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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
KnownPCB will attend Global Sourcing Electronics Exhibition in AsiaWorld-Expo,HongKong on Apr.11-14,2024.The address is at Asia Expo, Hongkong Asia expo, Booth No.: 11P12.We sincerely invite you to visit our Booth 11P12 in HK then.
Water-based cleaning process is based on water as the cleaning medium, in order to improve the cleaning effect, a small amount of surfactants, washing additives, corrosion inhibitors and other chemicals can be added to the water (the general content is 2%-10%). And can be in accordance with the specific situation of different nature of pollution on the printed circuit board, in the water-based cleaning agent additives, so that the scope of application of cleaning is wider. Water-based cleaning agent has a good dissolution effect on water-soluble dirt, and then with heating, brushing, spraying, ultrasonic cleaning and other physical cleaning means, can achieve better cleaning effect. The addition of surfactant to the water-based cleaning agent can greatly reduce the surface tension of water, strengthen the penetration and spreading ability of the water-based cleaning agent, and better penetrate into the gap between the closely arranged electronic components, and clean the dirt that
1. Dimensional stability of incoming substrate materials, especially the dimensional consistency between each laminating CYCLE of the supplier; Even if the dimensional stability of different cycles of the substrate of the same specification is within the specification requirements, due to the poor consistency between them, the graphic size of the subsequent mass production of the plate is out of line due to the difference between different batches of plate materials after the first plate trial production has determined a reasonable inner layer compensation. At the same time, there is a material anomaly that the board is found to shrink in the process of the outer pattern transfer to the shape process; In the production process, it was found that the width of the panel and the length of the shipping unit had a serious contraction in relation to the outer pattern transfer ratio during the pre-shape processing data measurement process, and the ratio reached 3.6mil/10inch. The specific
Step 1 Drill holes The design of the through hole aperture below 8mil, the hole spacing is close, plus each board about 500,000 to 1.2 million blind holes, the hole deviation and plugging of the through hole, and the perforation of the perforation will affect the PCB yield. Drilling machine needs to be maintained according to the regulations, the use of appropriate aluminum sheet and drill nozzle, in the production of new materials engineers to confirm the rationality of the operation parameters: number of sheets, tool parameters, etc. The amount of dust suction of the drilling machine needs to meet the standard, and the drilling needle has space for debris removal is also crucial. The pass shape and aperture, dielectric thickness, material and laser energy of the laser are very important, and it is necessary to set the best operating conditions. Step 2: Electroplating Electroplated copper carries the functions of current conduction and signal transmission, and the electroplating
Printed circuit board manufacturing industry more and more need high aspect ratio, small hole printed circuit board plating process. It is the driving force to promote the development of high-level multi-layer printed circuit board manufacturing technology. Because of the reliability of the hole coating, it plays a key role in the use of printed circuit boards. How to ensure the problem of high aspect ratio deep hole plating is the scientific and technological task of all printed circuit workers, and it is the most important problem that must be faced. To this end, many research departments began to carry out planned research and development. There are many methods reported from the current scientific and technological data, including pulse plating technology, chemical vapor deposition technology, solution impact plating technology, full electroless copper plating technology and improved (high acid and low copper) air stirring technology. This part of the technology is introduced a
1, in the case of mastering the operation technology of the digital programming instrument, first load the film and the drilling test plate, measure the length and width of the two deformation, in the digital programming instrument according to the size of the deformation of the hole to lengthen or shorten the hole, with the drilling test plate after lengthening or shortening the hole to match the deformed film, eliminating the tedious work of splicing the film, to ensure the integrity and accuracy of the graph. This method is called "changing hole position method". 2, in view of the physical phenomenon that the negative changes with the change of ambient temperature and humidity, the negative in the sealed bag is taken out before the copy of the negative, and the working environment conditions are hung for 4-8 hours, so that the negative is deformed before the copy, so that the deformation of the negative after the copy is very small, called this method "hanging method". 3. For
1. Splicing method: Applicable: The line is not too dense, the film deformation of each layer is inconsistent; It is especially suitable for the deformation of solder resistance plate and multilayer plate power formation plate. Not applicable: film with high wire density, line width and spacing less than 0.2mm; Note: When splicing, the wire should be damaged as little as possible, and the welding pad should not be damaged. When splicing copy after revision, attention should be paid to the correctness of the connection relationship. 2, change the hole position method: Application: All layers of film deformation is consistent. This method also applies to film with dense lines; Not applicable: film deformation is not uniform, local deformation is particularly serious. Note: After using the programmer to lengthen or shorten the hole position, the out-of-tolerance hole position should be reset. 3, hanging method: Applicable; Film that has not been deformed and is protected from
