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Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
The anti-interference ability of PCB circuit boards can affect the effective performance of electronic devices, and the anti-interference ability of PCB circuit boards is closely related to specific circuits. So, what are the anti-interference measures for PCB circuit boards? 1. Principle of ground wire design: If there are both logical and linear circuits on the PCB circuit board, they should be separated as much as possible; The grounding of low-frequency circuits should be connected in parallel with a single point as much as possible. If there are difficulties in actual wiring, partial series connection can be used before connecting to the ground. 2. Closed loop composed of grounding wires: PCB circuit boards composed solely of digital circuits, with their grounding circuits arranged in a clustered loop, can mostly improve their noise resistance. 3. On the premise that the speed can meet the requirements, try to reduce the crystal oscillator of the microcontroller and select lo
Due to cost and technical reasons, PCBs may encounter a large number of failure issues during production and application. In order to understand the cause of the failure and find a solution to the problem, it is necessary to conduct a failure analysis of the failure case. So, how to find the cause of PCB circuit board failure? Let the engineer share with you: The mechanism of PCB failure must follow basic principles and analysis processes. Firstly, it is necessary to determine the failure location and mode based on the failure phenomenon through information collection, functional testing, electrical performance testing, and simple visual inspection. Next, it is necessary to analyze the failure mechanism, which involves using various physical and chemical methods to analyze the mechanisms that cause PCB failure or defects, such as solder joints, contamination, mechanical damage, moisture stress, medium corrosion, fatigue damage, stress overload, and so on. Then there is the anal
When designing PCB circuit board products, we often care about layout and wiring, which can easily overlook the additional PCB manufacturing costs in the design. Below, let's talk about the factors that affect the sampling price of PCB circuit boards in Shenzhen, in order to avoid increasing costs for customers. 1. Number of wiring layers. The price increases linearly with the number of layers, and the higher the number of layers, the more the price doubles. 2. Through hole. Normally, vias smaller than 0.25mm will be charged by the manufacturer. 3. Plug the hole in the disc. Unless there are strict requirements for signal and layout, try not to use it as it will increase costs. 4. Back drilling. Usually only used for high-speed signals such as backplanes. 5. Line width and line spacing. Usually less than 3.5 mils, additional fees will be charged. 6. Plate (high tg, high-frequency, unconventional) increases procurement cycle and production costs. 7. HDI and blind burial have
Wave soldering is a batch soldering process used for manufacturing PCB circuit boards, mainly used for soldering through hole components. So, what are the issues that need to be paid attention to in the wave soldering process of PCB circuit boards? 1. There is green oil inside the component hole, which leads to poor tin plating inside the hole. The green oil in the hole should not exceed 10% of the hole wall, and the number of holes in the internal green oil should not exceed 5%. 2. Insufficient coating thickness leads to poor tin plating in the hole. 3. The coating thickness on the component hole wall is insufficient, resulting in poor tin plating inside the hole. Usually, the thickness of the hole wall should be greater than 18 μ M. 4. The hole wall is too rough, resulting in poor tin plating or pseudo welding inside the hole. 5. The hole is damp, causing pseudo welding or bubbles. Sealing a PCB before drying or cooling, as well as leaving it for a long time after unpacking,
High frequency circuit wiring is a key and difficult issue in PCB circuit board design. Let Shenzhen PCB manufacturers share with you the high-frequency circuit wiring techniques for PCB design: 1. The less alternating layers of leads between pins in high-frequency circuit devices, the better The so-called "less alternating between lead layers is better" refers to the use of fewer vias (Via) during the component connection process. Reducing the number of vias can significantly improve speed and reduce the possibility of data errors. 2. The shorter the lead between the pins of high-frequency circuit devices, the better The radiation intensity of a signal is proportional to the length of the signal line, and the longer the high-frequency signal lead, the easier it is to couple to components close to it. 3. The less bent the leads between the pins of high-speed electronic devices, the better The lead wire for high-frequency circuit wiring should preferably be fully straight, and i
High frequency circuit wiring should pay attention to the "crosstalk" introduced by signal lines running parallel in close proximity, which refers to the coupling phenomenon between signal lines that are not directly connected. The parameters of the PCB board layer, the spacing between signal lines, the electrical characteristics of the driver and receiver ends, and the termination method of signal lines all have a certain impact on crosstalk. So, what are the measures for reducing high-frequency signal crosstalk in PCB wiring? 1. Inserting a ground wire or ground plane between two lines with severe crosstalk can provide isolation and reduce crosstalk; 2. If parallel distribution cannot be avoided, a large area of "ground" can be arranged on the opposite side of the parallel signal line to significantly reduce interference; 3. If the wiring space permits, the spacing between adjacent signal lines can be increased to reduce the parallel length of signal lines; 4. If parallel run
The EMC issue in PCB design is very important and plays a decisive role in the quality and performance stability of the next PCB circuit board. Below, let the engineer share with you: What factors are related to EMC issues in PCB design? 1. System design: When conducting system level EMC design, it is necessary to first determine the EMI interference source in order to systematically shield, filter, or use other methods to effectively eliminate EMI radiation sources. 2. Structural impact: If the radiation disturbance emission of non-metallic chassis exceeds the standard, measures such as conductive spraying, local shielding cover design, cable shielding treatment, and reasonable grounding treatment should be taken for the chassis. 3. Cable impact: Never use a cable shield as a return path for a signal. 4. The selection of components is related to: Taking varistors as an example: The main characteristic of varistors is their wide operating voltage range, which plays a role i
