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  • PCB multi -layer process process process

      

      1 process process

      The printed board of the graphic plate → acid oil removal → scanning water washing → secondary countercurrent water washing → micro -erosion → scanning water washing → secondary countercurrent water washing → copper plating pre -immersing → copper plating → scanning water washing → pre -immersion of tin plating → Tin -plated → III countercurrent water washing → lower panel

      2 Detailed process process

      2.1 Tin -plated pre -immersion

      2.1.1 Composition and operating conditions of tin -plated pre -immersion fluid

      2.1.2 The cylinder method of pre -immersing tin -plated groove

      Add half -cylinder distilled water first, then slowly immerse the 15L mass score of 98%, stir and cool down, add 1.5L Sulfotech Part A, stir well, add distilled water to 300L and stir well to use it.

      2.1.3 The maintenance and control of tin -plated pre -immersed groove liquid

      Each treatment of 100m2 plates requires 1L sulfuric acid and 100mlsulfotech part A. Whenever the slot is treated with a board of 1500m2, the slot is replaced.

      2.2 tin plating

      2.2.1 Composition and operating conditions of tin -plated solution

      2.2.2 The cylinder method of the tin -plated slot [2]

      Add distilled water to liquid level, and circulate (with 1.5A/DM2 electrolytic 2AH/L).

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