KnownPCB, Shenzhen

Cost-effective HDI PCB Circuit Board Factory

Serving US and North American OEMs under NDA-backed intellectual property protection.

What are HDI PCBs?

High-density interconnect board (or multilayer HDI PCBs) with fine line/space, microvias, and via-in-pad for fine-pitch BGAs. 

1. Qualification Materials & Compliance Overview
2. The Advantage of HDI

Qualification Materials & Compliance Overview Acceptance Standards These materials were tested according to IPC-6012 criteria as well as internal HDI criteria such as microvia reliability testing, thermal cycling tests and IIR thermal cycling simulation. Material Standards HDI-capable FR-4 or low-loss materials with controlled CTE; laser-drillable, via-fill compatible dielectrics. Structure Overview Sequential build-up layers with stacked or staggered microvias, blind/buried vias and via-in-pad connections. Compliance Designed to meet RoHS / REACH, UL recognition, and OEM-specific HDI design rules for long-term reliability.

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The Advantage of HDI (High-density interconnect)

Reliable for fine-pitch and high-density designs when microvia rules are respected.

• 01 Laser drilling, via filling and stacking must stay within a tight process window.
• 02 Reduced via length lowers risk of barrel cracking.
• 03 Requires supplier with proven HDI reliability data (IST / thermal cycling).

Higher bare-board price, optimized for dense layouts and small form factors. 01 laser drilling, via fill and fine lines/space add process cost 02 smaller outline and reduced layer count can offset cost in compact products 03 good choice when miniaturisation or BGA pitch makes standard multilayer inefficient.
	Strong interconnect quality for high-speed and high-pin-count devices. 01 Microvias enable dense BGA fan-out and short interconnects; 02 Fewer stubs and fewer layer transitions improve eye diagrams; 03 Suitable for DDR, PCle. SerDes and complex SoC boards.

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HDI PCB manufacturer for

Fine-pitch BGA and high-speed CPU/SoC boards

HDI fabrication demands sub-mil micron precision for interconnects.  We achieve this using LDl lmaging for fine-line circuitry and Laser Drilling for microvias. Critical tolayer stacking is the X-Ray Alignment System, ensuring precise registration before Sequential Lamination. Every layer is confirmed via AOI Inspection to guarantee reliability and density. KnownPCB Profile Ask for Key Design Consideration Guideline

FAQs

These FAQs are designed to support PCB layout and hardware engineers throughout the entire project lifecycle—from early-stage design clarification and manufacturability questions to production delivery, inspection standards, and storage conditions. KnownPCB acts as a factory consultant, helping you balance cost, lead time, and quality consistency at every stage.

For deeper technical discussions, feel free to reach out to KnownPCB.