Summary Heavy or large-footprint components, such as large transformers, large inductors, electrolytic capacitors, heatsinks, shield cans, or board-edge connectors, can cause the risk w...

MOSFETs and PCB/SMT Integration A MOSFET is not just a “plug-and-play” component. More often than not, there are many figurations should be included, its electrical performance, therma...

Rigid-Flex PCB with multi-module interconnection structure has become a mainstream techincal option, since there are many modern electronic design is pursuing ultimate space efficiency. In this r...

In high-density interconnect (HDI) stackup design, controlled impedance in HDI boards does not just start with trace width, it is also begin with the stackup. In real-world engineering and HDI ...