+86 755 2794 4155 
sales@knownpcb.com
Have you noticed that now more and more of our lighting is using led lighting.What is LED? Compared to the traditional light bulbs, LEDs have lower power consumption, longer lifetime and higher energy efficiency. In the PCB industry,when we say LED PCB, it refers to the pcb used for LED lighting, if you are looking for a suitable LED PCB for your lighting system, this article may bring you something. WHAT ARE LEDS COMPOSED OF?LED is an initial light-emitting diode that produces light when an electric current passes through. LEDs typically have negative and positive electrodes, which generate light in the visible light region.The LEDS are glued to the PCB by soldering process and have electrical connections for lighting.Since light-emitting diodes dissipate a lot of heat when they are in use, when you are designing LED, the metal core is usually the best choice for LED PCB, it is because that it dissipates heat more faster. Among them, the metal material aluminum is the most widely used
Circuit board maintenance is an emerging repair industry. The automation level of industrial equipment is increasing, so the number of industrial control boards in various industries is also increasing. After the industrial control boards are damaged, the high cost of replacing circuit boards (ranging from several thousand yuan to tens of thousands or hundreds of thousands of yuan) has become a very headache for enterprises. In fact, the vast majority of these damaged circuit boards can be repaired in China, and the cost is only 20-30% of purchasing a new board, which takes much shorter time than ordering a board abroad. Below is an introduction to the basic knowledge of circuit board maintenance. Almost all circuit board maintenance has no drawings and materials, so many people are skeptical of circuit board maintenance. Although various circuit boards are different, what remains unchanged is that each circuit board is composed of various integrated blocks, resistors, capacitors a
PCB connector This bottom contact connector has specifications of 4 to 8 circuits, with a rated current and voltage of 0.3A and 50V, and can be used for 0.12mm thick FPC cables. It has a unique BackFlip clamp that facilitates the insertion and extraction of cables in tight spaces, as well as strong FPC cable clamping force. The PCB connector industry in Chinese Mainland is one of the few regions not affected by the global economic recession. As the domestic and international market demand is strong, with the development of electronic equipment to higher transmission speed and smaller size, connectors also follow this trend. Therefore, chip connectors, optical fiber connectors Connector products such as wired broadband connectors and micro spacing connectors suitable for various portable/wireless electronic devices are expected to become future star products.
PCB series connectors: used in military aviation, railway projects, industrial projects, aerospace projects, testing instrument ship systems, electric sightseeing vehicles; UPS; Communication power supply; The preferred high current connector for products such as chargers and batteries. The connector is made of PBT material, which has excellent electronic and motor characteristics and can be widely used in industrial needs. Various electric vehicles, including electric buses, forklifts, golf carts, sightseeing vehicles, tractors, batteries, communication power supplies; UPS. AC/DC stabilized power supply. EPS. inverter, high-frequency module power supply and high-frequency charger system, electric machinery; Electric wheelchairs, electric floor scrubbers, lawn mowers, vacuum cleaners, medical equipment; Suction machines, pressure reducing machines, electric treatment beds; Power supply, Material-handling equipment, rechargeable battery application, power distribution equipment, indu
The insulation is made of German Bayer flame-retardant polycarbonate raw materials, ensuring your safe use. The plastic base shall prevent unqualified phenomena such as extrusion deformation and long-term fracture. After secondary manual inspection of the screws and nuts, there will be no signs of screw jamming, slipping, and difficulty in disassembly. The terminal connection piece is free of burrs, patterns, secure clamping, good coating, excellent conductivity, and good verticality of the connection piece. This product adopts a wire spring contact pair, and the socket automatically shortens when the plug and socket are separated by 4mm. This product has high reliable electrical contact performance, novel structure, convenient use, small size, soft insertion and extraction, long service life, low contact resistance, good insulation performance, anti-interference, and other characteristics. Widely applicable to electrical control equipment in power system relay protection control
