1. Layout

　　The layout, line width, and line spacing of printed wires and pads shall be in accordance with the provisions of the design drawings. But our company will handle the following: compensate for the line width and PAD ring width appropriately according to the process requirements, and generally increase the PAD for single panels as much as possible to enhance the reliability of customer welding.

　　When the design line spacing does not meet the process requirements (if it is too dense, it may affect performance and manufacturability), our company will make appropriate adjustments according to the pre production design specifications.

　　★ In principle, it is recommended that customers design double or multi-layer boards with a through hole (VIA) inner diameter of 0.3mm or more and an outer diameter of 0.6mm or more. The component pad should be greater than 50% of the aperture, and the minimum plate thickness to aperture ratio should be ≤ 6:1. The design of the width and spacing of the tin plate process line is above 6mil. The design of the gold plating process has a wide line width and a line spacing of over 4mil, which greatly reduces the production cycle and reduces the difficulty of manufacturing Unregistered Shenzhen ShunYiJie Technology Co., Ltd. According to the copper foil thickness requirements, the above data (line width and line spacing) should be added by at least 1.5 mils per half ounce for tin plates.

　　The minimum drilling tool is 0.3mm, and the finished hole is about 0.2mm.

　　2. Wire width tolerance: The internal control standard for the width tolerance of printed wires is ± 20%

　　3. Processing of grids

　　To avoid blistering on the copper surface during peak welding and bending of the PCB board due to thermal stress after heating, it is recommended to lay a grid on the large copper surface.

　　★ Its grid spacing is ≥ 10mil (not less than 8mil), and the grid line width is ≥ 10mil (not less than 8mil)

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