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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
1、 PCB circuit board process elements: 1. Excessive etching of copper foil. The electrolytic copper foil used in the market is generally single-sided galvanized (commonly known as ashing foil) and single-sided copper plating (commonly known as reddening foil). The common copper throwing is generally galvanized copper foil with a thickness of 70um or more, while reddening foil and ashing foil with a thickness of 18um or less have not shown batch copper throwing. 2. During the PCB process, local collisions occurred, causing the copper wire to detach from the substrate due to external mechanical forces. This defect manifests as poor positioning or directionality, with significant twisting of dropped copper wires or scratches/impact marks in the same direction. Peel off the defective copper wire and observe the rough surface of the copper foil. It can be seen that the color of the rough surface of the copper foil is normal, and there will be no side corrosion defects. The peeling stre
The update and iteration of electronic products are relatively fast, and the development efforts are also increasing. The demand for PCB board making is also gradually growing, and the market share is constantly expanding. With the increasing process requirements and information speed of electronic products, PCB board making is rising rapidly. So, after designing the PCB, what are the relevant parameters and explanations of demand and supply when outsourcing the PCB? Below, the editor will explain them in detail. Relevant parameters and clarification of PCB sample demand and supply 1. Information: The first thing to clarify is what kind of PCB manufacturing materials are required. Currently, the most common one is using FR4, and the main information is epoxy resin peeled fiber cloth board. 2. Board layer: To clarify the number of layers you use to make a PCB. 3. Is it a single piece shipment or a demand for panel shipment? If panel shipment is required, the number of panels nee
1. The thickness of the board is 0.8, 1.0, 1.2, 1.6, 2.0, which are commonly used specifications. If there are no special requirements, choose a board thickness of 1.6mm. 2. Copper foil thickness: 0.5, 1.0, 2.0 are commonly used specifications. If the power is not particularly high, it is not necessary to choose a board. Manufacturers usually use a board with a power of 0.5oz. If the power is around 100W, a board with a power of 1.0 or above will be used. 3. The colors for solder mask: green, black, red, and white are commonly used. If there are no specific requirements, green should be used. If you are using it for your own experiment, you should use green even more because this color is the clearest for circuit boards. 4. Solder pad treatment: sinking gold, anti oxidation, tin spraying (divided into lead and lead-free), generally choose the latter two, and the preservation time of tin spraying will be longer. 5. Screen printing colors: White and black are commonly used colo
The volume of electronic products is becoming increasingly thin and short, and directly stacking holes on through blind holes is a design method to achieve high-density interconnection. To do a good job of stacking holes, the first step is to ensure the flatness of the hole bottom. There are several production methods, and the electroplating hole filling process is one of the representative ones. Next, let the PCB engineer teach you about the PCB electroplating hole filling process. 1. Advantages of electroplated hole filling: (1) Beneficial for designing stacked holes and holes on the disc; (2) Improving electrical performance helps with high-frequency design; (3) Helps to dissipate heat; (4) Plug holes and electrical interconnections are completed in one step; (5) The blind hole is filled with electroplated copper, which has higher reliability and better conductivity than conductive adhesive. 2. Physical impact parameters The physical parameters that need to be studied in
Dry film is a polymer material that can block electroplating and etching functions. Its reaction principle is to polymerize through ultraviolet radiation, producing stable substances attached to the board surface. It is a widely used consumer material in the microelectronics industry and circuit board manufacturing industry. Today, the editor of CITIC China PCB will talk to you about the types of PCB dry films. 1. Single sided PCB The substrate material is mainly composed of paper phenol copper laminated board (paper phenol as the bottom, covered with copper foil) and paper epoxy resin copper laminated board. Most of them are used in household appliances such as radios, AV appliances, heaters, refrigerators, washing machines, as well as commercial machines such as printers, vending machines, circuit breakers, and electronic components, with the advantage of low prices. 2. Double sided PCB The substrate material is mainly Glass-Epoxy copper laminated board, GlassComposite (glass
In order to save production costs, almost every PCB factory performs panel assembly operations before orders enter the workshop. Splicing boards is not just about putting various small boards together into one big board, but there are many things to pay attention to and important principles. Today, let the editor of Zhongxinhua summarize with everyone~ Firstly, there is the issue of splicing, and the reason for this is to save production costs. To avoid unnecessary waste, splicing treatment will be carried out before production on the circuit board production line without affecting the circuit board. For PCB panel width ≤ 260mm~300mm, it varies depending on the production line. Because we may have many materials and each material gun corresponds to a module in our own processing equipment, if the splicing exceeds the range of the module, the processing speed will become very slow. The outer frame (clamping edge) of the PCB panel should be carefully considered to ensure that the