Aluminum substrate is a metal based copper clad plate with good heat dissipation function, commonly used for making LED lights. Next, let the Shenzhen PCB manufacturer provide you with a detailed explanation of the aluminum substrate production process specifications and difficulties. 1、 Aluminum substrate production process specification: 1. Aluminum substrates are often used in power devices, so copper foil is relatively thick. 2. The aluminum substrate should be protected with a protective film in advance, otherwise chemicals may corrode and cause damage to the appearance. 3. The milling cutters used for producing aluminum substrates have high hardness, and the milling cutter speed is at least two-thirds slower. 4. The processing of aluminum substrates must focus on adding alcohol to the gongs for heat dissipation. 2、 Difficulties in the production process of aluminum substrate: (1) Using mechanical processing of aluminum substrate, there should be no burrs on the edge of
Circuit board design is a "slow work, meticulous work" job, where everyone has their own set of solutions. Below, let the engineer introduce to you the precautions for circuit board design? 1. Circuit board design should have a reasonable direction For example, input/output, AC/ DC, strong/weak signal, high/low frequency, high/low voltage, etc. Their directions should be linear (or separate) and cannot merge with each other. Its purpose is to prevent mutual interference. 2. Choose the appropriate contact position in circuit board design Usually, some commonality is required, such as the multiple grounding wires of the forward amplifier should converge and then be connected to the main line. In fact, due to various limitations, it is difficult to fully achieve this, but this principle should be followed as much as possible. 3. Circuit board design should correctly arrange capacitors Usually only a few power filters/decoupling capacitors are drawn, but it is not indicated where
The working environment of circuit boards can be subject to different external disturbances, which may come from power sources, spatial electromagnetic fields, and ground wires. So, what are the measures for suppressing interference on circuit boards? 1. Filter: A filter is a network composed of resistors, inductors, and capacitors with lumped or distributed parameters, used to separate noise superimposed on useful signals. The filter has a good effect on suppressing transient noise of inductive loads, and connecting the power input to the filter can reduce electromagnetic interference from the power grid. 2. Shielding: Shielding refers to the absorption or reflection of external electromagnetic interference by various shielded objects to prevent noise intrusion; Alternatively, limit the electromagnetic energy radiated inside the device to prevent interference with other devices. 3. Reasonable wiring: The type of wire, the thickness of wire diameter, the way of wiring, the dist
Many customers often overlook many key points when seeking circuit board manufacturers for circuit board sampling, resulting in unsatisfactory circuit board samples and unnecessary losses. So, what are the key considerations for circuit board sampling? 1. Quality The first thing to note is the quality of the circuit board. The selection of boards, the use of ink, production equipment, and the rigor of staff all affect the final quality of circuit boards. 2. Delivery date Customers have all had this experience: the circuit board manufacturer promised delayed sample delivery and found various reasons. Circuit board manufacturers can greatly improve production efficiency and ensure delivery speed only by implementing strict process management during the production process. 3. Price The customer is also very concerned about the price of circuit board samples. The factors that affect the price are the number of layers, thickness, material, order quantity, surface treatment process
Double panel is a type of circuit board product that customers make a lot. So, how to design a regular double-sided circuit board? Let Shenzhen Circuit Board Factory provide you with a detailed explanation: 1. The common design is that the surface layer is power supply+signal, and the bottom layer is ground+signal. The power supply and ground can adopt a cross bus structure or a large area of copper coating, depending on the actual wiring space. 2. Another good design idea is to implement each layer according to the design requirements of a single panel, and then further adjust and optimize it, such as thickening the power supply/ground wire, and laying copper on large areas of spare parts. 3. When manually wiring, it is necessary to follow some general design guidelines: try to use a ground plane as the current circuit, and separate the analog ground plane from the digital ground plane. If the ground plane is separated by signal wiring, in order to reduce interference with the
Circuit boards have many "layers", and many beginners are easily confused by various layers of circuit boards when learning circuit board design. Below, let the engineer summarize the definitions of various layers in circuit board design for you to help you better understand and master. 1. Mechanical layer Usually used to place indicative information about circuit boards and assembly methods, such as circuit board dimensions, size markings, data, assembly instructions, and other information. 2. Occlusive layer Draw a closed area on this layer as the effective area for wiring, which cannot be automatically arranged and routed. 3. Silk screen layer The silk screen layer is a text layer that belongs to the top layer of a circuit board and is typically used to mark the projected contour of components, their labels, nominal values or models, and various annotation characters. 4. Welding layer The solder entry layer is the green part of the printed circuit board. After mapping th
