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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
A car circuit board is like the brain of a car, which can accurately control various functions and performance of the car. It is connected to the engine, battery, brake, navigation, audio, lighting, and other components of the car to transmit and interact information, quickly respond to the driver's operating instructions, and then control the car's movement. In addition to being able to connect various components of the car, the circuit board of Yinmei Automobile also has some special functions. For example, a large number of intelligent sensors on modern car circuit boards can monitor the working status of the car in real-time, including engine temperature, throttle opening, brake pressure, etc. These data will be fed back to the driver in real-time, allowing the driver to have a clearer understanding of various information about the car. In addition, car circuit boards can also achieve some special functions, such as autonomous driving, adaptive cruise control, automatic parki
The production process of automotive circuit boards involves numerous materials and processes, requiring rigorous design and precise manufacturing. Firstly, the designer will design a circuit diagram that meets the performance and control requirements of the car. Then, the circuit diagram will be converted into a physical circuit board substrate, which requires the use of a high-precision exposure technology called "light drawing". Next, the circuit board substrate will undergo copper plating treatment to form a conductive circuit path. Then, various electronic components such as capacitors, resistors, diodes, transistors, etc. will be soldered onto the channel. Finally, these circuit boards will be tested and debugged to ensure that their performance meets the actual usage needs of the car. The maintenance and upkeep of car circuit boards is very important, otherwise it may affect the normal operation of the car and even cause malfunctions. Firstly, users should avoid using cars
Firstly, white oil can provide good insulation protection. In electronic devices, PCB boards carry numerous electronic components, which often require a certain degree of electrical isolation between them. The coating of white oil can form a layer of insulation protection film, effectively isolating the electrical connection between components and avoiding the occurrence of circuit short circuits and other problems. Secondly, white oil can prevent oxidation and corrosion. The surface of PCB boards is easily affected by oxidation when exposed to air, leading to the loss of conductivity of metal materials and even damage to circuits. The coating of white oil can form a protective layer that isolates air from direct contact with the PCB board, effectively preventing oxidation and corrosion, and extending the service life of electronic devices. In addition, white oil also has the function of dust and moisture prevention. In practical applications, PCB boards are often affected by ex
For circuit board design, shape is very important as it directly affects the performance and reliability of the circuit. Let's take a look at the manufacturers of intelligent circuit boards together! A suitable exterior design can improve the manufacturing efficiency and installation convenience of circuit boards. When choosing the appearance, we should follow the following principles: 1. Simplicity and clarity: The appearance of a PCB circuit board should be concise and clear, without excessive curves or patterns. This helps to control the manufacturing process and reduce manufacturing costs. 2. Reasonable use of space: According to actual needs, make reasonable use of the space on PCB circuit boards to avoid waste. At the same time, it is necessary to consider whether the size of the board is suitable for installation in the target device. 3. Consider edge treatment: When designing the shape of a PCB circuit board, the method of edge treatment should be considered. You can ch
Question 1: How to solve the inconsistency between the circuit schematic and the board copying result? To address this issue, we need to start from the source. Firstly, ensure the accuracy of the circuit schematic to avoid errors or omissions. Secondly, check the correspondence between the schematic diagram and the copied board file to ensure that there is no confusion or misalignment. Finally, professional schematic comparison tools can be used to check layer by layer and eliminate possible problems. Question 2: How to solve the problem of component loss or misalignment during the copying process? Component loss or misalignment is a common problem, but it can also be prevented and resolved. Firstly, it is recommended to prepare a component list and check the position and number of each component before copying to avoid omissions. Secondly, leave sufficient space during wiring to avoid interference and misalignment between components. Finally, during the placement process, stric
With the development of modern technology, the electronic products around us have become increasingly intelligent and precise. As the core of these electronic products, the importance of printed circuit boards (PCBs) has also become increasingly prominent. So, have you ever been curious about what PCB sampling is? How does it play a crucial role in product development? Intelligent circuit board manufacturers will reveal this knowledge and popular science topic for you. PCB sampling, in simple terms, is to verify the correctness, stability, and feasibility of circuit design by producing a small number of sample circuit boards. It is one of the indispensable links in the product development process Why do we need to conduct PCB sampling? There are three reasons: Firstly, PCB sampling can help developers discover and solve problems in circuit design in a timely manner. In the product design phase, especially for complex circuit designs, it is difficult to completely avoid errors o
The full name of FPC is Flexible Printed Circuit, which is a flexible printed circuit board. Unlike traditional hard circuit boards, FPC is made of flexible materials with characteristics such as bending, folding, and bending. It can better adapt to the curved design of mobile phones, providing higher reliability and stability. The FPC bending machine for mobile phones plays an important role in the production of mobile phones. It is mainly used for precise bending and bending of FPC to meet the requirements of mobile phone appearance design. Innovative designs such as curved screens and foldable screens in mobile phones cannot do without the support of the FPC bending machine. The function of mobile FPC bending machine is mainly reflected in the following aspects. Firstly, it can achieve high-precision bending and bending, ensuring the accuracy and stability of FPC during the phone assembly process. Secondly, mobile phone FPC bending machines can improve production efficiency
