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FPCB board raw materials with high heat resistance, high stability performance In the final forming products of chemical materials, PI can be used as gaskets, liners, sealing materials, bismale type materials can be used in the soft version of the multi-layer circuit circuit substrate, all aromatic materials, in the use of organic polymer materials is the highest heat resistance of the material, heat resistance temperature of up to 250~360°C! As for the bismale type PI used as a soft circuit board, the heat resistance characteristics will be slightly lower than the all-aromatic PI, generally around 200°C. bismale PI is excellent in mechanical material properties, subject to extremely low temperature changes, can maintain a highly stable state under high temperature environment, minimal creep deformation, and small thermal expansion rate! In the temperature range of -200~+250°C, the change of the material is small, in addition, bismale PI has excellent drug resistance, if 5% hydroch
① Single-sided flexible board is the lowest cost, when the electrical performance requirements are not high printed board. When wiring on one side, one side flexible plate should be selected. It has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is rolled copper foil. The insulating substrate can be polyimide, polyethylene terephthalate, arylamide fiber ester and polyvinyl chloride. The two-sided flexible plate is a conductive pattern made of a layer etched on each side of the insulating base film. Metallized holes connect the two sides of the insulating material to form a conductive path to meet the design and use of flexible functions. The covering film can protect the single and double-sided wires and indicate the position of the components. (3) Multi-layer flexible plate is to layer 3 or more layers of single-sided or double-sided flexible circuits together, through drilling holes, electrop
Process description of reverse osmosis equipment for circuit board 1, quartz sand + activated carbon + softening + security filter + reverse osmosis device + UV kill 2. Quartz sand + activated carbon + scale inhibition system + security filter + reverse osmosis device 3. Quartz sand + activated carbon + softening + security filter + primary reverse osmosis + secondary reverse osmosis + ozone sterilization 4. Flocculation settlement + quartz sand + activated carbon + scale inhibition system + security filter + reverse osmosis device 5, quartz sand + activated carbon + softening + security filter + reverse osmosis device (water production <2M3/H equipment) Characteristics of reverse osmosis equipment for circuit boards 1, reverse osmosis is at room temperature conditions, the use of no phase change physical method to make water desalination, purification. 2, water treatment relies on water pressure as a driving force, and its energy consumption is the lowest in many treatment
Five key design points of PCB circuit board 1. Have a reasonable direction Such as input/output, AC/DC, strong/weak signal, high frequency/low frequency, high voltage/low voltage, etc. Their direction should be linear (or separate) and not blend with each other. The aim is to prevent mutual interference. The best direction is in a straight line, but it is generally not easy to achieve, the most unfavorable direction is a ring, and fortunately, isolation can bring improvement. For DC, small signal, low voltage PCB design requirements can be lower. So "reasonable" is relative. 2, choose a good grounding point: the grounding point is often the most important Small ground point I do not know how many engineering and technical personnel have done much to discuss it, which shows its importance. Under normal circumstances, common points are required, such as: multiple ground lines of the forward amplifier should be joined and then connected to the main line ground, and so on. In reali
PCB sinking copper quality control method 1. Determination of chemical copper deposition rate: The use of chemical copper plating solution has certain technical requirements for copper plating rate. If the speed is too slow, it may cause holes or pinholes in the hole wall. However, if the copper deposition rate is too fast, the coating will be rough. Therefore, the scientific determination of copper sinking rate is one of the means to control the quality of copper sinking. Taking the electroless plating of thin copper provided by Schering as an example, the determination method of copper deposition rate is introduced: (1) Material: The epoxy substrate after copper corrosion is used, the size is 100×100(mm). (2) Measurement steps: A. Bake the sample at 120-140℃ for 1 hour, and then weigh W1(g) with an analytical balance; B. Corroded in 350-370 g/l of chromic anhydride and 208-228 ml/l of sulfuric acid mixture (temperature 65℃) for 10 minutes and washed with clean water; C. Treatme
Why is the circuit board required to be very flat In the automatic insertion line, if the printed board is not smooth, it will cause inaccurate positioning, and the components can not be inserted into the holes of the board and the surface mount pad, and even break the automatic insertion machine. The board on which the components are installed is bent after welding, and the component feet are difficult to cut neatly. The board can not be installed in the chassis or the socket in the machine, so the assembly plant encountered the board is also very troublesome. At present, printed boards have entered the era of surface installation and chip installation, and the requirements of assembly plants for board warping must be more and more stringent. Standard and test method for warpage According to the United States IPC-6012 (1996 edition) "Specification for Identification and Performance of Rigid Printed Boards", the maximum allowable warping and distortion for surface-mounted printed
1, engineering design: printed board design should be noted: A. The arrangement of interlayer semi-cured sheets should be symmetrical, such as six-layer plates, and the thickness between 1 ~ 2 and 5 ~ 6 layers and the number of semi-cured sheets should be consistent, otherwise it is easy to warp after lamination. B. Multi-layer core board and semi-cured sheet should be made of the same supplier. C. The line graphic area of the outer A side and B side should be as close as possible. If the A side is a large copper side, and the B side is only a few lines, the printed board is easy to warp after etching. If the line area difference between the two sides is too large, some independent grids can be added on the thin side to balance. 2. Drying plate before cutting: The purpose of drying the copper clad plate before cutting the material (150 degrees Celsius, time 8±2 hours) is to remove the moisture in the plate, while the resin in the plate is completely cured, further eliminating
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