Its working principle is: usually, a conductive pattern made of printed circuits, printed components, or a combination of both on insulating materials according to predetermined design is called a printed circuit. The conductive pattern that provides electrical connections between components on an insulating substrate is called a printed circuit. In this way, printed circuits or finished boards of printed circuits are called printed circuit boards, also known as printed boards or printed circuit boards. The gold soldering area on the PCB lowers the PCB board edge In industrial environments, connectors produced using press fit technology can maintain stability and can be used with right angle PCBs This nano compact connector is suitable for various drones, especially in extremely harsh working environments The advantage of using this connector in drone applications is that the oversupply of basic PCB connectors with small size has forced their prices to decrease by 3% to 10%. Manuf
The product meets the 19 "standard and adopts a splicing method of profiles and plates, which is easy to assemble and fully reflects the characteristics and advantages of standardization, modularization, and serialization. The product adopts a modular card structure with good scalability, which can be expanded according to customer needs and is easy to maintain in the later stage. Has good electromagnetic shielding performance. For special functional requirements such as EMC (electromagnetic shielding and anti-interference) and ESD (live plug and unplug maintenance), both design and functionality have passed product testing certification. It has reliable anti strength vibration design, impact design, and load-bearing design (superior performance in rail transit). Excellent heat dissipation performance and environmental protection design (IP protection level). Effective lightweight design: The product is made of aluminum alloy material, which is lightweight and effective, and has
Circuit board moisture-proof insulation coating adhesive is specifically designed for PCB circuit boards and various plastic surfaces to provide protection after coating. The surface of the covered material has functions such as moisture resistance, insulation, dust prevention, and corona prevention. Typical applications include PCB circuit boards, solar panels, bathroom sensors, ink, paper drawings, and more 1. There are a wide range of bonding materials, suitable for various circuit board substrates, plastics, glass, and metals. Oil coated paper and other materials have extremely high adhesion 2. The surface of the adhesive solidifies (surface drying) quickly, and can quickly reach surface drying under ultraviolet light irradiation. 3. It can cover the surface of PCBs, soft plastics, and oil coated paper paintings 4. Low viscosity and permeability, which can be sprayed mechanically 5. It is moisture-resistant, high-temperature resistant, high humidity resistant, and UV resis
1. The ideal adhesive layer thickness for bonding is 0.01-0.05mm, and either too thin or too thick can affect the bonding performance. 2. Ensure that the adhesive layer absorbs sufficient ultraviolet energy to achieve the best curing effect, otherwise it may affect the adhesive performance of the adhesive layer. 3. Do not move the material back and forth when exposed to ultraviolet radiation, otherwise it may cause the adhesive layer to turn white and the bonding strength to decrease. 4. The remaining glue should not be returned to the original packaging, and should be stored at room temperature and sealed away from light, avoiding contact with children. 5. This product has slight irritation to the eyes and skin. If it accidentally splashes into your eyes, please rinse immediately with plenty of water. If in contact with skin, Rinse with soap. If the situation is serious, please see a doctor. It is recommended that the glue applicator wear professional UV resistant glasses and
Plastic circuit boards are another type of thermoplastic engineering plastic circuit board compared to the traditional thermosetting epoxy resin fiberglass that is widely used in the electronics industry. Traditional printed circuit boards are made by die-casting thermosetting resin and glass fiber into a substrate, and then bonding conductive copper foil onto the substrate. It is called printed circuit copper clad plate. Copper clad boards are made into printed circuit boards through processes such as exposure and etching. This process has armed the electronics industry to this day. However, the process of removing copper foil involves environmental issues, and approval of circuit board licenses is strictly prohibited in many regions. Printed circuit boards are a planar structure, although flexible circuit boards can be formed on curved surfaces as a branch, they are not rigid curved three-dimensional structures. Some emerging applications, such as robots, 3D lighting fixtures, a
The memory packaged with BGA technology can increase the memory capacity by two to three times without changing its volume. Compared with TSOP, BGA has smaller volume, better heat dissipation performance, and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch. Memory products using BGA packaging technology have a volume of only one-third that of TSOP packaging at the same capacity; In addition, compared to traditional TSOP packaging methods, BGA packaging has a faster and more effective heat dissipation path. The I/O terminals of BGA packaging are distributed in an array of circular or columnar solder joints below the packaging. The advantage of BGA technology is that although the number of I/O pins increases, the pin spacing does not decrease but increases, thereby improving the assembly yield; Although its power consumption increases, BGA can be soldered using a controllable collapse chip method, which can improve its electro
