SMT process_PCBA Process Capability_Capabilities_Capabilities&Applications_KnownPCB

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PCBA Process Capability

Capabilities

PCB Process Capability PCBA Process Capability PCB Equipment PCBA Equipment

SMT process

Item			Standard Capability	Limited Capability	Remark
SMT process	PCB	Min Size	L≥30mm,W≥30mm	L<30mm,W<30mm	BOT、TOP sides components、Fiducial Mark should be≥3mm from the board edge.
		Max Size	L≤650mm,W≤400mm	L:800-650mm,W:400-450mm
		Component thickness(T)	0.5mm≤T≤3mm	T＜0.5mm T＞3mm
	Component size	Min Package	0201 (0.6mm*0.3mm)	01005 (0.3mm*0.2mm)
	QFP、QFN、SOP、SOJ	Min Pin distance	0.4mm	0.3mm≤Pitch<0.4mm
	CSP、BGA	Min Pitch distance	0.4mm	0.3mm≤Pitch<0.4mm

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DIP Process (Wave soldering)

Item			Standard Capability	Limited Capability	Remark
DIP Process (Wave soldering)	PCB size	Min Size	L≥30mm,W≥30mm	L＜30mm
		Max Size	L≤650mm,W≤400mm	L:800-650mm,W:400-450mm
		Thinnest size	0.4mm	T＜0.4mm
		Thickest size	5mm	T>5mm

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Conformal Coating Process

Item

Standard Capability

Limited Capability

Remark

Conformal Coating

Process

Technological

parameter

Temperature range

-30°C≤T≤120°C

-50°C≤T≤150°C

Coating thickness

20um≤T≤35um

35um≤T≤60um

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