Rigid flexible combination board is a method of laminating a flexible circuit substrate and a rigid circuit substrate together, which has both the rigidity of a hard board and the flexibility of a soft board. So, what issues should be paid attention to when making rigid flexible composite boards? 1. The design of rigid flexible composite plates usually changes from rigidity to flexibility, and then to rigidity. The rigid region generally has more layers than the flexible region, and the material is transferred from FR-4 to polyimide in the transition region. When intersection occurs, the overlap between rigid and flexible materials needs to keep the holes away from the transition area to maintain integrity. In addition, many rigid and flexible designs incorporate reinforcing materials such as stainless steel or aluminum to provide additional support for connectors and components. 2. Flexible circuits have bent wires that can affect wiring. Due to possible material stress, it is n
Industrial circuit board damage usually refers to a component being damaged, possibly a chip, a capacitor, or even a small resistor. The repair process involves identifying and replacing the damaged component. 1. Resistors with small resistance values and capacitors with large capacity are prone to damage A resistor with a small resistance value is often used in power supply lines to limit current, which acts as a fuse. If the current is too high, it will first burn out. In addition, many ground capacitors are used in power supply lines for filtering, and their size and capacity are generally large. If the voltage or current is unstable, the capacitors will break down and cause leakage. 2. Fault characteristics and maintenance of capacitor damage The failure caused by capacitor damage is the highest in electronic devices, with electrolytic capacitor damage being the most common. Capacitor damage is manifested as: 1. reduced capacity; 2. Complete loss of capacity; 3. Leakage; 4
PCB design is an important step before PCB production. If not designed well, it will directly affect the performance and quality of the circuit board, causing the entire circuit board to be scrapped; Layout of components is an important aspect of PCB design. So, what are the requirements for PCB design and layout of components? 1. Aesthetics When designing a PCB, it is not only important to consider the orderly placement of components, but also to consider the graceful and smooth wiring. 2. Force The circuit board should be able to withstand various external forces and vibrations during installation and operation: it should have a reasonable shape, and the positions of various holes on the board should be arranged reasonably; Generally, the distance between the hole and the board edge should be at least greater than the diameter of the hole; It should also be noted that the weakest section of the plate caused by irregular holes should also have sufficient bending strength. 3.
1. Judging the strength level of circuit board manufacturers: Effective PCB sampling before production can also provide a clear understanding of the strength of circuit board manufacturers, especially those who have not cooperated with them before. By sampling, the strength level of circuit board manufacturers in production can be determined. Only circuit board manufacturers with comparable capabilities and the ability to process circuit boards that meet standard technical requirements can be determined, To better meet the requirements of long-term cooperation and high-quality processing and production of PCB boards. 2. Reduce the defect rate in batch production of PCB circuit boards: The processing and production volume of PCB boards are relatively large. In order to ensure smooth mass production without quality problems and reduce defect rates, it is very necessary to conduct circuit board sampling processing before production. The processing of PCB boards requires complex proce
1: When adjusting the mold, please try to use the operation manual instead of relying solely on intuition for operation; 2: Before drilling, check whether the clutch, brake, slider and other parts are normal, whether the operating mechanism is reliable, and confirm all data before performing drilling operations; 3: Several sets of pressure plates and T-head pressure plate screws should be prepared for use corresponding to the mold. The front end of the pressure plate should not contact the straight wall of the lower mold. A piece of sand cloth should be placed between each contact surface, and the screws must be tightened; 4: In order to improve the punching performance of the substrate, the paper substrate should be preheated, with a preferred temperature of 70-90 ℃; 5: Select a punch (including model and tonnage) based on the calculated punching pressure, mold size, and closing height according to the mold design; 6: The gasket under the mold is usually 2 pieces, which must
1. Good basic quality/good application effect: The performance of the beloved multi-layer circuit board in terms of basic quality is reassuring, and the direct manifestation is that the electronic products made from it, such as electronic watches, computers, military equipment, etc., are in excellent use. The multi-layer circuit board can excellently complete the interconnection between various electrical components, The quality and texture of high-quality multi-layer boards are evident in various application environments. 2. Outstanding quality/high durability: Users have also found that good multi-layer circuit boards exhibit extremely strong durability, which means they exhibit strong adaptability in various places, including sports facilities. The performance durability and vibration resistance of multi-layer circuit boards are very reassuring. The manufacturing capacity of multi-layer circuit boards is also constantly optimized with the continuous innovation of technology.