The types of FPC board substrates mainly include polyimide (PI), polyamide acid (PAA), polyamide ester (PA), polyaniline ester (PEN), and fluoroplastics (FEP). Polyimide is the most common substrate with good heat resistance, chemical corrosion resistance, and mechanical properties, suitable for high-temperature and high-frequency applications. PAA substrates are relatively inexpensive, but have poor heat and chemical resistance, making them suitable for low-cost and general performance requirements applications. PA and PEN substrates are intermediate in terms of heat resistance, chemical resistance, and mechanical properties between polyimide and PAA, making them suitable for various moderately demanding applications. The characteristic of FEP substrate is its excellent flame retardancy and electrical properties, suitable for high demand applications. When selecting FPC board substrate, it needs to be determined based on specific application requirements and performance requirem
1. Use high-quality raw materials: Choose reliable circuit board suppliers and ensure that the purchased raw materials such as developer and photoresist meet relevant standards and requirements. Under no circumstances should quality be reduced in order to reduce costs. 2. Regular maintenance and update of equipment: Regularly inspect and maintain photosensitive adhesive coating equipment, development equipment, and other related equipment to ensure their normal operation and provide stable performance. 3. Establish a strict quality control process: Develop appropriate quality control and inspection processes to ensure that each production step meets quality standards. Relevant personnel should also receive training to understand and master the correct operating methods. 4. Emphasis on cleanliness and hygiene: Ensure a clean working environment and strictly prohibit pollution sources from entering the production area. Operators should use appropriate protective measures to avoid
Firstly, it has a high degree of automation and can achieve fully automated bending and bending processes, reducing the possibility of manual intervention and improving production efficiency and quality. Secondly, the mobile FPC bending machine adopts advanced control systems and sensor technology, which can monitor and adjust the bending angle and force in real-time, ensuring that each FPC can meet the design requirements. In addition, the mobile FPC bending machine also has flexibility and adjustability, which can adapt to the bending needs of different models and sizes of FPC. To summarize, mobile phone FPC bending machines play an important role in mobile phone production. It can achieve high-precision bending and bending, improve production efficiency and quality, and has flexibility and adjustability. With the continuous innovation and development of mobile phone exterior design, mobile phone FPC bending machines will continue to play an important role in providing better
Poor development of PCB circuit boards has always been a common problem faced by manufacturers and the manufacturing industry. With the continuous development and complexity of electronic devices, the requirements for circuit boards have become increasingly high. The problem of unclear development on the circuit board not only affects the quality and performance of the product, but also may lead to functional failure of the product. It is very important to understand the reasons for unclear development and find solutions. 1. Developer contamination: Developer is an indispensable part of the development process of circuit boards, which can remove uncured photosensitive adhesive. However, if the developer is contaminated, such as the presence of precipitates, metal particles, or other impurities, it can lead to unclean development. Solution: Regularly replace the developer and ensure that its quality and purity meet the requirements. At the same time, before using the developer, it
The traditional COF FPC used in the television industry is not much different from ordinary FPC in the production and processing process. In addition to the finer line width and spacing compared to ordinary FPC, FPC is still produced using standard reduction etching method. The COF FPC carrier board used in smartphones is produced using a completely different method from the standard subtractive etching method, using an additive method for semiconductor chips. The industry calls this process the SAP semi additive method. Because the minimum line width and line spacing of FPC produced by standard reduction etching method are generally above 15 microns, it is basically powerless for COF production processes with finer lines. The processing technology of SAP semi additive method mainly comes from SLP type carrier PCB. However, when it entered the smartphone industry, Apple was the first to use this technology on a large scale in the production of mobile phone motherboards. Earlier, w
At present, there are approximately 1500 PCB enterprises in China, forming a pattern of joint competition among Taiwanese, Hong Kong, American, Japanese, and domestic enterprises. Among them, foreign-funded enterprises generally have a large investment scale, and have certain advantages in production technology and product specialization; There are many domestic enterprises, but there is still a certain gap in their scale and technological level compared to foreign enterprises. Among them, China's printed circuit industry is mainly distributed in the southeast coastal areas, which is also related to the large demand for water in the PCB industry. These areas are relatively rich in water resources. The Yangtze River Delta and the the Pearl River Delta add up to 90% of the national total. The PCB industry investment analysis indicates that the ratio of the Yangtze River Delta to the Pearl River Delta is about 1:1 at present. The proportion of boards (single panel, double-sided boar
