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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
For some customers, pcb sampling production design is seriously non-standard, it is impossible to distinguish which is pad and which is via usage, sometimes conductive holes are processed with pad, sometimes key holes are processed with via, the design is confused, resulting in increased errors, according to incomplete statistics of Jialicom, the problems caused by non-standard design account for more than 50% of customer complaints. And for the current situation of the circuit board, some of the processing of Philin engineers, because the customer design documents are not standardized, and make mistakes, help customers modify the document, the non-standard design, with their own experience to deal with engineering data, which leads to and contributes to the customer's design is not standardized, Jialicang once again stated that the last time you do the right, does not mean that your file is right! All engineers must pay attention to the design standards and specifications! Jialich
An ordinary pcb board proofing production line needs more than 20 million yuan, multi-layer boards need to invest 50 million yuan, and HDI needs to invest more than 200 million yuan. Due to the huge industry, the division of labor is very fine, there are single-station process outsourcing specializing in drilling, etc., and low-grade products are oversupplied. HDI and other high-end printed circuit board industry is a capital, labor-intensive industry, management and technical requirements are relatively high, often become the bottleneck of capacity expansion. Glass fiber yarn: glass fiber yarn processing by silica sand and other raw materials in the kiln calcined into liquid, through the PCB through the very small alloy nozzle to draw very fine glass fiber, and then hundreds of glass fiber twisted into glass fiber yarn. Kiln construction investment is huge, for the capital intensive industry, 30,000 tons of kiln needs 400 million yuan, the new kiln needs 18 months, the business
Many customers believe that after a hole is broken, the film temperature and pressure should be increased to enhance its adhesion. However, this view is not correct because the solvent in the corrosion resistant layer evaporates excessively when the temperature and pressure are too high, making the dry film brittle and thin. During development, it is very easy to break the hole. We always need to maintain the toughness of the dry film. Therefore, after a hole is broken, we can improve it from the following points: 1. Reduce film temperature and pressure 2. Improve drilling edge 3. Increase exposure energy 4. Reduce development pressure 5. After applying the film, the parking time should not be too long to avoid causing the semi fluid like drug film at the corner to diffuse and thin under pressure 6. During the film application process, do not tension the dry film too tightly
Copper coating, that is, the idle space on the PCB is used as the base level, and then filled with solid copper, these copper areas are also called copper filling. The significance of copper coating is to reduce the ground impedance and improve the anti-interference ability. Reduce voltage drop, improve power efficiency; Also, connect to the ground wire to reduce the area of the loop. If there are many PCB places, such as SGND, AGND, GND, etc., how to cover copper? My approach is that according to the different positions of the PCB board, the most important "ground" is used as a benchmark reference to independently cover copper, and digital and analog copper are separated from each other. At the same time, before coating copper, first bold the corresponding power cable: V5.0V, V3.6V, V3.3V(SD card power supply), and so on. In this way, multiple deformation structures of different shapes are formed. The copper coating needs to deal with several problems: one is the single point con
1, 3 points above the line, try to make the line through each point, easy to test, the line length as short as possible. 2, try not to put wires between pins, especially between and around integrated circuit pins. 3, the lines between different layers should not be parallel as far as possible, so as not to form an actual capacitor. 4, the wiring is as straight as possible, or 45 degree line, to avoid electromagnetic radiation. 5, ground wire, power cord at least 10-15mil above (for logic circuit). 6. Try to connect the ground polysemy lines together and increase the ground area. Line to line as neatly as possible. 7, pay attention to the uniform emission of components, so as to install, plug-in, welding operation. The text is discharged in the current character layer, the position is reasonable, pay attention to the orientation, avoid being blocked, easy to produce.