As soon as BGA emerged, it became the best choice for high-density, high-performance, multifunctional, and high I/O pin packaging of VLSI chips such as CPUs and north-south bridges. Its characteristics include: Although the number of I/O pins has increased, the pin spacing is much greater than that of QFP, thereby improving the assembly yield; Although its power consumption increases, BGA can be soldered using the controllable collapse chip method, abbreviated as C4 soldering, which can improve its electric heating performance; 3. The thickness is reduced by more than 1/2 compared to QFP, and the weight is reduced by more than 3/4; 4. The parasitic parameters are reduced, the signal transmission delay is small, and the usage frequency is greatly increased; 5. Assembly can be carried out using coplanar welding, with high reliability; 6. BGA packaging is still the same as QFP and PGA, occupying too much substrate area; Intel Corporation adopts ceramic pin grid array packaging
1. PBGA (Plastic BGA) substrate: Generally a multi-layer board composed of 2-4 layers of organic materials. In the Intel series of CPUs, Pentium II, III, and IV processors all adopt this packaging form. In the past two years, another form has emerged: directly binding ICs to boards, which are much cheaper than regular prices and are generally used in fields such as games that do not have strict quality requirements. 2. CBGA (CeramicBGA) substrate: refers to a ceramic substrate, and the electrical connection between chips and substrates is usually installed using FlipChip (FC). In the Intel series of CPUs, Pentium I, II, and Pentium Pro processors have all adopted this packaging form. 3. FCBGA (FilpChipBGA) substrate: Hard multilayer substrate. 4. TBGA (TapeBGA) substrate: The substrate is a ribbon soft 1-2 layer PCB circuit board. 5. CDPBGA (Carity Down PBGA) substrate: Refers to the chip area (also known as the cavity area) with a square depression in the packaging center.
The substrate or intermediate layer is a very important part in BGA packaging. In addition to being used for interconnection wiring, it can also be used for impedance control and integration of inductors, resistors, and capacitors. Therefore, the substrate material is required to have high Glass transition temperature rS (about 175~230 ℃), high dimensional stability, low moisture absorption, good electrical performance and high reliability. The metal film, insulation layer, and substrate medium also have high adhesion performance. 1. Packaging process flow of PBGA wire bonding ① Preparation of PBGA substrate Laminate extremely thin (12-18) on both sides of BT resin/glass core board μ M thick copper foil, followed by drilling and through hole metallization. Create graphics on both sides of the substrate using conventional PCB and 3232 technology, such as guide strips, electrodes, and solder zone arrays for installing solder balls. Then add a solder mask and create a pattern to ex
QFN is a kind of non -quoted feet packaging, which is square or rectangular. There is a large -area naked pad in the center of the packaging at the center of the packaging to conduct heat. The electrical conductivity pad with electrical links around the packaging periphery around large pads. Because QFN packaging does not have gull -wing -like leads like the traditional SOIC and TSOP packaging, the conductivity between the internal pins and the pads is short, the self -sense coefficient and the wiring resistance in the packaging body are very low, so it can provide excellent electrical properties. In addition, it also provides excellent heat dissipation performance through the exposed lead frame pad. The pad has a direct cooling channel to release the heat in the package. The heat dissipation pad is usually welded directly on the circuit board, and the heat dissipation of the PCB can help spread the excess power consumption to the copper connecting floor, thereby absorbing excess h
The thickness of the mesh board determines the amount of welded paste printing on PCB. Too many welded paste will cause the bridge to connect when the return welding. Therefore, it is recommended that the QFN package of 0.5mm spacing uses a net board with a thickness of 0.12mm thickness and a 0.65mm spacing QFN packaging with a net board with a thickness of 0.15mm. It is recommended that the mesh opening size can be appropriately smaller than the pad to reduce the occurrence of the welded bridge connection. As shown in Figure 5. (2) Netboard design of heat dissipation pads When welding the exposed pads at the bottom of the chip and the hot pads on the PCB, the gas in the pores and the gas in large -sized pads will overflow due to the heat pores and large -sized pads. All kinds of defects (such as sputtering, welding balls, etc.), but it is almost impossible to eliminate these pores, only reduce the pores to the lowest amount. Therefore, in the design of the mesh area of the hot pa
