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  • New product 12L semiconductor board with blind milling

    Recently we have produced a new semiconductor board,we would like to share some pictures of our new product as below:


    image


     The character of this new product as below:


    1.12 layers with heavy copper 4oz for all layers;  

    2.The board thickness is 6.35mm; 

    3.The finishing is ENIG(Au:2u”) + Selectivity hard gold plating (Au:50u”); 

    4.This board with countersunk and blind routing design; 

    5.With Via-in-pad design, 

    6.The aspect ratio is 16:1  

    Read recommendations:

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