+86 755 2794 4155 
sales@knownpcb.com
Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
1. Substrate processing problems, for some thinner pcb substrates, due to poor rigidity of the substrate, it is not appropriate to use the brush machine to brush the board, and attention should be paid to control the solid production and processing, so as not to cause the poor bonding force between the substrate copper foil and chemical copper caused by the board bubbling. 2. The surface of the plate in the machining (drilling, laminating, milling, etc.) process caused by oil, or other liquids contaminated with dust pollution surface, will cause the surface foaming phenomenon. 3. The copper brush plate is bad, the grinding plate pressure is too large before copper sinking, resulting in hole deformation, so that the hole foaming phenomenon will be caused in the process of copper plating and tin-spraying welding. 4. Washing problem, due to copper plating to go through a large number of chemical solution treatment, all kinds of acid and alkali inorganic, organic and other drug solv
Cutting: According to the requirements of engineering data MI, on the large sheet plate that meets the requirements, cut into small pieces of production plate. Small sheet material that meets customer requirements. Process: Large plate material - cut plate according to MI requirements - curium plate - beer rounded or edging - out of the plate. Pressing: The pressing of the pcb four-layer board needs to go through two operations, first the inner two layers of the board after drilling, and then the outer layer and the inner layer are pressed again. Drilling: According to the engineering data (customer data), drill out the desired aperture at the corresponding position on the sheet material that meets the required size. Process: Stack pin -- top board -- drilling -- bottom board -- inspection/repair. Copper sinking: Copper sinking is the use of chemical methods on the insulation hole wall deposited on a thin layer of copper. Process: rough grinding -- hanging plate -- automatic coppe
1, the line width is wider than the fine line: because there is a fine line limit in the manufacturing process, the width is not limited. Adjusting the line width to adjust the impedance at a later stage and reach the limit can be cumbersome, which increases the cost or relaxes the impedance control. 2, there is an overall trend: there may be multiple impedance control targets in the design, so the overall size is too large or too small, and there is no need to be out of sync. 3, consider the residual copper rate and glue flow: when one or both sides of the prepreg are etched lines, during the pressing process, the glue will fill the etching gap, so the glue thickness time between the two layers is reduced. If the residual copper rate and glue flow rate are not calculated correctly, and the dielectric coefficient of the new material is not consistent with the nominal value, signal integrity problems may occur. 4, specify the glass cloth and glue content: different glue content o
Through hole (VIA), this is a common hole used for conducting or connecting copper foil lines between conductive patterns in different layers of the circuit board. Such as (e.g., blind holes, buried holes), but can not insert the component lead leg or other reinforcement material copper plated holes. Because the PCB is formed by the accumulation of many copper foil layers, each layer of copper foil will be covered with a layer of insulation layer, so that the copper foil layer can not communicate with each other, and the link of its signal depends on the through hole (via), so there is the title of the Chinese through hole. The characteristic is: in order to meet the needs of customers, the through hole of the circuit board must be strengthened, so that in changing the traditional aluminum plug process, the circuit board surface welding and plug hole are completed with white mesh, so that the production is stable, the quality is reliable, and the use is more perfect. The through h
The content of copper sulfate in each analysis in the production is low, originally divided once a week, and now in the case of excessive consumption, it is divided every day, and copper sulfate has decreased every day, originally controlled in 60-80g/L, but just added the day before, and the next day less 6-7G, I wonder why copper sulfate consumption is so large. Subsequently, according to the production volume to follow up, according to the production capacity of each shift is about 30 square meters, about 60 square meters a day, the copper consumption is about 21KG a day, a large slot of copper ball is about 1400KG, according to the production needs to consume 21KG a day, so, according to the theory, the copper ball must be added every week 147KG. After two weeks of observation, the copper ball was not replenished in time in production, and it must be replenished every week, but now it is only replenished once every two weeks. After analysis and observation, it is found that the
The so-called copper coating is to use the idle space on the PCB as the base level, and then fill with solid copper, these copper areas are also known as copper filling. The significance of copper coating is to reduce the ground impedance and improve the anti-interference ability. Reduce voltage drop, improve power efficiency; Connected with the ground wire, the loop area can also be reduced. Key words: Copper coating as an important part of PCB design, whether it is domestic Qingyufeng PCB design software, but also some foreign Protel, PowerPCB provides intelligent copper coating function, then how to apply copper, I will share some of my ideas with you, hope to bring benefits to peers. The so-called copper coating is to use the idle space on the PCB as the base level, and then fill with solid copper, these copper areas are also known as copper filling. The significance of copper coating is to reduce the ground impedance and improve the anti-interference ability. Reduce voltage
It has been said that there are only two types of electronics engineers in the world: those who have experienced electromagnetic interference and those who have not. With the increase of PCB routing, electromagnetic compatibility design is an issue that we electronic engineers have to consider. Faced with a design, there are five important attributes to consider when conducting an EMC analysis of a product and design: (1) Key device size: the physical size of the emitting device that produces radiation. The radio frequency (RF) current will generate an electromagnetic field, which will leak out of the housing through the housing. The line length on the PCB as a transmission path has a direct impact on the RF current. (2) Impedance matching: the impedance of the source and receiver, and the transmission impedance between the two. (3) The temporal nature of the interference signal: whether the problem is a continuous (periodic signal) event, or only exists in a specific operating
1, it is mentioned above that ordinary electrolytic copper foil is galvanized or copper-plated products, if the peak value of the wool foil production is abnormal, or galvanized/copper plating, the coating crystal branch is bad, resulting in the peel strength of the copper foil itself is not enough, the bad foil pressing board is made of PCB plug-in in the electronics factory, the copper wire will fall off by external impact. This kind of bad copper stripping copper wire to see the copper foil surface (that is, the contact surface with the substrate) will not be obvious side corrosion, but the peeling strength of the whole copper foil will be very poor. 2, poor adaptability of copper foil and resin: some special properties of laminates now used, such as HTg sheet, because the resin system is not the same, the curing agent used is generally PN resin, resin molecular chain structure is simple, the degree of cross-linking is low when curing, is bound to use special peak copper foil and
Operation Center: Room 306-309,Bldg D,Liantangkeng Industrial Area,Qianjin Road,Xixiang Street,Bao'an Dist.,Shenzhen City,Guangdong Province,518102,China.
Tel: +86 755 2794 4155
Fax: +86 755 2794 4159
E-mail: sales@knownpcb.com
Appointment Experience
EN
CN
Home > 