Because the qfn's solder joints are below the packaging body, and the thickness is thin, X -Ray cannot detect the QFN solder point less tin and the opening of the road. It can only be judged as possible by the external welding joint situation. However, the current QFN welding The determination standards of the point part of the point part of the side have not yet appeared in the IPC standard. With no more ways for the time being, the testing stations that rely on post -production will be relying on the after -production section to judge the quality of welding. From the X -Ray images in Figure 6, the difference between the side part is obvious, but the image of the bottom part of the performance of the welding point performance is the same, so this brings problems to the X -ray detection and judgment. The use of electric iron to add tin, which increases only the side part, which impacts on the bottom part, X -Ray still cannot judge. Judging from the local magnifying of the appearan
For the repairs of QFN, because the welding point is completely at the bottom of the component packaging, any defects such as bridges, roads, and tin balls need to be moved away, so it is somewhat similar to the repairs of BGA. QFN is small in size, light weight, and they are used on high -density assembly boards, making it more difficult to repairs than BGA. At present, QFN repairs are still a part of the urgent development and improvement of the entire surface installation process. In particular, it is necessary to use welded paste A reliable electrical and mechanical connection between QFN and the printed board is indeed difficult. At present, there are three kinds of feasible coating ointments: one is to use the traditional use of the small silk net printing solder balla Print the welding balm directly on the pad of the component. The above methods need to be very skilled to repair the workers to complete this task. The choice of repairs equipment is also very important. It mu
The current trend of electronic products, in a small component or whole machine, constantly integrates more and more devices and functions. Hybrid integration technology has become one of the key technologies that increase the packaging density of source and passive devices. In the mixed integration of various manufacturing steps, the device and the circuit are interconnected, some passive devices such as resistors, such as resistors, are directly made of thick film or film process on the substrate. There are many important parameters of the design of the layout of the mixed integrated circuit board; the width of the wires, the routing of the wire and the keyboard, the height of the bonding coincidence, the height of the bonding leader, and the heat consumption must be considered. The thick -membrane integrated circuit process, the interconnection between the device and the circuit, the wires and resistors are on the substrate, and the various functional pulp is printed and sinte
Over the years, the industry is committed to developing the advantages of hybrid integration circuit technology, but has not made a breakthrough in manufacturing costs. Therefore, the printed board assembly process is still the best choice in the complex circuit installation. It is undoubtedly easy to improve the connection process on the naked chip board to make a directly -connected key on the nude chip board. The COB chip direct -board assembly technology is first used for digital clocks, watches. Each printed and circuit board is equipped with a chip, which is now widely used in digital cameras, calculators, telephone cards and various smart cards. Cob is complexCircuit components are equipped with a printer module of 5,000 LEDs and IC -driven combinations. Advanced data processing circuit 32BithP9000 computer motherboard installation 22 ICs and one MODEM circuit and other products have expanded their applications. Today, the multi -chip process with more than 100 chips in a
The current trend of electronic products, in a small component or whole machine, constantly integrates more and more devices and functions. Hybrid integration technology has become one of the key technologies that increase the packaging density of source and passive devices.In the mixed integration of various manufacturing steps, the device and the circuit are interconnected, some passive devices such as resistors, such as resistors, are directly made of thick film or film process on the substrate. There are many important parameters of the design of the layout of the mixed integrated circuit board; the width of the wires, the routing of the wire and the keyboard, the height of the bonding coincidence, the height of the bonding leader, and the heat consumption must be considered.The thick -membrane integrated circuit process, the interconnection between the device and the circuit, the wires and resistors are on the substrate, and the various functional pulp is printed and sintered. The
About Us Product Center Capabilities&Applications Quality Assurance News Contact Us flexible printed circuit board
ISO 9001:2008 registered © 2022 Shenzhen Knownpcb Technology Co., Ltd. All Rights
Reserved ICP: 粤ICP备08036040
Inquiry Now
EN
CN
中文
Home > 
