GPUs in AI servers with an astonishing power consumption which up to kilowatts brings a opportunity to get creative in a whole new era, from interconnections to materials, design, and manufacturing.

Let’s view the rethinking how we create boards.

• Technical Breakthroughs: Interconnection Density and precision

From 4-Step to Any-Layer HDI meets the demands in tighter impedance and denser routing, the pushing motherboard of NVIDIA’s H100 over 20 layers is as symbol of technical challenge.

KNOWNPCB have been actually experimenting on exploring multi-layer HDI tech hard, the processing of drilling, LDI imaging, sequential lamination is all part of our toolkit.

Across the industry, there are some notable projects:

1.     Stacked microvias: 28-layer, 6-step HDI with 0.8mm staked microvias, routing density up 40% to previous generations.

2.     Precision: Any-Layer HDI with ±2 μm precision LDI, which supports complicated AI boards and package.

KNOWNPCB does comparable work in High-end GPUs designed in data center, gaming and mid-range, which have a power up to 700 watts to 1000watts. 

• Material Development for 112 Gbps

Remarkable transmission speeds are hitting 112 Gbps PAM4, the speed rate have been applied in wide range of applications, such as advanced packaging solution, 3D printed electronics,5G/6G telecommunications infrastructure.

We have a strong relationship with Panasonic, Isola, Rogers that make sure every AI board with a stable performance in low-loss dielectric and dimension.

The processing to perform stably after multiple lamination:

1. Ultra-low-loss      dielectrics (Dk ~3.2–3.5, Df < 0.005)

2. Copper-foil      treatments processing from HVLP to RTF to reduce insertion loss.

• The balance at Heat, Power and Structure

It is intense that the heat in GUP areas can get to 150 W/cm². The simulation-driven is designed to a cooler board, cleaner signals. 

KNOWNPCB’s solution:

1. 3+2+3 hybrid stackups with embedded copper for thermal      conduction efficiently

2. Thermal + SI co-simulation with ANSYS Icepak and SIwave

3. Controlled back-drill to keep STUBs under 4 mil for clean 112      Gbps channels

• Smart manufacturing in a digital way:

Precision isn’t simply a buzzword at KNOWNPCB, it is built into the procedure.

Data-driven precision:

1. The temperature control to ±0.5°C, thickness within 3%

2. Automated optical alignment with ±8 μm layer registration

3. Plasma cleaning reducing via roughness to 0.8 μm

Supported by:

1. Pulse plating to keep microvia copper uniform

2. Flying-probe + boundary scan testing with 98.5% coverage

3. SPC tracking 127 parameters in real time

Adding AOI and hybrid inspection assessment helped us improve 6-step HDI returns from 93.2% to 97.8% within 3 months.

KNOWNPCB as a China HDI PCB manufacturer with 17-year-experience has been improve the capacity to transform the design requirement in density, precision, cost, quality. KNOWNPCB serves High Density Interconnection PCB to variety of industry, a wide application of smartphones and consumer electronics, which has full size display, ultra-thin form factors, powerful CPUs or GPUs)

As the trends of automotive intelligence and electrification that lead In-vehicle central control displays, millimeter-wave radar modules, GPS modules, power control units etc required high-performance, highly reliable PCBs. HDI PC board satisfied the demand for integrated signal and decreased space. 

Further introduction about industry solution in 

1.    Medical Devices (Endoscopes, portable ultrasound devices, cardiac monitors, high-tech imaging equipment (e.g., modules in CT and MRI machines)

2.    High-Performance Computing & Communication Equipment (Data center servers, high-speed network routers, 5G base station antenna units (AAU), optical modules)

Please contact us to require case study or PCB data.

Operations Center

Add: Bldg D,Liantangkeng Industrial Area,Qianjin Road,Xixiang Street,Bao'an Dist.,Shenzhen City,Guangdong Province,518102,China.

Tel: +86 755 2794 4155

Fax: +86 755 2794 4159

E-mail: sales@knownpcb.com