Key Features:

efficient heat dissipation
high thermal conductivity
stable mechanical structure

High-Speed
Low-Loss PCB

Lead Time:

5-15 Days

Layer Count:

4–20 Layers

Supported Materials:

Megtron 6/7, Tachyon, TU-872, low-Dk/Df FR-4

Typical Applications:

5G, servers, telecom equipment

Key Features:

10–112G SerDes
low skew
backdrill support

Flexible PCB
(FPC)

Lead Time:

5-10 Days

Layer Count:

1-4 Layers

Supported Materials:

Polyimide / adhesive-less PI

Typical Applications:

Wearables, cameras, connectors, sensors

Key Features:

ultra-thin
small bending radius
dynamic flex

Our PCB Capabilities

—are summarized in clear tables.

They help engineers quickly evaluate manufacturability and match real PCB performance with high-speed or high-power design requirements.

01Core electrical specs
02Material and stackup design options
03Impedance & Signal Performance

Product Type

Min Trace/Space

Min Drill / Microvia

Aspect Ratio

Max Layers

Board Size Max

HDI Levels

Blind/Buried Via

Via Filling

Backdrill

HDI PCB

🔵 2/2 mil

🔵 0.075–0.1 mm

laser via

1:1 (microvia) /

1:10 (TH)

🔵 12–16L

🔵 250×310 mm

1–3 levels

Yes

resin / copper-filled

Yes

Rigid-Flex PCB

🔵 3/3 mil

0.1 mm laser

1:1–1:12

🔵 10L

🔵 350×600 mm

1 level

No (usually)

RF / Microwave PCB

4/4 mil

mechanical only

1:08

2–8L

🔵 400×500 mm

–

High-Speed /

Low-Loss PCB

🔵 3/3 mil

laser optional

1:10

4–20L

🔵 300×500 mm

1–2 levels

Yes

resin

Yes

Heavy-Copper PCB	6/6 mil (2 oz)	mechanical only	1:08	2–10L	🔵 350×450 mm	–	No	No	No
Heavy-Copper PCB	8/8 mil (4–6 oz)	mechanical only	1:08	2–10L	🔵 350×450 mm	–	No	No	No
Multilayer PCB	🔵 3/3 mil	mechanical	1:10	🔵 4–32L	🔵 450×600 mm	–	Optional	No	Optional
FPC (Flex PCB)	3/3 mil	0.1 mm laser	1:1–1:10	1–4L	🔵 300×500 mm	–	No	No	No

Product	Supported Material Systems	Tg Range	Low-Loss Options	Special Requirements
HDI	FR-4 high-Tg, S1000H	150–170°C	–	thin cores (50–75 µm)

Rigid-Flex

PI (adhesive / non-adhesive)

FR-4

150–200°C

–

bend radius validation

RF PCB

Rogers 4003/4350B/

PTFE,/hydrocarbon

120–200°C

Yes

Dk/Df stability

High-Speed PCB	Megtron 6/7, Tachyon, IT-88	180–200°C	Yes	low roughness foil
Heavy-Copper	FR-4 / FR-5	130–170°C	–	thick copper lamination

Multilayer PCB	FR-4 / FR-5	130–150°C	–	high aspect ratio control
FPC	Polyimide	200–260°C	–	flex reliability

Factors	HDI PCB	Rigid-Flex	RF PCB	High-Speed PCB	Heavy-Copper PCB	Multilayer PCB	FPC
Thermal Cycling	good	excellent	medium	good	good	good	medium
Vibration Resistance	good	good	medium	good	excellent	good	low

Flex/Bend Life	–	excellent	–	–	–	–	excellent
Via Reliability	high	medium	medium	high (backdrill optional)	high	medium	–

Max Copper Weight	1 oz	1 oz rigid / 0.5 oz flex	1 oz	1 oz	🔵 2–6 oz	1–2 oz	0.5–1 oz
Thermal Via Support	Yes	limited	limited	optional	Yes	Yes	Impedance & Signal Performance

Heat Spreading	limited	–	–	plane–based	strong	good	–
Suitable Applications	IoT, wearables	AR/VR, medical	antennas, RF modules	servers, telecom	power electronics	industrial	wearables

Advanced PCB Technology & Reliability Capabilities

Controlled Impedance for High-Speed & RF Paths

Stable impedance for MIPI, USB, LVDS, PCIe, 5G NR, Wi-Fi/BLE RF, and 10–112G SerDes.