1, choose a reasonable wire width Since the impact interference caused by the transient current on the printed line is mainly caused by the inductive component of the printed wire, the inductance of the printed wire should be minimized. The inductance of the printed wire is proportional to its length and inversely proportional to its width, so a short and fine wire is advantageous for suppressing interference. Signal lines for clock leads, line drivers, or bus drivers often carry large transient currents, and printed wires should be as short as possible. For discrete component circuits, when the width of the printed wire is about 1.5mm, the requirements can be fully met; For integrated circuits, the printed wire width can be selected between 0.2 and 1.0mm. 2, use the correct wiring strategy The use of equal wiring can reduce the inductance of the wire, but the mutual inductance and distributed capacitance between the wires increase, if the layout allows, it is best to use a well
As the carrier of various components and the hub of circuit signal transmission, PCB has become the most important and critical part of electronic information products, and its quality and reliability level determine the quality and reliability of the whole equipment. With the miniaturization of electronic information products and the environmental requirements of lead-free and halogen-free, PCB has also developed in the direction of high density, high Tg and environmental protection. However, due to cost and technical reasons, PCB has a large number of failure problems in the production and application process, and therefore caused a lot of quality disputes. In order to find out the cause of the failure in order to find a solution to the problem and distinguish the responsibility, it is necessary to carry out failure analysis on the failure cases. To obtain the exact cause or mechanism of PCB failure or failure, it is necessary to follow the basic principles and analysis process,
The general trend of industrial eastward movement, the mainland region outshines. The focus of the PCB industry continues to shift to the Asian region, and the capacity of the Asian region has further transferred to the mainland, forming a new industrial pattern. Applications such as data centers increase the demand for HDI, and the future space for FPC is broad. Data centers are developing towards the characteristics of high speed, large capacity, cloud computing, and high performance, and the construction demand is surging, among which the demand for servers will also pull up the overall demand for HDI. The popularity of mobile electronic products such as smartphones will also drive the demand for FPC boards. In the trend of intelligent and thin mobile electronic products, the advantages of light weight, thin thickness and bending resistance of FPC will be conducive to its wide application. The demand for FPC in the display module, touch module, fingerprint recognition module, sid
1) Single panel: This type of panel is usually used in the case of lower cost requirements. In layout design, sometimes components are needed or jumper wires are used to skip the circuit board's wiring. If there are too many, you should consider using dual panels. 2) Dual panel: Dual panel can be used or not to use PTH. Because PTH boards are expensive, they are only used when the complexity and density of the circuit require them. In general, the choice between a single panel or a dual panel must meet the most efficient cost utilization. As a rule of thumb, the cost of a double-sided printed board with plated through holes is 5-10 times that of a single panel. Similarly, the cost of assembling components is also an important aspect to consider, the cost of assembling a single-sided printed circuit board component (manual) is about 25%-50% of the cost of the circuit board, and the cost of assembling a double-sided printed circuit board component with PTH is 15%-30% of its cost.
Automatic optical inspection (AOI) systems are commonly used to test the inner layer before the formation of layers. After stratification, X-ray systems monitor alignment accuracy and minor defects; A scanning laser system provides a way to detect the layer before reflow. These systems, along with line visual inspection technology and component integrity testing for automatically placed components, help ensure the reliability of the final assembly and welded plates. However, even if these efforts minimize defects, the final inspection of the assembled printed circuit board is still required, which is perhaps the most important, as it is the final unit for product and overall process evaluation. The final inspection of the assembled PCB board may be done by an active method or by an automated system, and often both methods are used together. Manual "means that an operator uses optical instruments to visually inspect the board and make a correct judgment about the gap. Automated sy
Automatic optical inspection (AOI) systems are commonly used to test the inner layer before the formation of layers. After stratification, X-ray systems monitor alignment accuracy and minor defects; A scanning laser system provides a way to detect the layer before reflow. These systems, along with line visual inspection technology and component integrity testing for automatically placed components, help ensure the reliability of the final assembly and welded plates. However, even if these efforts minimize defects, the final inspection of the assembled printed circuit board is still required, which is perhaps the most important, as it is the final unit for product and overall process evaluation. The final inspection of the assembled PCB board may be done by an active method or by an automated system, and often both methods are used together. Manual "means that an operator uses optical instruments to visually inspect the board and make a correct judgment about the gap. Automated sy
1, engineering design line width compensation: due to the thick copper, the line width must be compensated, otherwise the line width is too poor after etching, the customer is not accepted, the line width compensation value must experience stacking. 2, the uniformity of print resistance welding: due to the ultra-normal copper thickness of the line after graphic etching, print resistance welding is very difficult, skip printing, too thick and too thin customers do not bear. How to print this layer of green oil is also one of the difficulties. 3. Etching: The line width after etching must meet the needs of customer drawings. The residual copper is not allowed, nor can the knife be scraped away, the knife will scratch the insulation layer, resulting in sparks and leakage in the voltage test. 4, mechanical processing: aluminum substrate drilling can be, but the drilling hole inside the hole edge is not allowed to have any burrs, which will affect the pressure test. Milling shape is
