Automotive PCB Supplier with PPAP Documentation Support

ISO 7637-2 transient & load-dump vulnerability

Reviewing input protection (TVS), filtering, grounding, and return paths

Prevents resets, latent damage, and field failures during vehicle transients

HV isolation gaps and routing in compact layouts

Validating creepage/clearance, slots/keepouts, coating strategy, CTI/material limits

Reduces arcing risk and supports functional safety and HV compliance

Partial discharge risk in HV nodes and edges

Flagging sharp copper edges, void-prone structures, spacing at HV transitions

Avoids insulation degradation that shows up after thermal cycling

Thermal hotspots in high-current paths (inverters, DC-DC, busbars)

Assessing copper weight, current density, via stitching, heat spreading and sinking paths

Prevents overheating, delamination, and accelerated aging

EMI coupling from power stages into sensing/communication

Calling out noisy return paths, switching loops, partitioning, and shielding opportunities

Improves CISPR 25 margin and reduces intermittent performance issues

Vibration-driven fatigue at connectors and heavy components

Stress-checking anchor points, pad/trace reinforcement, teardrops, stiffeners, and stackup rigidity

Reduces cracked joints and intermittent opens under vibration profiles

Corrosion susceptibility in harsh environments (salt fog, moisture)

Reviewing surface finish, edge plating needs, conformal coating coverage, and leakage paths

Prevents leakage, dendrites, and long-term reliability drift

SI integrity on automotive high-speed links (CAN FD / Ethernet)

Reviewing impedance targets, pair routing, reference continuity, skew, and stubs

Avoids late-stage link instability and EMI surprises