1, engineering production -- light painting machine, film exposure machine 2, opening - opening machine, baking plate oven 3, laminating - brown production line, laminating machine, grinding machine 4, drilling -- CNC drilling machine 5, grinding board -- grinding machine 6, Metallized hole (PTH)-- chemical copper production line (copper wire) 7, graphics transfer - film machine, UV exposure machine or LDI 8, graphic plating - plating production line 9, dry (wet) film - film production line 10, graphic etching ---- etching production line 11, welding resistance layer production -- screen printing machine, UV exposure machine or LDI 12, baking and curing ---- oven, tunnel oven 13, surface treatment --OSP production line or chemical nickel gold line, chemical nickel palladium gold line 14, molding -- punching machine or CNC gong machine, cutting machine 15. Test -- Electric Measuring machine, AOI, 3DAOI. 4, the plate is scratched during the transfer process: a, the ha
1, hot air smoothing (spray tin) Hot air smoothing, also known as hot air solder smoothing (commonly known as spray tin), it is the process of coating molten tin (lead) solder on the surface of the PCB and heating compressed air to smooth (blow), so that it forms a coating layer that is resistant to copper oxidation and can provide good solderability. During hot air conditioning, a copper-tin metal intermetallic compound is formed at the joint of solder and copper. PCB for hot air finishing usually to sink in the molten solder; The air knife blows out the liquid solder before it solidifies; The air knife minimizes the meniscus of solder on the copper surface and prevents solder bridging. 2, organic weldability protectant (OSP) OSP is a process for printed circuit board (PCB) copper foil surface treatment in accordance with the requirements of the RoHS directive. OSP is short for Organic Solderability Preservatives, also known as organic solderability preservatives, also known as
Improvement method: 1, the copper clad plate in the warehouse before IQC must be random inspection, check whether the surface of the board scratches the substrate phenomenon, if there should be timely contact with the supplier, according to the actual situation, make appropriate treatment. 2, the copper clad plate is scratched during the opening process, the main reason is that there are hard objects on the surface of the opening machine, and the friction between the copper clad plate and the objects causes the copper foil scratch to form the phenomenon of exposing the substrate, so the table must be carefully cleaned before the opening of the material to ensure that the table is smooth and there is no hard objects. 3, the copper clad plate is scratched by the drill when drilling, the main reason is that the spindle clip is worn, or the debris in the clip is not clean, the drill is not firmly grasped, the drill does not go to the top, the length of the drill is slightly longer t
RO4000 Laminates RO4350B Cavity Opening BoardRo4350B material, cavity opening at L1-L2&L6-L5, 4mil bonding pad.Details: Cavity from Top Layer to L2. L2 has exposed pads with ENEPlG Plating for Wire Bonding.Cavity from Bottom Layer to L5. L5 has exposed pads with ENEPIG Plating for Wire Bonding.The 2 cavities are symmetric with each other.
PCB ink is mainly divided into three lines, solder resistance, character ink three categories. The line ink is used as a barrier layer to prevent corrosion of the line, and the line is protected when etched, which is generally liquid sensitive type. There are two kinds of acid corrosion resistance and alkaline corrosion resistance, alkali resistance is more expensive, this layer of ink should be dissolved with alkali after corrosion of the line. Solder resistance ink is applied to the line after the line is done to protect the line. There are liquid photosensitive and heat curing, as well as ultraviolet hardening type, the pad is retained on the board, which is convenient for welding components and plays the role of insulation and oxidation prevention. Character ink is used to mark the surface of the board, such as marking the component symbol, which is generally white. In fact, there are other inks, such as: strippable adhesive ink, which is to protect the part that does not nee
According to the actual experience of the use of ink by most manufacturers, the use of ink must be carried out in accordance with the following provisions: 1, in any case, the temperature of the ink must be kept below 20-25 ° C, the temperature change can not be too large, otherwise it will affect the viscosity of the ink and screen printing quality and effect. Especially when the ink is stored outdoors or at different temperatures, it must be placed at the ambient temperature for a few days or the appropriate operating temperature must be reached in the ink bucket before use. This is because the use of cold ink will cause screen printing failure, causing unnecessary trouble. Therefore, to maintain the quality of the ink, it is best to store or store under normal temperature process conditions. 2, before use, the ink must be fully and carefully manually or mechanically stirred evenly. If the ink enters the air, use it to stand for a period of time. If dilution is required, it is
1. Viscosity and thixotropy In the printed circuit board manufacturing process, screen printing is one of the indispensable important processes. In order to obtain the fidelity of image reproduction, the ink must have good viscosity and suitable thixotropy. The so-called viscosity is the internal friction of the liquid, which means that under the action of external forces, one layer of liquid slides on another layer of liquid, and the friction exerted by the inner layer of liquid. The inner layer of the thick liquid has greater mechanical resistance to sliding, and the thinner liquid has less resistance. The unit of viscosity measurement is poisons. In particular, it should be noted that temperature has a significant effect on viscosity. Thixotropy is a physical property of liquid, that is, the viscosity of the liquid decreases in the state of agitation, and quickly recovers its original viscosity after standing. By stirring, the thixotropic effect lasts long enough for its inter