The process of processing PCB multilayer boards is very complex, as it is in the process of laminated boards. The total thickness and number of layers of PCB multilayer boards are limited by the characteristics of the PCB board, and the variety of boards with different thicknesses that special boards can provide is generally limited. Therefore, designers must consider the characteristics of the board and the limitations of the PCB multilayer board processing technology in the PCB multilayer board design process Processing PCB multi-layer board lamination refers to the process of bonding each layer of circuit board into a whole. The process includes: kiss pressing, full pressing, and cold pressing (to quickly cool the circuit board and maintain size stability). During the kiss pressing stage, resin infiltrates the bonding surface and fills the gaps in the circuit, and then enters full pressing to bond all the gaps. The first thing to pay attention to when laminating PCB multilayer b
1. Design PCB, create punching files, lay copper plates on both sides of the PCB, then polish the copper plates on both sides for CNC drilling, and inspect for defects after polishing and drying. 2. Main process through hole: To complete the hole, the hole should be sorted and standardized. After confirming that there are no defects in the hole through water washing, drying, and other procedures, black holes should be made to prepare for copper plating through the hole. Next, through holes should be drilled and dried (to ensure sufficient black space, water washing and drying should be performed twice). After completion, copper plating can be carried out. After copper plating, polishing should be carried out, and the hole should be checked again for defects. 3. Production process: apply photosensitive blue oil - dry ink - apply bottom and top line film, and position properly - expose and develop appropriately - wash and dry with water - check for defects in the circuit - tin plat
1. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc. 2. Power supply equipment: switch regulators, DC/AC converters, SW regulators, etc. 3. Communication electronic equipment: high-frequency amplifier, filtering device, and transmitting circuit. 4. Office automation equipment: electric motor drivers, etc. 5. Automobile: electronic regulators, igniters, power controllers, etc. 6. Computer: CPU board, floppy disk drive, power supply device, etc. 7. Power module: inverter, solid-state relay, rectifier bridge, etc.
a) Ma Keng: Ma Keng is the result of organic pollution. A large pit usually indicates oil pollution. If the stirring is poor, the bubbles cannot be expelled, which will form pits. Wetting agents can be used to reduce its impact. We usually refer to small pitting as pinholes. Poor pre-treatment, metallic impurities, low boric acid content, and low plating temperature can all cause pinholes. Maintenance and process control of the plating solution are crucial, and anti pinhole agents should be used as process stabilizers to supplement. b) Roughness and burrs: Roughness indicates that the solution is dirty, which can be corrected by sufficient filtration (high pH can easily form hydroxide precipitates and should be controlled). If the current density is too high, impurities are brought in by impure anode mud and added water, and in severe cases, roughness and burrs will be produced. c) Low adhesion: If the copper coating is not fully oxidized, the coating will peel off and the adhesi
1、 Dry film mask with perforation Many customers believe that after a hole is broken, the film temperature and pressure should be increased to enhance its adhesion. However, this view is not correct because the solvent in the corrosion resistant layer evaporates excessively when the temperature and pressure are too high, making the dry film brittle and thin, making it easy to break through during development. We always need to maintain the toughness of the dry film. Therefore, after a hole is broken, we can improve it from the following points: 1. Reduce film temperature and pressure 2. Improve drilling edge 3. Increase exposure energy 4. Reduce development pressure 5. After applying the film, the parking time should not be too long to avoid causing the semi fluid like drug film at the corner to diffuse and thin under pressure 6. During the film application process, do not tension the dry film too tightly 2、 Penetration occurs during dry film electroplating The reason for
Conducting hole (VIA) is a common type of hole used to conduct or connect copper foil circuits between conductive patterns in different layers of a circuit board. For example, blind holes or buried holes, but cannot be inserted into copper plated holes of component leads or other reinforcement materials. Because PCBs are formed by stacking and accumulating many layers of copper foil, an insulation layer is laid between each layer of copper foil, so the copper foil layers cannot communicate with each other, and their signal connections rely on through holes (via), hence the Chinese name for through holes. The characteristic is that in order to meet the needs of customers, the conductive holes on the circuit board need to be plugged. This changes the traditional aluminum sheet plugging process by using white mesh to complete the circuit board surface solder mask and plug holes, making it stable in production, reliable in quality, and more perfect in use. Conducting holes mainly serv
1. Report the results of the work The leader who lifts the heavy weight is the favorite. When reporting work, please remember to report the result to the leader first, and the result thinking is the first thinking. 2. Ask for work plan Please ensure that at least two programs are given to leaders, and express their views and effective suggestions. Don't let the leader do the quiz questions, but let the leader do the multiple-choice questions. Don't ask the leader how to do this thing, what to do, but ask, I have a plan, you can listen to it and see how it goes! 3. Summarize the work process and find three points To do a work summary, it is necessary to describe the process, not only to have a clear sequence and logic, but also to find out the key points, mistakes, and reflection points in the process. 4. Arrange work standards and clarify customer requirements Layout work must be clear about customer requirements and quality standards, otherwise subordinates will not know how
After the customer's plug-in test, it is found that the via hole (via hole) is not connected. The test can be carried out normally before the plug-in, and the appearance has no drilling deviation phenomenon, which is mainly caused by the following five reasons: First: the hole copper is not enough; Second: the roughness of the hole wall is too large Third: Drilling dust plug holes Fourth: drilling broken knife to make up holes Fifth: poor solder mask plug hole In terms of controlling the problem of through-hole failure, the hole copper is the most important link. The automatic sinking copper line of our Honglian circuit is not small: Detection: The detection method of immersion copper wire is mainly backlight series detection. The number of series is more than 9 to be qualified to ensure the quality of copper immersion and hole formation. The detection methods include deposition speed force detection (copper layer thickness in standard time); glue removal speed force (this
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