1. It has the characteristics of small signal transmission loss, short transmission delay time and small signal transmission distortion. 2. Excellent dielectric properties (mainly: low relative dielectric constant Dk, low dielectric loss factor Df). Moreover, this dielectric property (Dk, Df) can maintain its stability under environmental changes in frequency, humidity, and temperature. 3. High precision control with characteristic impedance (Zo). 4. Excellent heat resistance (Tg), processability and adaptability. Based on the above characteristics, high-frequency PCB boards are widely used in wireless antennas, base station receiving antennas, power amplifiers, components (shitters, confluence, filters), radar systems, navigation systems and other communication equipment. Multi-layer high frequency plate design, based on cost savings, improving bending strength, electromagnetic interference control and other factors, often in the form of hybrid plate, called high frequency hy
1. Welding materials 1) The solder usually adopts Sn60 or Sn63 solder that meets the general standard of the United States, or adopts HL-SnPb39 type tin lead solder. 2) The flux can usually be rosin flux or water-soluble flux, the latter is generally only used for wave soldering. 3) The cleaning agent should ensure that the PCB board is non-corrosive and pollution-free, generally using anhydrous ethanol (industrial alcohol), trichlorotrifluoroethane, isopropanol (IPA), aviation washing gasoline and deionized water and other cleaning agents for cleaning. The specific cleaning agent used should be selected according to the process requirements. 2. Welding tools and equipment 1) The reasonable selection of the power and type of soldering iron has a direct relationship to improving welding quality and efficiency. It is recommended to use low-voltage temperature-controlled electric soldering iron, the soldering iron head can be nickel plated, iron plated or copper material, the sha
The minimum width of the printed wire is related to the size of the current flowing through the wire: the line width is too small, the resistance of the just-printed wire is large, the voltage drop on the line is large, affecting the performance of the circuit, the line width is too wide, the wiring density is not high, the board area increases, in addition to increasing the cost, it is not conducive to miniaturization. If the current load is calculated at 20A/ mm2, when the thickness of the copper clad foil is 0.5MM,(generally so much,) the current load of 1MM(about 40MIL) line width is 1A, Therefore, the line width of 1--2.54MM(40--100MIL) can meet the general application requirements, the ground wire and power supply on the high-power equipment board, according to the power size, can be appropriately increased line width, and in the low-power digital circuit, in order to improve the wiring density, the minimum line width of 0.254--1.27MM(10--15MIL) can be full Full. Same circui
With the development of electronic products in the direction of "light, thin, short, and small", PCBs have also developed to high density and high difficulty. Therefore, a large number of SMT and BGA PCBs have appeared, and customers require plugging when mounting components, mainly including Five functions: (1) Prevent the tin from passing through the via hole to the component surface and cause a short circuit when the PCB is wave soldered; especially when we put the via on the BGA pad, we should first make the plug hole and then gold-plated, which is convenient for BGA welding. (2) Avoid flux residue in the via; (3) After the surface mounting and component assembly of the electronics factory are completed, the PCB must be vacuumed on the testing machine to form a negative pressure to complete: (four) to prevent surface solder paste from flowing into the hole, causing false soldering, affecting placement; (5) Prevent the solder balls from popping up during wave soldering, cau
The high frequency board application such as 5G, routers, bluetooth headsets and other products that require fast signal transmission frequency. KnownPCB engaged in varies high frequency material, such as RO4003C, RO4350B,RO3006,RO5880....etc. The following is the DK value for reference. It is our big advantage in new material and high technology update.We can provide a variety of different types boards to meet your needs. No matter prototype 1pcs or mass production. Contact us now for further more info.
1) Double-head ultraviolet drilling system; 2) Double-head CO2 laser drilling system; 3) Hybrid laser drilling system (CO2 and UV). Such drilling systems in all HDI PCB board fabrication processes have their own advantages and disadvantages. Laser drilling systems can be simply divided into two types, two-bit single-wavelength systems and two-bit dual-wavelength systems. Regardless of the type, there are two main components that affect the ability to drill: 1) Laser energy/pulse energy; 2) Beam positioning system. The energy of the laser pulse and the transmission efficiency of the beam determine the drilling time, which refers to the time for the laser drilling machine to drill a micro-through hole, and the beam positioning system determines the speed of movement between the two holes. These factors together determine the laser drilling mechanism for the given requirements of the micro-hole speed. The dual-head UV laser system is best suited for drilling holes smalle
When we open the keyboard of a general-purpose computer, we see a soft film (flexible insulating substrate) printed with a silver-white (silver paste) conductive pattern and a health pattern. Because of the general screen printing method to obtain this pattern, we call this printed circuit board flexible silver paste printed circuit board. And we go to the computer city to see a variety of computer host board, graphics cards, network cards, modems, sound cards and household appliances on the printed circuit board is different. The substrate used is made of paper base (usually used for single side) or glass cloth base (often used for double side and multi-layer), pre-pregassed phenolic or epoxy resin, one or both surface layers are glued to a copper-coated sheet and then laminate and cure. This circuit board covered with copper sheet plate, we call it a rigid plate. Then made into a printed circuit board, we call it a rigid printed circuit board. Single-sided printed circuit graphic
1. Poor wear resistance, the wear resistance said here is not the wear resistance of metal materials, which refers to the PCB surface ink in use will often be worn off causing blurring, fading and so on. 2. Aesthetic requirements, the appearance of the metal surface printing feels relatively low-end, which is not suitable for some products with relatively high appearance requirements, such as commemorative badges, metal business cards, exquisite company promotional nameplates, handicraft description nameplates, etc., which cannot meet their appearance requirements. 3. Ordinary printing process requires the use of organic solvents and heavy metal elements and other chemical raw materials, these substances have certain toxicity and will cause personal injury to the screen printing staff, in addition, the drying process of screen printing ink, volatile chemical raw materials gradually volatilized into the air, causing pollution to the air and the environment. Compared with traditio
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