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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
The so-called PCB sampling actually refers to the trial production of printed circuit boards before mass production, which is the process of electronic engineers designing circuits and completing PCBs, and PCB manufacturers conducting small-scale trial production. After the sample testing is completed, mass production will be carried out. There are two methods for sampling, one is a legitimate PCB factory, and the other is a professional sampling company. PCB sampling generally includes two groups, one is the engineer group, and the other is the PCB sampling manufacturer. As a team of engineers, attention should be paid to the following aspects when making samples: 1. Only by carefully selecting the sample size can we effectively control costs. 2. Confirm the packaging of the equipment to avoid packaging errors that may lead to sample failure. 3. Conduct comprehensive electrical testing to improve the electrical performance of the PCB board. 4. Complete signal integrity layout, re
In recent years, Pcb liquid medicine has gradually shifted from being environmentally friendly to being environmentally friendly. The government has increased its punishment efforts, and the industry and PCB manufacturers or suppliers have begun to pay close attention to environmental issues. Environmentally friendly chemical solutions emit less exhaust gas, wastewater, and waste, making them easy to handle, creating a friendly working environment, and providing more protection for workers' physical health. For example, in the field of porous metals, in recent years, more and more PCB companies have chosen organic conductive film direct electroplating. This metallization process does not emit formaldehyde gas, which not only greatly improves the working environment, but also has no complex wastewater and simple treatment methods, greatly saving water and electricity, and reducing operating costs. Wise individuals in the PCB industry have begun to call for the innovation of PCB ma
What is the thermal design in PCB processing? What aspects do we need to understand this problem from? The use range of thermocouple temperature measurement is very wide, and the problems encountered are also diverse. Therefore, this chapter can only cover several important aspects of thermocouple temperature measurement. Thermocouples are still one of the main means of temperature measurement in many industries, especially in the steelmaking and petrochemical industries. However, with the advancement of electronics, the application of resistance thermometers in industry has become increasingly widespread, and thermocouples are no longer the only and most important industrial thermometers. The practical application of thermoelectric phenomena is, of course, the use of thermocouples to measure temperature. The complex relationship between electron energy and scattering results in different thermoelectric potentials of different metals. Since a thermocouple is such a device, the dif
1： The development of electronic components, the development of integrated circuits - IC, and the diverse use of semiconductor materials; 2： Electronic products pursue miniaturization, and the original perforated inserts cannot meet the requirements; 3： The revolution in electronic technology is indeed necessary to pursue international trends. 4： SMT processing has a more complete function in electronic products, and the integrated circuits currently used - ICs - no longer have perforated inserts, especially large-scale and highly integrated ICs that have to use surface mount technology; 5： PCB sampling, mass production, automation, and production enterprises strive to improve product quality and reduce production costs in order to improve their competitiveness and meet customer needs;
What are some issues to pay attention to in the appearance method of PCB processing? Here are a few points for everyone to have a more comprehensive understanding of some issues related to PCB processing. Understanding these issues clearly is believed that everyone will also gain more knowledge in the field of processing: 1： When adjusting the mold, try to use manual operation instead of manual operation. 2： Start the punching machine and conduct a comprehensive inspection to ensure that all parts, including the clutch, brake, slider, etc., are functioning properly, the operating mechanism is reliable, and there is no continuous punching phenomenon. 3： Prepare several sets of pressure plates and T-head pressure plate screws for use with the mold. The front end of the pressing plate should not touch the straight wall of the lower mold. Sandcloth should be placed between the contact surfaces, and the screws must be tightened. 4： To improve the punching performance of the substrat
What do we need to know about some passive components in SMT processing? Here you can have a comprehensive understanding of these aspects: 1： Inductor: The ability of a coil to store energy in a magnetic field is called an inductor, and this coil is called an inductor. The main function of inductors is to prevent interference from electromagnetic waves and filter noise in the current. They are widely used, but the technology and scale of chip inductors produced in China are still insufficient, and there is no professional manufacturer of inductors. Resistor: The function of a resistor is to regulate the voltage and current in a circuit, which can be divided into three categories based on material and product packaging. 2： Capacitor: When two conductive substances are separated by a medium and used to store potential static electricity, it is called a capacitor. There are various types of capacitors, which can be divided into more than 30 types based on the materials used. Domest
As usual, paying attention to some details can eliminate unwanted situations, such as misprints of solder paste and removal of solidified solder paste from the board. Our goal is to deposit an appropriate amount of solder paste at the desired location. Dirty tools, dry solder paste, and misalignment between the template and the board can all cause unwanted solder paste on the bottom surface of the template or even on the assembly. During the printing process, wipe the template according to a certain pattern between printing cycles. Ensure that the template is located on the solder pad, not on the solder mask layer, to ensure a clean solder paste printing process. Online and real-time solder paste inspection and pre reflow inspection after component installation are both helpful process steps for reducing process defects before welding occurs. For fine-pitch templates, if the thin template cross-section is bent and causes damage between pins, it can cause solder paste to deposit bet
