8-Layer BGA PCB with VIPPO technology

8-Layer BGA PCB: High-Density Via-in-Pad (VIPPO) with Resin Filling & Capped Technology

We all make the sense that standard solder mask can't withstand the heat, leading to 'wicking' and weak BGA connections.

Compared with via cover oil and plug oil, resin plug hole and hole combination Plated caps. KnownPCB introduces the process that a 10–20μm copper layer with plated over the hole, its aim to transform a non-solderable resin-plugged surface into a functional pad. This 'capping' step restores the necessary conductivity, turning an otherwise insulating plug into a fully solderable surface for BGA mounting.

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There are also many advantages of high-density Via-in-Pad (VIPPO) with resin filling,

such as:

Enhancing Lamination Reliability: To effectively promotes vacuum elimination during the lamination process, the resin plug technology prevents surface dents caused by insufficient glue flow. It will be good to ensures the flatness and reliability of the PCB.

Fine Line Production: Regarding to characteristic impedance, the tech definitely supports the production of fine-pitch circuits and stable impedance profiles, high-density trace routing and precise fine lines, which are vital for high-speed and high-frequency signaling.

Space utilization efficiency: Thanks for the resin plug technology which makes the use of three-dimensional space more efficient.

Stacked Vias: The Via-in-Pad tech allows a great electrical connection between any layers to improves the layout flexibility of the circuit board.

Prevent impurities and corrosion: For the requirement at storage environment, complete sealing can effectively prevent the intrusion of contaminants, reduce the risk of corrosion in the through holes, and extend the service life of the PCB.