Cutting: According to the requirements of engineering data MI, on the large sheet plate that meets the requirements, cut into small pieces of production plate. Small sheet material that meets customer requirements. Process: Large plate material - cut plate according to MI requirements - curium plate - beer rounded or edging - out of the plate.

　　Pressing: The pressing of the pcb four-layer board needs to go through two operations, first the inner two layers of the board after drilling, and then the outer layer and the inner layer are pressed again.

　　Drilling: According to the engineering data (customer data), drill out the desired aperture at the corresponding position on the sheet material that meets the required size. Process: Stack pin -- top board -- drilling -- bottom board -- inspection/repair.

　　Copper sinking: Copper sinking is the use of chemical methods on the insulation hole wall deposited on a thin layer of copper. Process: rough grinding -- hanging plate -- automatic copper sinking line -- lower plate -- dipping 1% dilute H2SO4-- thickening copper.

　　Graphic transfer: Graphic transfer is the transfer of the image on the production film to the board. Wet membrane processes: grinding plate, the second surface is printed the first - surface - drying - - drying - exposure - shadow - check, (dry film process) : hemp board -- - let stand - para - film exposure - let stand - shadow - check.

　　Graphic plating: plating a copper layer of required thickness and a gold-nickel or tin layer of required thickness on the exposed copper skin or hole wall of the line pattern. Process: upper, degreasing, washing twice - micro erosion - washing, pickling, copper plating, water washing, acid - tin - water - the lower.

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