Nowadays, more and more electronic companies are starting to provide personalized PCB board sampling and customization services. There is no fixed range of prices, and prices need to be determined based on the size, quantity, process, special process, delivery time, packaging type, etc. of the circuit board you need to customize. So, how can so many PCB personalized customization companies find a suitable PCB personalized customization company for themselves? This article will explain to you from 8 aspects. Customer Experience A good reputation is the primary factor for us to refer to when choosing personalized customized services for PCB sampling. When selecting a manufacturer for multi-layer PCB board sampling, we can first search for relevant information and information about the manufacturer at the internet level. Manufacturers with their own official website are definitely trustworthy. Only a website is not enough, but it also depends on whether the website has updates on co
In daily life, the composition of various electronic devices inevitably requires the use of PCB circuit boards. PCB sampling is a provider of electrical connections for electronic components. According to different product design and usage requirements, PCB sampling can also be divided into single-layer boards, double-layer boards, and multi-layer boards. Multilayer boards are currently the most commonly used type of PCB. So what are the application advantages of multi-layer PCB board sampling? Below, the quick technician will organize and introduce for everyone. The application advantages of multi-layer PCB circuit boards: 1. High assembly density, small size, and light weight meet the needs of miniaturization of electronic equipment; 2. Due to the high assembly density, the wiring between various components (including components) is reduced, installation is simple, and reliability is high; 3. Due to the repeatability and consistency of graphics, errors in wiring and assembly a
Reflow soldering is a very important process in SMT chip processing, which involves combining the chip components with the solder pads on the circuit board at high temperatures and then cooling them together, greatly affecting the stability of the circuit board. In reflow soldering, some process defects are also prone to occur, and the reasons need to be analyzed and targeted solutions are needed to ensure product quality. Below, the quick technician will mainly organize and introduce the common defects and cause analysis of SMT reflow soldering for everyone. 1、 Tin bead Reason: 1. The silk screen holes are not aligned with the solder pads, and the printing is not accurate, causing solder paste to stain the PCB. 2. Solder paste is exposed too much in an oxidizing environment and absorbs too much water from the air. 3. Heating is inaccurate, too slow and uneven. 4. The heating rate is too fast and the preheating interval is too long. 5. The solder paste dries too quickly. 6.
Firstly, the application prospects of microcircuit boards in the field of smartphones are very broad. Nowadays, smartphones have become an essential communication tool in people's lives. The application of micro circuit boards has made smartphones more intelligent and multifunctional. The small size and high integration of microcircuit boards enable smartphones to have stronger computing power and richer functions, such as facial recognition, fingerprint recognition, virtual reality, and so on. Moreover, the rapid development of micro circuit boards has also brought about improvements in the performance and price of smartphones, allowing more people to enjoy the convenience and fun brought by smartphones. Secondly, the application prospects of micro circuit boards in the field of smart homes are also very broad. With the improvement of people's living standards, the requirements for living environment are also increasing. Smart home, as an emerging way of life, is gradually bein
Firstly, one of the difficulties in designing and manufacturing high-frequency high-speed boards is ensuring signal integrity. Due to the transmission characteristics of high-frequency signals, the requirements for signal integrity are very high. Once the signal experiences attenuation, interference, or distortion, it will lead to a decrease in system performance or even malfunction. The key to solving the problem of signal integrity is to choose materials, wiring, and grounding methods reasonably, and conduct strict signal integrity simulation and testing. Secondly, the design and production of high-frequency high-speed boards also face challenges in terms of high-frequency characteristics and electromagnetic compatibility. In the transmission of high-frequency and high-speed signals, electromagnetic wave radiation and interference will become a serious problem. In order to improve electromagnetic compatibility, it is necessary to design and layout devices, pins, and ground wir
Firstly, a challenge in the design of switch PCB circuit boards is the issue of signal interference. On PCB boards, the generation and transmission of high-speed signals can generate a significant amount of electromagnetic radiation and mutual inductance. And these radiation and mutual inductance can interfere with other signals, leading to a decrease in communication signal quality. To solve this problem, we can adopt the following strategies: first, reasonably plan the routing of signal and power lines, and minimize the possibility of crossing each other; Secondly, reasonable layout and use of shielding covers and other measures to reduce the propagation of signal interference; Finally, design the grounding wire and shielding ground reasonably to improve the continuity and shielding effect of the grounding wire. Another difficulty in the design of switch PCB circuit boards is the transmission of high-speed signals. Due to the high frequency of high-speed signals in switches, p
