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Metal Core PCB(MCPCB)

-- for SMEs Needing Serious Thermal Dissipation IATF 16949 Certified MCPCB Fabrication In China Since 2008

Whether you require standard aluminum core or high-power copper base boards for MOSFET arrays, our process ensures high dielectric strength

 (> 3.0  KV) and reliable high-current paths.

What are MC(Metal Core) PCBs?

PCB with an aluminium or copper core used primarily for high-power LED and power driver thermal management.

  1. Qualification, Materials & Compliance Overview
  2. The Advantages of MC PCB

Qualification, Materials & Compliance Overview

Acceptance Standards

Manufactured to IPC-6012 guidelines adapted for metal-based boards and OEM-specific thermal test requirements.


Material Standards

Metal base (Al or Cu), thermally conductive dielectric layer, copper foil; all materials traceable and UL-recognized where needed.


Structure Overview

Typically single-sided or limited multilayer build on a metal core, with thermal vias and direct heat path to chassis or heatsink.


Compliance

Supports RoHS / REACH, UL marking, and relevant safety and insulation requirements for lighting and power equipment.


KnownPCB Prototyping & Mass Production Service Request Thermal Design Review

The Advantages of MC PCB

(Metal Core Printed Circuit Board)

Reliable for continuous high-power operation when CTE and dielectric quality are controlled.

  • 01 Metal core provides a stable heat path away from devices;
  • 02 Good adhesion and void-free dielectric are critical under thermal cycling;
  • 03 Often used in long-life lighting and outdoor equipment.

More expensive than standard FR-4, but often cheaper than complex heat-sink assemblies.

  • 01 Aluminium or copper core increases base cost;
  • 02 Can remove separate heat sinks, thermal pads and mounting hardware;
  • 03 Simplifies mechanical design in thermally dominated applications.


Performance is driven by thermal capacity rather than routing density.

  • 01 Short conduction path from device to core and chassis improves junction temperature;
  • 02 Allows LEDs and power devices to run at higher power within safe limits;
  • 03 Best suited to relatively simple layouts for lighting and power modules.

KnownPCB Prototyping & Mass Production Service Request Thermal Design Review

IATF 16949 Certified MCPCB Fabrication

In China Since 2008


We consistently deliver MCPCB with high performance by utilizing premium dielectric layers with high thermal conductivity (k> 2.0W/m.K), minimizing thermal resistance (Rth). 


Thermal problems are usually structural, not schematic. 

These parameters focus on core material, dielectric thickness, thermal conductivity, and breakdown limits—so you can evaluate whether an MCPCB can manage heat, voltage, and mechanical mounting before finalizing LED or power-module layouts.


KnownPCB Profile Ask for DFM Guideline



Metal Core PCB(MCPCB)
  1. 01Metal Core PCB (MCPCB) Layer/Complexity Mapping Matrix
Parameter BASIC (Single-layer Aluminum MCPCB) ADVANCED (High-thermal Aluminum MCPCB) HIGH-END (Copper Core / Multilayer MCPCB) Typical Use Case Classification Logic
Layer Count Single layer Single / Dual layer Dual-layer / Multilayer + localized thermal structures Evaluating thermal path & routing space Layer Count / Structure
Metal Core Material Standard aluminum High-thermal-conductivity aluminum alloy Copper core / Specialty metal core LED / Power module material selection Material / Structure
Thermal Conductivity (k) 1.0–3.0 W/m·K 2.0–8.0 W/m·K 3.0–10.0+ W/m·K Thermal dissipation capability Material / Process
Dielectric Thickness 75–100 µm 50–75 µm ≤50 µm (down to 25 µm) Balancing thermal resistance & dielectric breakdown Material / Process
Copper Foil Thickness 1–3 oz 1–3 oz 2–4 oz High-current traces Material / Process
Surface Finish HASL / OSP ENIG / OSP ENIG / Hard Gold / Selective plating Solder joint reliability & connector durability Material / Process
Board Thickness 0.8–1.6 mm 1.0–2.0 mm 1.5–3.0 mm (incl. copper core) Structural strength & heatsink attachment Structure / Mechanical
Mechanical Accuracy / Tolerances Standard tolerances Enhanced dimensional control High-precision profiling + slotting Mechanical assembly & heatsink fit Mechanical / Process
Dielectric Breakdown Voltage 500–1,000 V 1,000–2,000 V >2,000 V High-voltage LED drivers / Power supplies Functional / Performance
Operating Temperature –20 to 85 °C –40 to 105 °C –40 to 125 / 150 °C Automotive lighting / Industrial / New energy Functional / Performance
Thermal Cycling Life Standard grade Mid-grade Automotive/Industrial-grade cycling life Long-term reliability Functional / Performance
Service Tier MCPCB BASIC MCPCB ADV MCPCB PRO Quick selection by application & power level Tier / Capability
Standard Lead Time 3–10 days 3–10 days 5–20 days Project scheduling Lead Time / Planning
Localized Heavy-copper Regions Not supported / Limited Localized copper thickening (selective) Embedded copper blocks / Complex localized copper structures High-power hotspot design Material / Process
Slotting / Thermal Windows Simple mechanical slots Polygon thermal windows Complex CNC machining / Recessed cavities Heatsink bonding & insulation clearance Mechanical / Process

Industry-specific

PCB Solutions

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FAQs

Are thermal paths and dielectric thickness properly defined for metal core PCB manufacturing? 

These FAQs outline MCPCB stackup options, heat dissipation performance, insulation reliability, and production tolerances, helping ensure stable quality, cost control, and consistent delivery.

Start Your MCPCB Production Plan.

You can submit files via our Message Box for a DFM check and pricing.

Proven by 7 industries, 4000+ customer projects

Metal Core PCB(MCPCB)

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