1. The less bending the leads between the pins of high-speed electronic devices, the better. It is best to use full straight leads for high-frequency circuit wiring, and if a bend is needed, a 45 degree bend or arc bend can be used. This requirement is only used to improve the bonding strength of copper foil in low-frequency circuits, while in high-frequency circuits, meeting this requirement can reduce the external emission and mutual coupling of high-frequency signals.

　　2. The less interlayer alternation between the pins of high-frequency circuit devices, the better. The so-called "less interlayer alternation of the leads, the better" refers to the use of fewer via (Via) during the component connection process. A through-hole can bring about a distributed capacitance of about 0.5pF, reducing the number of through-holes can significantly improve speed and reduce the possibility of data errors.

　　3. The shorter the lead between the pins of high-frequency circuit devices, the better. The radiation intensity of the signal is proportional to the length of the signal line. The longer the high-frequency signal lead, the easier it is to couple to the components close to it. Therefore, for high-frequency signal lines such as clock, crystal oscillator, DDR data, LVDS line, USB line, HDMI line, etc., it is required to have as short as possible as possible.

　　4. Pay attention to the "crosstalk" introduced by signal lines running parallel at close distances. For high-frequency circuit wiring, pay attention to the "crosstalk" introduced by signal lines running parallel at close distances. Crosstalk refers to the coupling phenomenon between signal lines that are not directly connected. Due to the fact that high-frequency signals are transmitted along transmission lines in the form of electromagnetic waves, the signal lines act as antennas, and the energy of the electromagnetic field is emitted around the transmission lines. The unwanted noise signals generated by the coupling of electromagnetic fields between signals are called crosstalk. The parameters of the PCB circuit board layer, the spacing between signal lines, the electrical characteristics of the driver and receiver ends, and the termination method of signal lines all have a certain impact on crosstalk.

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