In the design and manufacturing process of PCB circuit boards, step holes are a common and important component. It plays a crucial role in the connection between electronic devices and circuit boards, so understanding the design and manufacturing principles of step holes is one of the essential skills for every electronic engineer and PCB designer. Firstly, let's introduce the basic concepts and functions of step holes. Step holes are holes with different diameters that serve as connections between electronic devices and soldering pins on PCB boards. It is usually composed of two or more cylindrical holes, forming a progressive structure layer by layer, which can effectively bear the stress during welding and connection processes and improve the reliability of the connection. When making step holes, it is first necessary to carry out appropriate design. The design includes selecting appropriate aperture and spacing, as well as determining parameters such as plate thickness and
Firstly, the production of PCB boards usually starts with design. The designer conducts detailed design work based on the functional requirements of the smartphone, combined with electronic schematic and layout diagrams. Designers need to consider various factors such as signal transmission, power supply, and circuit isolation to ensure the stable and reliable performance of the PCB board. After the design is completed, the next step is the sampling stage of the PCB board. The production of PCB boards requires the use of electrical discharge machining technology, photolithography technology, chemical etching technology, and electroplating technology. Firstly, based on the designed CAD drawings, the pattern is transferred to a fiberglass board covered with copper foil using photolithography technology. Next, through chemical etching technology, unnecessary copper foil is etched away, leaving the required circuit; Then, using electroplating technology to increase the conductivity
1、 V-shaped cutting and splitting process The V-shaped cutting and splitting process uses a V-shaped cutting tool to cut V-shaped grooves on both sides of the circuit board, and then break the circuit board to separate it. This process is suitable for most general board splitting needs, with simple operation and low cost. However, its disadvantage is that it is prone to cutting burrs and uneven board edges, making it suitable for circuit boards with no connectors or components on the edges. 2、 Machine milling and cutting process The machine milling and cutting process involves using a CNC machine tool for cutting and performing milling operations according to a predetermined cutting path. It can more accurately control the position and size of the split board, suitable for complex split board requirements. The edges after milling are smooth and flat, and can be directly used for welding. However, the machine milling and cutting process has a high cost and is not suitable for hig
When choosing the thickness of a PCB board, there are several main considerations to consider. 1. Mechanical strength A thinner PCB board usually has lower mechanical strength, while a thicker board will be more sturdy. Therefore, in application scenarios with high mechanical strength requirements, choosing a thicker PCB board thickness is more appropriate. 2. Welding performance The thickness of the PCB board also affects the welding performance. A thinner plate thickness can provide better thermal conductivity, making it easier to dissipate heat during the welding process. A thicker plate thickness can provide better welding strength. Therefore, in application scenarios involving welding, it is necessary to choose the appropriate PCB board thickness based on specific welding needs. 3. Cost and Space Restrictions Thicker plate thicknesses generally increase costs and occupy more space. In some application scenarios with cost and space limitations, it is necessary to choose a
In addition to the above considerations, the thickness of the PCB board also involves some details in the PCB manufacturing process. 1. Selection of PCB materials Choosing different PCB materials can affect the standard and range of PCB board thickness. For example, the thickness range of PCB boards made of FR-4 material is generally between 0.4mm and 6.0mm. 2. Thickness of Laminate (Multi Layer PCB) For multi-layer PCBs, the board thickness is generally the sum of the thicknesses of each laminate. For example, for a 4-layer PCB, if the thickness of each laminate is 0.2mm, then the thickness of the entire PCB is 0.8mm. 3. Special needs In some special application scenarios, very thin or very thick PCB board thickness may be required. For example, some flexible PCBs (FlexPCBs) can have a board thickness of less than 0.1mm, while some high-power electronic devices may require a thicker board thickness to ensure heat dissipation.
The medical industry has high requirements for the reliability and safety of electronic devices. As an important component of medical equipment, medical PCB boards have correspondingly high standards and requirements to ensure the normal operation of medical equipment and the safety of patients. Let's take a look at some specifications and standards for medical PCB boards. 1. Material selection specifications: Medical PCB boards must be made of materials that comply with medical industry standards. These materials need to undergo strict safety and reliability testing to avoid any negative impact on patient health. 2. Electrical performance specifications: Medical PCB boards need to have good electrical performance, including stable voltage output, low noise, and low power consumption. These performance requirements are achieved through appropriate design and high-quality components to ensure the normal operation and accuracy of medical equipment. 3. Environmental adaptability
PCB circuit board reflow soldering is one of the common welding methods in the electronic assembly process. It firmly fixes electronic components on the PCB board by applying appropriate heat and melted solder paste to pre arranged welding points. However, some common problems may also arise during the reflow soldering manufacturing process. Introduce these issues and corresponding solutions. 1、 Tin splashing on the board surface Problem description: Tin splashing on the board refers to the excessive amount of solder around the welding point during reflow soldering. This may cause damage to components near the welding point, and even cause short circuits or welding failures. Solution: There are several methods to solve the problem of tin splashing on the board surface. Firstly, check whether the size and position of the welding points are appropriate to avoid excessive soldering caused by design defects. Secondly, adjust the temperature and speed in the reflow soldering furnace
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