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  • multilayer pcb manufacture.PCB industry shift accelerates

    Impendacne Control PCB design

      The general trend of industrial eastward movement, the mainland region outshines. The focus of the PCB industry continues to shift to the Asian region, and the capacity of the Asian region has further transferred to the mainland, forming a new industrial pattern.

      Applications such as data centers increase the demand for HDI, and the future space for FPC is broad. Data centers are developing towards the characteristics of high speed, large capacity, cloud computing, and high performance, and the construction demand is surging, among which the demand for servers will also pull up the overall demand for HDI. The popularity of mobile electronic products such as smartphones will also drive the demand for FPC boards. In the trend of intelligent and thin mobile electronic products, the advantages of light weight, thin thickness and bending resistance of FPC will be conducive to its wide application. The demand for FPC in the display module, touch module, fingerprint recognition module, side key, power key and other plates of smart phone is increasing.

      "Raw material price increase + environmental protection inspectors" under the concentration, leading manufacturers to meet the opportunity. The price rise of raw materials such as copper foil, epoxy resin and ink in the upstream of the industry has transmitted cost pressure to PCB manufacturers, and at the same time, the central government has vigorously carried out environmental protection inspectors, implemented environmental protection policies, fought against small manufacturers with chaotic conditions, and applied cost pressure. Under the background of rising raw material prices and stricter environmental protection inspectors, the PCB industry reshuffle has brought about an increase in concentration. Small manufacturers on the downstream bargaining power is weak, it is difficult to digest upstream price increases, small and medium-sized PCB enterprises will be due to the continuous narrowing of profit margins and exit, and in this round of PCB industry reshuffle, leading companies have technology, capital advantages, is expected to expand capacity, mergers and acquisitions, product upgrades and other ways to achieve scale expansion, with its efficient production process, Excellent cost control based on the direct benefit of industry concentration. The industry is expected to return to rationality, and the industrial chain will continue to develop healthily.

      New applications are driving industry growth, and the 5G era is getting closer. 5G new communication base stations have a large demand for high-frequency circuit boards: compared with the number of millions of base stations in the 4G era, the scale of base stations in the 5G era is expected to exceed 10 million levels. The high-frequency high-speed board that meets the requirements of 5G has a wider technical barrier than traditional products, and the gross profit margin is also higher.

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