1. Substrate

　　★ FR4: Glass cloth epoxy resin copper-clad foil plate (Tg: 130 °).

　　★ CEM-1: Paper core glass cloth surface - epoxy resin copper-clad foil board.

　　★ 94V0: Flame retardant cardboard.

　　★ Aluminum substrate: Thermal conductivity coefficient of 100.

　　2. Copper foil: 99.9% or more electrolytic copper, surface copper foil thickness of finished product: 18 μ M (H/HOZ), 35 μ M (1OZ), 70 μ M (2OZ).

　　3. Plate thickness:

　　★ Thickness of single and double-sided boards: 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 2.5mm

　　The minimum thickness of multi-layer printed boards: 4 layers ≥ 0.6mm, 6 layers ≥ 1.0mm, and 8 layers ≥ 1.6mm, with a finished board thickness tolerance of ± 10%.

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