In the era of low profit in electronic products, price wars have changed the supply chain. The total output value of China's PCB industry reached 58.84 billion yuan, an increase of 8.6% year-on-year, with an average compound growth rate of 20% in revenue and a compound growth rate of 27% in net profit attributable to the parent company. The following is an analysis of investment in the PCB industry. Due to the concentration of downstream industries and relatively low labor and land costs, China has become the region with the strongest development momentum. In 2017, China surpassed the United States for the first time and became the world's second largest PCB producer. The proportion of output value also increased from 8.54% in 2000 to 15.30%, nearly doubling. As of 2018, the newly planned investment in China's PCB industry reached 95.5 billion yuan, with 72 new investment projects, with an average investment of 1.3 billion yuan per project. The newly planned investment amounts fo
1. Resistor: One of the common components in a circuit. Its main function is to limit the flow of current and control the voltage and current levels in the circuit. By adjusting the circuit signal with different resistance values, it is possible to prevent overcurrent from damaging other components. 2. Capacitor: A common component in a circuit that stores energy. Capacitors can store and release charges under the action of an electric field. It plays a storage and discharge role in the circuit, used for circuit functions such as filtering, coupling, and voltage stabilization. 3. Diode: A nonlinear component in a circuit. Diodes have a single conductivity and can only circulate current in one direction. It is commonly used for circuit rectification, current limiting, and protection functions. 4. Transistor: An important semiconductor device in electronic equipment. The transistor can amplify current and voltage signals, and has various functions such as switching, amplification, a
There are significant differences in usage between rigid circuit boards and flexible circuit boards. Rigid circuit boards are suitable for scenarios with high requirements for stability and reliability, while flexible circuit boards are suitable for scenarios with high requirements for shape and weight. Rigid circuit boards have a fixed shape and size, which can provide good stability and mechanical strength, making them suitable for most general electronic devices. Flexible circuit boards can be bent and folded according to design requirements, with strong shape variability, making them suitable for products with special shapes and lightweight designs. With the continuous development and innovation of electronic products, the application prospects of rigid circuit boards and flexible circuit boards in different fields are becoming increasingly broad. Rigid circuit boards still dominate traditional large electronic devices, but the application of flexible circuit boards in wearabl
FPC: Flexible Printed Circuit, abbreviated as Flexible Board, in English. It is a single-sided, double-sided, and multi-layer circuit board made by using an etching process on a flexible substrate surface. The surface circuit can also be electrically connected to the inner and outer layers through metallized holes. The production method of flexible circuit boards is simple and cost-effective, while compared to traditional (hard boards), they achieve weight breakthroughs and are thinner. Flexible circuit boards in certain fields can also effectively reduce device volume and facilitate portability. It has a wide range of application scenarios, high experimental value, and long-lasting research and preparation enthusiasm. So far, the vast majority of FPC board circuit fabrication has been done using addition and subtraction (etching) processing, usually by photolithography on copper foil to prepare traditional FPC boards. Firstly, the printing/lithography circuit needs to be printed
1. One on one assembly board One on one splicing is the simplest splicing method, suitable for small PCB boards with a small quantity. Arrange each small board accurately on the large board according to the design requirements, then perform one-time etching, cutting, and other processes, and finally cut the large board into multiple independent small boards. This method is suitable for sample production or small-scale production, but it is inefficient for large-scale production. 2. Minimize Area Splicing Minimizing area splicing is an optimized splicing method. Arrange multiple small boards on the large board in a certain way to minimize the area of the large board and save materials. This method is suitable for large-scale production, which can improve utilization and reduce costs. 3. Maximize the number of pieces for splicing Maximizing the number of pieces is a splicing method that pursues production efficiency. According to the size and process requirements of the small bo
What are the advantages of the product? One is automation. It can be connected to the production line of circuit boards, achieving functions such as automatic feeding, automatic detection, and automatic identification of good and bad products, without the need for manual operation, greatly reducing labor costs and reducing quality damage caused by manual operation. Secondly, high accuracy. Adopting high-precision CIS scanning system, as well as technologies such as automatic positioning, image processing, and intelligent detection and analysis, to achieve high-precision detection. Thirdly, high efficiency. Equipped with a multi-channel detection device, it can customize 3 and 6 channels for simultaneous detection, greatly improving detection efficiency.
The main problem with RF circuit layout is usually the unsatisfactory characteristic impedance of the circuit, including circuit components and their interconnections. If the copper layer on the lead is relatively thin, it is equivalent to an inductance line and forms a distributed capacitance with other adjacent leads. When the lead passes through a through hole, it also exhibits inductance and capacitance characteristics. The through-hole capacitance mainly comes from the capacitance formed between the copper coating on the through-hole pad side and the copper coating on the formation, which is separated by a relatively small circular ring. Another influence comes from the cylindrical structure of the metal through hole itself. The influence of parasitic capacitance is generally small and usually only causes the edge of high-speed digital signals to deteriorate. The biggest impact of via is the parasitic inductance caused by the corresponding interconnection method. Because in
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