During the design and production process of circuit boards, various problems are always encountered, such as circuit board short circuits, circuit board open circuits, and circuit board solder joints turning golden. Next, let the engineer explain the common problems and cause analysis of circuit board sampling for you in detail. 1. Circuit board short circuit This is one of the common faults in circuit board production, and there are many reasons for this problem: 1) The biggest cause of circuit board short circuits is improper design of welding pads; At this point, the circular welding pad can be changed to an oval shape, increasing the distance between points. 2) Improper design of the direction of circuit board components can also cause short circuits. 3) Automatic plug-in bending foot. It can also cause a short circuit on the circuit board. 4) Other reasons, such as large substrate holes, low tin furnace temperature, poor solderability of the board surface, failure of sol
Circuit board design is a crucial step before circuit board production. So, for beginners, what issues do circuit board design need to understand? Let the engineer share with you: 1. Create packages that are not in the package library. Build using the encapsulation model editor to ensure that the encapsulation model used for the encapsulation library is complete and to ensure the smooth progress of circuit board design. 2. Set circuit board design parameters. According to the needs of circuit system design, set the number of layers, size, color, etc. of the circuit board. 3. Load the network table. Load the web table generated from the schematic diagram and automatically load the component encapsulation model into the circuit board design window. 4. Layout. Combining automatic and manual layout, placing the component packaging model in an appropriate position within the planning range of the circuit board ensures a neat and aesthetically pleasing component layout, which is bene
Circuit boards are prone to solder back issues during production, resulting in bending and warping of the board, which affects the product qualification rate. So, how to reduce the risk of bending and deformation in circuit board production? 1. The effect of reducing temperature on the stress of circuit boards. Due to temperature being the main source of stress on circuit boards, as long as the temperature of the reflow furnace is reduced or the production heating speed of the circuit board in the welding furnace is slowed down, the bending and warping of the board can be greatly reduced. 2. The use of boards with higher Tg can increase their ability to withstand stress deformation, but the production cost of circuit boards is also relatively high. 3. Increase the thickness of the circuit board. Many electronic products have circuit board thicknesses of 1.0mm, 0.8mm, or 0.6mm for lighter purposes. It is recommended that if there are no requirements, the circuit board should be 1
In recent years, with the development of circuit board welding technology, reflow welding technology has become a trend. Below, let Shenzhen circuit board manufacturers explain in detail: What are the three main factors that constitute welding defects in circuit boards? 1. The solderability of circuit board holes affects welding quality The poor solderability of circuit board holes will result in solder defects, affecting the parameters of components in the circuit, causing unstable conduction of multi-layer board components and inner wires, and leading to the failure of the entire circuit function. 2. Welding defects caused by warping of circuit boards The circuit board and components produce warping during the welding process, resulting in defects such as solder joints and short circuits due to stress deformation. Warping is often caused by uneven temperature distribution between the upper and lower parts of a circuit board. In addition, for large-sized circuit boards, they m
1、 Definition of high-frequency PCB circuit board High frequency PCB circuit boards refer to circuit boards with higher electromagnetic frequencies used in the fields of high frequency (frequencies above 300MHz or band lengths not exceeding 1m) and microwave (frequencies above 3GHz or wavelengths not exceeding 0.1m). It is a circuit board produced using ordinary rigid circuit board manufacturing methods or special processing methods on microwave based copper clad plates. Generally speaking, high-frequency circuit boards can be considered as circuit boards with frequencies above 1GHz. With the rapid development of science and technology, many devices are planned to operate in the microwave frequency band (>1GHz) or even millimeter wave (30GHz) range. From this, it can be seen that the frequency is increasing, and the requirements for PCB boards are also high. For example, the substrate material needs to have high-quality electrical properties and chemical stability. With the increas
PCB design is a 'slow work leads to meticulous work' job, where everyone has their own set of solutions. Now let the engineer introduce to you what are the precautions for PCB design? 1. PCB design should have a reasonable direction For example, input/output, AC/ DC, strong/weak signal, high/low frequency, high/low voltage, etc. Their directions should be linear (or separate) and cannot merge with each other. Its purpose is to prevent mutual interference. 2. Choosing a Good Contact Position in PCB Design Usually, some commonality is required, such as the multiple grounding wires of the forward amplifier should converge and then be connected to the main line. In fact, due to various limitations, it is difficult to fully achieve this, but this principle should be followed as much as possible. 3. PCB design should correctly arrange capacitors Usually only a few power filters/decoupling capacitors are drawn, but it is not indicated where they should be placed. In fact, these cap
PCB circuit boards have many "layers", and many beginners are easily confused by various layers of PCB when learning PCB design. Below, let the engineer summarize the definitions of various layers in PCB circuit board design for you to help you better understand and master. 1. Mechanical layer Usually used to place indicative information about circuit boards and assembly methods, such as PCB dimensions, size markings, data, assembly instructions, and other information. 2. Occlusive layer Draw a closed area on this layer as the effective area for wiring, which cannot be automatically arranged and routed. 3. Silk screen layer The silk screen layer is a text layer that belongs to the top layer of a PCB and is typically used to mark the projected contour of components, their labels, nominal values or models, and various annotation characters. 4. Welding layer The solder entry layer is the green part of the printed circuit board. After mapping the shape of the welding layer onto
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