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Industrial Double-sided Aluminium PCB Manufacturer in China

Metal Core PCB

-- for SMEs Needing Serious Thermal Dissipation IATF 16949 Certified MCPCB Fabrication In China Since 2008

Whether you require standard aluminum core or high-power copper base boards for MOSFET arrays, our process ensures high dielectric strength

 (> 3.0  KV) and reliable high-current paths.

What are MC(Metal Core) PCBs?

PCB with an aluminium or copper core used primarily for high-power LED and power driver thermal management.

  1. Qualification, Materials & Compliance Overview
  2. The Advantages of MC PCB

Qualification, Materials & Compliance Overview

Acceptance Standards for 

Manufactured to IPC-6012 guidelines adapted for metal-based boards and OEM-specific thermal test requirements.


Material Standards

Metal base (Al or Cu), thermally conductive dielectric layer, copper foil; all materials traceable and UL-recognized where needed.


Structure Overview

Typically single-sided or limited multilayer build on a metal core, with thermal vias and direct heat path to chassis or heatsink.


Compliance

Supports RoHS / REACH, UL marking, and relevant safety and insulation requirements for lighting and power equipment.


KnownPCB Prototyping & Mass Production Service Request Thermal Design Review

The Advantages of MC PCB

(Metal Core Printed Circuit Board)

Reliable for continuous high-power operation when CTE and dielectric quality are controlled.

  • 01 Metal core provides a stable heat path away from devices;
  • 02 Good adhesion and void-free dielectric are critical under thermal cycling;
  • 03 Often used in long-life lighting and outdoor equipment.

More expensive than standard FR-4, but often cheaper than complex heat-sink assemblies.

  • 01 Aluminium or copper core increases base cost;
  • 02 Can remove separate heat sinks, thermal pads and mounting hardware;
  • 03 Simplifies mechanical design in thermally dominated applications.


Performance is driven by thermal capacity rather than routing density.

  • 01 Short conduction path from device to core and chassis improves junction temperature;
  • 02 Allows LEDs and power devices to run at higher power within safe limits;
  • 03 Best suited to relatively simple layouts for lighting and power modules.

KnownPCB Prototyping & Mass Production Service Request Thermal Design Review

IATF 16949 Certified MCPCB Fabrication

In China Since 2008


We consistently deliver MCPCB with high performance by utilizing premium dielectric layers with high thermal conductivity (k> 2.0W/m.K), minimizing thermal resistance (Rth). 


Thermal problems are usually structural, not schematic. 

These parameters focus on core material, dielectric thickness, thermal conductivity, and breakdown limits—so you can evaluate whether an MCPCB can manage heat, voltage, and mechanical mounting before finalizing LED or power-module layouts.


KnownPCB Profile Ask for DFM Guideline

Metal Core PCB
  1. 01Metal Core PCB (MCPCB) Layer/Complexity Mapping Matrix
Parameter BASIC (Single-layer Aluminum MCPCB) ADVANCED (High-thermal Aluminum MCPCB) HIGH-END (Copper Core / Multilayer MCPCB) Typical Use Case Classification Logic
Layer Count Single layerSingle / Dual layerDual-layer / Multilayer + localized thermal structuresEvaluating thermal path & routing spaceLayer Count / Structure
Metal Core Material Standard aluminumHigh-thermal-conductivity aluminum alloyCopper core / Specialty metal coreLED / Power module material selectionMaterial / Structure
Thermal Conductivity (k) 1.0–3.0 W/m·K2.0–8.0 W/m·K3.0–10.0+ W/m·KThermal dissipation capabilityMaterial / Process
Dielectric Thickness 75–100 µm50–75 µm≤50 µm (down to 25 µm)Balancing thermal resistance & dielectric breakdownMaterial / Process
Copper Foil Thickness 1–3 oz1–3 oz2–4 ozHigh-current tracesMaterial / Process
Surface Finish HASL / OSPENIG / OSPENIG / Hard Gold / Selective platingSolder joint reliability & connector durabilityMaterial / Process
Board Thickness 0.8–1.6 mm1.0–2.0 mm1.5–3.0 mm (incl. copper core)Structural strength & heatsink attachmentStructure / Mechanical
Mechanical Accuracy / Tolerances Standard tolerancesEnhanced dimensional controlHigh-precision profiling + slottingMechanical assembly & heatsink fitMechanical / Process
Dielectric Breakdown Voltage 500–1,000 V1,000–2,000 V>2,000 VHigh-voltage LED drivers / Power suppliesFunctional / Performance
Operating Temperature –20 to 85 °C–40 to 105 °C–40 to 125 / 150 °CAutomotive lighting / Industrial / New energyFunctional / Performance
Thermal Cycling Life Standard gradeMid-gradeAutomotive/Industrial-grade cycling lifeLong-term reliabilityFunctional / Performance
Service Tier MCPCB BASICMCPCB ADVMCPCB PROQuick selection by application & power levelTier / Capability
Standard Lead Time 3–10 days3–10 days5–20 daysProject schedulingLead Time / Planning
Localized Heavy-copper Regions Not supported / LimitedLocalized copper thickening (selective)Embedded copper blocks / Complex localized copper structuresHigh-power hotspot designMaterial / Process
Slotting / Thermal Windows Simple mechanical slotsPolygon thermal windowsComplex CNC machining / Recessed cavitiesHeatsink bonding & insulation clearanceMechanical / Process

Industry-specific

PCB Solutions

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FAQs

Are thermal paths and dielectric thickness properly defined for metal core PCB manufacturing? 

These FAQs outline MCPCB stackup options, heat dissipation performance, insulation reliability, and production tolerances, helping ensure stable quality, cost control, and consistent delivery.

Start Your MCPCB Production Plan.

You can submit files via our Message Box for a DFM check and pricing.

Proven by 7 industries, 4000+ customer projects

Metal Core PCB

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