Get A Quote
CN
Prototype PCB Board Assembly Factory in China | Low MOQOne Supplier for SMT, THT, DFM, and Production Builds
We provide end-to-end PCB assembly services, SMT, THT, testing, and full engineering review built for prototype PCB assembly, NPI builds, and reliable low-to-mid volume production.
|
Selection GuideWhich PCB Assembly Service Page Should You Visit?Use the table below to quickly match your project requirement with the correct service page. Choose a service based on your build stage and assembly requirements.
|
|||||||||||||||||||||||||||||||||||
Support for prototype, NPI, low-volume, and mass-production PCBA builds.
Capable of handling rigid, flex, and rigid-flex PCBs with single-sided or double-sided SMT placement.
Submit Your Files for a Free DFM Review
| Item | Sub-item | Standard Capability | Limited Capability | Remark |
|---|---|---|---|---|
| SMT Process | PCB - Min Size | L≥30mm, W≥30mm | L<30mm, W<30mm | BOT, TOP sides components, Fiducial Mark should be ≥3mm from the board edge |
| PCB - Max Size | L≤650mm, W≤400mm | L:800-650mm, W:400-450mm | ||
| PCB - Component thickness(T) | 0.5mm ≤ T ≤ 3mm | T < 0.5mm, T > 3mm | ||
| Component size - Min Package | 0201 (0.6mm*0.3mm) | 01005 (0.3mm*0.2mm) | ||
| QFP, QFN, SOP, SOJ - Min Pin distance | 0.4mm | 0.3mm ≤ Pitch < 0.4mm | ||
| CSP, BGA - Min Pitch distance | 0.4mm | 0.3mm ≤ Pitch < 0.4mm | ||
| DIP Process (Wave soldering) | PCB Size - Min Size | L≥30mm, W≥30mm | L<30mm | |
| PCB Size - Max Size | L≤650mm, W≤400mm | L:800-650mm, W:400-450mm | ||
| PCB Size - Thinnest Size | 0.4mm | T < 0.4mm | ||
| PCB Size - Thickest Size | 5mm | T > 5mm | ||
| Conformal Coating Process | Temperature range | -30℃ ≤ T ≤ 120℃ | -50℃ ≤ T ≤ 150℃ | |
| Coating thickness | 20um ≤ T ≤ 35um | 35um ≤ T ≤ 60um |
|
|
High-performance SMT lines equipped with automated stencil printers, advanced pick-and-place platforms, multi-zone reflow ovens, wave and selective soldering systems, and inline SPI/AOI/X-ray inspection.
Design & File Review (DFA)
Process Description
Validate Gerber/BOM accuracy, ensure manufacturability, and identify layout risks before production begins. Key Technical Requirements Correct footprints; spacing & clearance; thermal relief design; BOM validation; DFM/DFA compliance. |
Solder Paste Printing
Process Description
Apply solder paste precisely to SMT pads using stencil alignment, ensuring consistent volume and clean pad definition. Key Technical Requirements
Laser-cut stencil accuracy; controlled paste viscosity; |
SMT Component Placement
Process Description
Place SMD components at high speed with vision alignment to ensure accuracy for fine-pitch and miniature packages. Key Technical Requirements Optical centering; feeder calibration; fine-pitch handling (BGA/QFN/01005); placement accuracy control. |
Reflow Soldering
Process Description
Melt solder paste under controlled thermal profiles to form strong joints without damaging heat-sensitive components. Key Technical Requirements Multi-zone temperature profiling; peak temp control; nitrogen atmosphere (optional); thermal soak/cooling control. |
Through-Hole Assembly (THT)
Process Description
Insert leaded components manually or via automation, followed by wave or selective soldering for reliable joints. Key Technical Requirements Proper lead forming; wave height control; selective solder parameters; solder fillet & hole-fill requirements. |
Cleaning & Finishing
Process Description
Remove flux residues and apply optional conformal coating for added protection and long-term reliability. Key Technical Requirements Ionic contamination limits; ultrasonic/aqueous cleaning; controlled coating thickness; masking critical zones. |
Inspection & Testing
Process Description
Verify assembly quality with AOI/X-ray and confirm electrical performance through ICT, flying-probe or functional tests. Key Technical Requirements
AOI coverage; X-ray for BGAs; solder joint criteria; |
Discuss Your Process Requirements with Our Team
|
KnownPCB supports PCBA projects for industrial, IoT, medical, automotive, telecom, aerospace and power electronics applications.
|
|
|
|||
|
|
|
Should I choose prototype PCB assembly or low-volume PCB assembly?Choose prototype PCB assembly if you are building first samples or engineering validation boards. Choose low-volume PCB assembly if your design is more stable and you need pilot production, NPI builds or small-batch commercial production. |
When should I choose SMT assembly services?SMT assembly is suitable when your PCB uses surface-mount components such as resistors, capacitors, ICs, QFN, BGA, LGA, CSP or other fine-pitch SMD packages. |
When is through-hole PCB assembly required?Through-hole assembly is commonly used for connectors, switches, transformers, high-current components, power devices and parts that need stronger mechanical bonding than standard SMT components. |
Can KnownPCB source components for my PCB assembly project?Yes. KnownPCB supports component sourcing, BOM validation, shortage review, alternative part suggestions and material preparation for turnkey, partial turnkey and consigned PCBA projects. |
What files are needed for a PCB assembly quote?To request a quote, customers usually provide Gerber files, BOM, pick-and-place file, assembly drawing, quantity, sourcing model, testing requirements and any special process notes. |
Proven by 7 industries, 4000+ customer projects
|
Please contact us at sales@knownpcb.com, ask for engineering support here or use the form below to reach out to KnownPCB |
Request a Manufacturing QuoteInclude your quantity, target delivery date and key requirements. File handling and NDA information. |