Maintains signal quality through:

Precise dielectric thickness
Consistent copper-reference planes
Low-loss / low-Dk / low-Df stackups

HDI Microvia Reliability (Stacked & Staggered)

Verified microvia integrity for fine-pitch BGA fan-out, sensor clusters, and compact IoT modules:

stable laser via formation
controlled plating and copper filling
copper balancing to avoid via fatigue underthermal cycling

High-Temperature & High-Tg Stackups for Harsh Environments

Thermally stable materials for automotive (AEC-Q100 electronics), aerospace (–55°C to +150°C), and industrial control:

high-Tg FR-4 / FR-5
polyimide for wide thermal cycling
CTE-matched stackups to reduce warpage

Heavy-Copper Thermal Management for High-Power Electronics

For power converters, motor drivers, chargers, BMS, PMIC zones:

2–6 oz copperoptions
thermal-via grids
heat-spreading planes for MOSFETs / IGBTs /SiC devices

Rigid-Flex Mechanical Stability under Repeated Bending

Designed for wearables, AR/VR headsets, medical sensors, and dynamic cable replacements:

bend-radius validation
flex-tail stress analysis
adhesive-less PI for long bending life

RF Loss & Phase Stability for Microwave/mmWave Designs

For antennas, radar front-ends, GNSS, BLE/WiFi modules, 24/60/77 GHz automotive radar:

low-loss PTFE / hydrocarbon laminates
smooth copper for reduced conductor loss
stable Dk across frequency and temperature

Products & Services

Submit Your Gerber

Request Stackup Review

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PCB Product Capabilities

PCB Product

Comparison Table

7-18 Days

4–12 Layers

10-18 Days

2–10 layers (rigid);
1–4 layers (flex)

5-15 Days

4-32 Layers

5-15 Days

2–10 Layers

5-15 Days

2–8 Layers

5-15 Days

4–20 Layers

5-10 Days

1-4 Layers

Our PCB Capabilities

—are summarized in clear tables.

Advanced PCB Technology & Reliability Capabilities

Controlled Impedance for High-Speed & RF Paths

HDI Microvia Reliability (Stacked & Staggered)

High-Temperature & High-Tg Stackups for Harsh Environments

Heavy-Copper Thermal Management for High-Power Electronics

Rigid-Flex Mechanical Stability under Repeated Bending

RF Loss & Phase Stability for Microwave/mmWave Designs

Submit Your Gerber

Request Stackup Review

Shenzhen KnownPCB Technology Co.,Ltd

Request a call back

Operation Center

Follow Us

PCB Product Capabilities

PCB Product

Comparison Table

7-18 Days

4–12 Layers

10-18 Days

2–10 layers (rigid); 1–4 layers (flex)

5-15 Days

4-32 Layers

5-15 Days

2–10 Layers

5-15 Days

2–8 Layers

5-15 Days

4–20 Layers

5-10 Days

1-4 Layers

Our PCB Capabilities

—are summarized in clear tables.

Advanced PCB Technology & Reliability Capabilities

Controlled Impedance for High-Speed & RF Paths

HDI Microvia Reliability (Stacked & Staggered)

High-Temperature & High-Tg Stackups for Harsh Environments

Heavy-Copper Thermal Management for High-Power Electronics

Rigid-Flex Mechanical Stability under Repeated Bending

RF Loss & Phase Stability for Microwave/mmWave Designs

Submit Your Gerber

Request Stackup Review

Shenzhen KnownPCB Technology Co.,Ltd

Request a call back

Operation Center

Follow Us

2–10 layers (rigid);
1–4 layers (flex)