Leading technology

1.The top number is 38 layers, the minimum line width and line distance is 3mil/3mil, the plating hole aspect ratio is 13:1, and the drill hole is 0.1mm(laser hole is 0.075mm).

2.High precision pressing positioning and hot melt and shooting technology, to ensure the processing quality of high multilayer PCB.

3.Various types of rigid flexible binding plate process structure, to meet the needs of different vehicle type products.

4.Metal base, aluminum base plate, thick copper processing technology, to ensure high heat dissipation requirements of products.

Advanced production equipment&Complete quality control system

1.ISO9001, ISO14001, AITF16949, UL, CQC quality system certification, etc

2.In strict accordance with the latest IPC standards and customer requirements of multiple control, ensure that shipped products meet customer quality requirements

3.Strictly follow IPQP,SPC,FMEA,MSA and PPAP system operation.

4.Ensure that the hole copper and surface copper meet customer requirements, electroplating special use Rohm and Haas electroplating potions, Fuji film, Hitachi dry film, sun ink, etc.