I. The backlight is unstable, and the hole wall is without copper 1. The composition of chemical copper working liquid is out of control or the process conditions are out of control 2. The adjuster is missing or invalid 3. Low activator component or temperature 4. Overspeed 5. Different plates, to drill dirt is too strong 6. The inner layer of the hole wall is broken or peeled off when drilling So how do circuit board manufacturers improve it? 1. The composition and process conditions of the whole working liquid, especially increasing the content of HCHO, appropriately increasing the temperature or reducing the addition of components containing stabilizers, improve the activity of the working liquid. 2. Add or replace the regulator at normal temperature 3. Add activator and increase the temperature 4. Reduce the concentration of accelerant or immersion time 5. Appropriately reduce the decontamination strength, and improve the activity of activator and chemical copper solu
In the process of circuit board manufacturing, what is the copper sinking process of pcb in circuit board factory? And the major circuit board manufacturers are a kind of production process? That's the whole process of sinking copper? Let's take a closer look. In the production process of the circuit board factory, the copper is called plating through the hole, that is, chemical plating copper. In the PCB production process of Shenzhen Circuit Board Factory copper deposition this process requires a chemical reaction, usually abbreviated as PTH, is a self-catalytic REDOX reaction. Generally, double panels or multi-layer boards are sunk after drilling. The role of copper sinking is mainly to connect the circuit, in the non-conductive hole wall substrate, the use of chemical method - chemical copper, because there are electroplated copper behind, copper sinking is to make a base for the copper plating behind, our Shenzhen circuit board factory in the production of PCB process are ve
1. The first step is alkaline oil removal: Alkaline oil removal refers to the removal of oil, finger marks, oxides and dust in the hole; The negative charge of the pore wall is changed into positive charge, which is convenient for the adsorption of colloidal palladium in the later process. Under normal circumstances, oil removal cleaning should be carried out in accordance with the rules of the circuit board factory (Shenzhen circuit board factory is also like this), and the copper backlight test is used for detection. 2. Micro-etching: Micro-corrosion refers to remove the oxide of the plate surface, rough the plate surface, to ensure that the subsequent copper deposition layer and the substrate bottom copper combination; The new copper surface has strong flexibility and can adsorb colloidal palladium very well. 3. Prepreg: The prepreg is mainly to protect the palladium tank from pollution, because the front tank will pollute the palladium tank, and the service life of the pal
The staff of the enterprise often turn a blind eye to many problems, or think that it is harmless, or think that it cannot be changed. There are also many managers who tend to turn a blind eye to intuitive information and focus only on numbers. As a result, it may slip through the cracks, ignore some key clues, and fail to truly understand the true state of the enterprise. As a customer, you should go to the supplier's site to understand its cost composition, production efficiency, quality control. As a supplier, we should go to the customer's site to understand its production process in order to better serve customers. As a peer, if you have the opportunity to visit other circuit board factories, it is also a very good opportunity to learn, compare and reference. Enterprise operation is a big system, all links are closely related and affect each other. For production-oriented enterprises, through any details of the scene, you can know the micro. Any big problem can be found at the
1, PCB wire welding This method does not require any connectors, as long as the external connection point on the PCB printed board is welded directly with the components or other components outside the board. For example, the speaker in the radio, the battery box, etc. Circuit board interconnection welding should pay attention to: (1) The welding pad of the welding wire should be as far as possible on the edge of the PCB printed board, and arranged according to a unified size to facilitate welding and maintenance. (2) In order to improve the mechanical strength of the wire connection and avoid pulling the solder pad or printed wire off due to the pull of the wire, drill holes near the solder joints on the PCB printed board, let the wire pass through the hole from the welded surface of the printed board, and then insert the solder pad hole from the component surface for welding. (3) Arrange or bundle the wire neatly, and fix it with the board through the wire card or other fast
1. Check and remove the debris adhering to the semi-cured sheet; 2. Check the inner plate: and ensure that there is no debris adhering to it; Our operators do a good job in the laminate positioning template (also known as the press template positioning pin) tooling, templates, and buffer paper before the plate. Whether it is a senior circuit board manufacturer or our operator, according to the performance of the semi-cured sheet used, the relevant temperature setting size provisions: Tg<135t, the maximum temperature setting range is 160-185t; Tg>160t, the maximum temperature setting range is 170-205t. The next step is the pressure of lamination: it squeezes the air between the plates and speeds up the flow of resin to fill the space between the shapes. - Generally, the setting of pressure is divided into four stages: ① Pre-pressure section: drive volatiles and residual gases, so that the layer is closely combined. Precompression is the key of lamination. ② Medium pressure se
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