1. The first step is alkaline oil removal:

　　Alkaline oil removal refers to the removal of oil, finger marks, oxides and dust in the hole; The negative charge of the pore wall is changed into positive charge, which is convenient for the adsorption of colloidal palladium in the later process. Under normal circumstances, oil removal cleaning should be carried out in accordance with the rules of the circuit board factory (Shenzhen circuit board factory is also like this), and the copper backlight test is used for detection.

　　2. Micro-etching:

　　Micro-corrosion refers to remove the oxide of the plate surface, rough the plate surface, to ensure that the subsequent copper deposition layer and the substrate bottom copper combination; The new copper surface has strong flexibility and can adsorb colloidal palladium very well.

　　3. Prepreg:

　　The prepreg is mainly to protect the palladium tank from pollution, because the front tank will pollute the palladium tank, and the service life of the palladium tank will be extended after prepreg, so as to ensure the quality of our PCB board.

　　After pre-alkaline deoiling, the positively charged pore wall can effectively adsorb the negatively charged colloidal palladium particles in order to ensure the continuity, average and density of subsequent copper deposition. Therefore, alkaline oil removal and activation are very important for the quality of subsequent copper deposition.

　　5. Gluing:

　　Degumming is to remove the stannous ion coated outside the colloidal palladium particles, so that the palladium core in the colloidal particles is exposed, which can catalyze the chemical precipitation of copper reaction, according to the experience of Shenzhen circuit board factory shows that the use of fluoroboric acid as a degumming agent is a better choice.

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