1、 Design considerations

　　When designing multi-layer circuit boards, the following points need to be noted:

　　1. Determine the number of circuit board layers and interlayer connection methods, reasonably plan the layout of signal and power layers, and avoid signal interference and power noise.

　　2. Reasonably arrange the size and layout of the circuit board to ensure its manufacturability and assemblability.

　　3. Choose appropriate line width and spacing to avoid signal crosstalk and current overload.

　　Multilayer circuit board

　　2、 Material selection considerations

　　When selecting materials for multi-layer circuit boards, the following points need to be noted:

　　1. Choose high-quality substrate materials, such as FR-4 or high-frequency materials, to ensure the stability and reliability of the circuit board.

　　2. Choose the appropriate thickness of copper foil, based on current and signal requirements, to avoid overload and signal distortion.

　　3. Select appropriate interlayer dielectric materials, such as prepregs and copper clad plates, to ensure interlayer insulation performance and signal transmission quality.

　　3、 Process control precautions

　　In the process of making multi-layer circuit boards, the following points need to be noted:

　　1. Control the process parameters of etching and copper plating to ensure the accuracy and consistency of line width and line spacing.

　　2. Control the process of interlayer connection, such as drilling and copper plating for blind and buried holes, to ensure the reliability of interlayer connection.

　　3. Control the process parameters of interlayer bonding to ensure the firmness and stability of interlayer connections.