With great enthusiasm, we welcome the 2024 Munich Electronics Show in Germany, which is a large-scale and world-leading exhibition. It fully displays the rapidly developing electronic technology, allowing leading companies to showcase forward-looking innovations and expand/maintain their global networks.

As an excellent PCB/PCBA manufacturer, KnownPCB met with you at booth C6.230/5.
At the exhibition, many old friends came to support us, and had in-depth face-to-face communication on the latest progress of the project and future cooperation plans.
At the same time, we met many new friends, and made professional suggestions from the perspective of customers, laying a solid foundation for future cooperation.

In the communication with new and old customers at the booth, we deeply felt their diverse demands for PCB products. This is exactly the opportunity for us to show our strength.

For deeper technical discussions, feel free to reach out to KnownPCB.

	Multilayers with via in PAD technics 18 Layers with via in PAD,  inner layers w/s:2.5/2.5mils  outer layers w/s:3/3mils  holes to tracks only 6.5mils		Multi-panel HDI boards  10 layers rigid-fexible pcbs Material:It180+R-F777+FR0110  ENIG:3U"
	Burn-in boards 20 Layers;  Board thickness: 3.4mm; FR4, TG250,  Min.fnishing hole diameter: 0.25mm;  Countersunk holes;  Aspect ratio:13.6:1		High frequency boards Ro4003C,2-6U" immersion Gold Flash over 2-10U" of Electroless Palladium over 120-240U" of Electroless Nickel Electroless Palladium lmmersion Gold（ENEPIG）

In the communication with customers, we have collected valuable feedback and expectations, and we understand that continuous product improvement is crucial, and improving process capabilities is the key.  Next, we present the PCB future process capability development table.