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22-layer Heavy Copper PCB for High-power DC

KnownPCB delivered a project of 22-layer heavy copper PCB for high-power DC power supply, which is the ultimate answer to complex thermal challenges. By utilizing massive 4oz inner copper weights, heavy copper layers act as integrated heat sinks to boost power efficiency.

Thanks for our superior lamination reliability. 


Learn about KnownPCB Heavy Copper PCB Solution


The design figures about the heavy copper PCB:

Core Specs of the heavy copper PCB: 22 Layers | 4oz Inner Copper | 2oz Outer

Precision Engineering: 7.87mil/7.87mil minimum trace/space


type of PCB Heavy Copper PCB with 22 layers 2 pressed and buried blind holes
PCB Dimension
36.8mm*58.4mm
PCB Surface treatment ENIG (immersion gold)
Thickness of the PCB
 5.2±0.4mm
Applications
High-power DC power module

22-layer Heavy Copper PCB for High-power DC22-layer Heavy Copper PCB for High-power DC


How Heavy Copper PCB Design Improves Electrical Performance in High-Power DC Applications

High-Quality Materials for High-Current Heavy Copper PCBs


High current is a big deal.

Without sufficient copper weight, PCB turns into an "electric blanket" in minutes.

How to make a decision on the materials?

Using Taiyao Tu865 plate, the heavy copper foil design can withstand the high voltage and high current loads of high-power DC power supplies, providing a low-resistance current channel, reducing power loss and heat generation, and maintaining good stability and reliability.

Performance Benchmark: At 20A, KnownPCB’s 3oz copper maintains a modest 58°C rise, whereas standard 1oz copper spikes to 105°C, risking component damage. Don't settle for "good enough." Choose the board designed for uninterrupted 24-hour performance.



High-Precision PCB Layout for DC Charging Stations and Power Modules

The heavy copper PCB was designed with a two-stage lamination process with resin plugging for buried/blind vias and an unsymmetrical stack-up design. The heavy copper PCB was built to a minimum copper thickness requirement of 50 μm and a 15:1 aspect ratio. Combined with high-density routing, this design, in our view, satisfies the high-power output demands of DC charging stations and improves signal stability and transmission accuracy.




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